SB520 CYSTEKEC | Alldatasheet

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Technical content

CYStech Electronics Corp. Spec. No. : C762LD Issued Date : 2009.05.15 Revised Date : Page No. : 1/3 SB520 thru SB560 CYStek Product Specification 5.0Amp Schottky Barrier Rectifiers Reverse Voltage 20V to 60V Forward Current 5A SB520 thru SB560 Features Outline

  • Guard ring for over voltage protection. DO-201AD
  • Plastic package has UL flammability classification 94V-0
  • Low power loss, high efficiency
  • For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications Mechanical Data
  • Case : JEDEC DO-201AD molded plastic body
  • Epoxy : UL94V-0 rate flame retardant
  • Terminals: Plated axial leads, solderable per MIL-STD-750 method 2026. High temperature soldering guaranteed: 250° C/10seconds, 0.375”(9.5mm) lead length, 5lbs(2.3kg) tension
  • Polarity: Color band denotes cathode end.
  • Mounting Position : Any.
  • Weight: 0.041 oz., 1.15 gram Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, re sistive or inductive load. For capacitive load, derate current by 20%) Type Parameter Symbol SB520 SB530 SB540 SB550 SB560 Units Maximum repetitive peak reverse voltage VRRM 20 30 40 50 60 V Maximum RMS voltage VRMS 14 21 28 35 42 V Maximum DC blocking voltage VDC 20 30 40 50 60 V Maximum instantaneous forward voltage at 5A VF 0.55 0.67 V Maximum average forward rectified current @ 0.375”(9.5mm) lead length (see Fig 1) IF(AV) 5 A Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) at rated T L IFSM 150 A TA=25°C 0.5 Maximum DC reverse current at rated DC blocking voltage TA=100°C IR 50 25 mA RθJA 25 Typical thermal resistance RθJL 8 ℃/W Operating junction temperature range TJ -55 ~ +125 -55 ~ +150 ℃ Storage temperature range TSTG -55 ~ +150 ℃ Note: 1.Pulse test: pulse width≤300μs, duty cycle≤1% 2.Thermal resistance, junction to lead , vertical PCB mounted, 0.375”(9.5mm) lead length

CYStech Electronics Corp. Spec. No. : C762LD Issued Date : 2009.05.15 Revised Date : Page No. : 2/3 SB520 thru SB560 CYStek Product Specification Characteristic Curves

CYStech Electronics Corp. Spec. No. : C762LD Issued Date : 2009.05.15 Revised Date : Page No. : 3/3 SB520 thru SB560 CYStek Product Specification DO-201AD Dimension DO-201AD Molded Plastic Package CYStek Package Code: LD C 0.285 0.375 7.20 9.50 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material :

  • Lead : Axial leads, solderable per MIL-STD-750, Method 2026 guaranteed.
  • Mold Compound : Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.