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CYStech Electronics Corp. Spec. No. : C771LD Issued Date : 2009.08.03 Revised Date : 2013.09.30 Page No. : 1/6 SB3150 and SB3200 CYStek Product Specification 3.0Amp Schottky Barrier Rectifiers Reverse Voltage 150V and 200V Forward Current 3A SB3150 and SB3200 Features Outline

  • Low forward voltage drop DO-201AD
  • High current capability
  • High reliability
  • High surge current capability
  • Epitaxial construction Mechanical Data
  • Case : JEDEC DO-201AD molded plastic body
  • Epoxy : UL94V-0 rate flame retardant
  • Terminals: Plated axial leads, solderable per MIL-STD-202, method 208 guaranteed
  • Polarity: Color band denotes cathode end.
  • Mounting Position : Any.
  • Weight: 1.10 grams

Ordering Information

(Pb-free lead plating and halogen-free package) 1200 pcs / Tape & Box Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, TC : 1200 pcs / tape & box Product rank, zero for no rank products Product name

CYStech Electronics Corp. Spec. No. : C771LD Issued Date : 2009.08.03 Revised Date : 2013.09.30 Page No. : 2/6 SB3150 and SB3200 CYStek Product Specification Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, re sistive or inductive load. For capacitive load, derate current by 20%) Type Parameter Symbol SB3150 SB3200 Units Maximum repetitive peak reverse voltage VRRM 150 200 V Maximum RMS voltage VRMS 105 140 V Maximum DC blocking voltage VDC 150 200 V Maximum instantaneous forward voltage at 3A VF 0.89 V Maximum average forward rectified current IF(AV) 3 A Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) IFSM 80 A TA=25°C 0.5 Maximum DC reverse current at rated DC blocking voltage TA=100°C IR 10 mA Typical junction capacitance CJ 250 pF Typical thermal resistance RθJA 20 ℃/W Operating junction temperature range TJ -55 ~ +150 ℃ Storage temperature range TSTG -55 ~ +150 ℃ Note: 1.Pulse test: pulse width≤300μs, duty cycle≤2%

CYStech Electronics Corp. Spec. No. : C771LD Issued Date : 2009.08.03 Revised Date : 2013.09.30 Page No. : 3/6 SB3150 and SB3200 CYStek Product Specification Characteristic Curves Forward Current Derating Curve 0.5 1.5 2.5 3.5 0 20 40 60 80 100 120 140 160 Ambient Temperature---T A(℃) Average Forward Current---I F(AV)(A) Forward Current vs Forward Voltage 0.01 0.1 100 Forward Voltage---V F(V) Instantaneous Forward Current---IF(A) Tj=25℃, Pulse width=300μs, 1% Duty cycle Maximum Non-Repetitive Forward Surge Current 100 1 10 100 Number of Cycles at 60Hz Peak Forward Surge Current---IFSM(A) Tj=25℃, 8.3ms Single Half Sine Wave JEDEC method Reverse Leakage Current vs Reverse Voltage 0.01 0.1 100 0 20 40 60 80 100 120 140 Percent of Rated Peak Reverse Voltage---(%) Reverse Leakage Current---I R(mA) Tj=75℃ Tj=25℃ Junction Capacitance vs Reverse Voltage 100 200 300 400 500 600 700 0.01 0.1 1 10 100 Reverse Voltage---V R(V) Junction Capacitance---C J(pF)

CYStech Electronics Corp. Spec. No. : C771LD Issued Date : 2009.08.03 Revised Date : 2013.09.30 Page No. : 4/6 SB3150 and SB3200 CYStek Product Specification Taping Dimension

CYStech Electronics Corp. Spec. No. : C771LD Issued Date : 2009.08.03 Revised Date : 2013.09.30 Page No. : 5/6 SB3150 and SB3200 CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : C771LD Issued Date : 2009.08.03 Revised Date : 2013.09.30 Page No. : 6/6 SB3150 and SB3200 CYStek Product Specification DO-201AD Dimension DO-201AD Molded Plastic Package CYStek Package Code: LD C 0.285 0.375 7.20 9.50 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material :

  • Lead : Axial leads, solderable per MIL-STD-202, Method 208 guaranteed.
  • Mold Compound : Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.