SAKTC397QA-160F300S

TC39X INFINEON | Alldatasheet

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AURIX™ TC39x variants About this document Scope and purpose This document is an addendum to the TC39x Product Data Sheet and User's Manual, listing all planned product variants, key parameters such as memory size and optional features. The User's Manual lists functions implemented on the Silicon, but this document counts functions that are pinning dependent; i.e. functions are counted that are connected to at least one package pin. As pins are overlaid with several functions the pinning needs to be checked (see Product Data Sheet) to determine the number of usable functions in an application. Naming conventions Prefix:

• SAK: T ambient Temperature Range from -40 °C up to +125 °C.
• SAL: T ambient Temperature Range from -40 °C up to +150 °C (packaged device). Feature package:
• P: Standard feature.
• E: Emulation device with all features of the emulated standard type, additionally full MCDS, overlay functionality for calibration, AGBT as trace interface for development (depending on the package).
• C,V,Z: Customer Specific.
• A: ADAS ext. Memory.
• T: ADAS + emulation.
• X: Extended Feature device. These products contain the extended memory (EMEM) of the ADAS subsystem. The ADAS peripherals SPU, RIF and CIF are not available.
• M: MotionWise software.
• F: Extended Flash.
• G: Additional Connectivity.
• H: ADAS Standard feature.
• N: Standard feature with AMU. Datasheet Addendum Please read the Important Notice and Warnings at the end of this document v1.3 www.infineon.com 2019-06 OPEN MARKET VERSION

AURIX™ TC39x variants Table of contents Datasheet Addendum 2 v1.3 2019-06 OPEN MARKET VERSION

1 TC39x BD step variants

1.1 TC39x BD step (part 1)

A table listing the TC39x BD step variants. Table 1 TC39x variants SAL- TC399XX-256F 300S SAL- TC399XP-256 F300S SAL- TC397XP-256 F300S SAK- TC399XP-256 F300S SAK- TC399XX-256 F300S SAK- TC397XP-256 F300S SAK- TC397XA-256 F300S Step BD BD BD BD BD BD BD Production status Standard Standard Standard Standard Standard Standard Standard Package type PG-LFBGA-516 PG-LFBGA-516 PG-LFBGA-292 PG-LFBGA-516 PG-LFBGA-516 PG-LFBGA-292 PG-LFBGA-292 Pinout Reference silicon TC39x TC39x TC39x TC39x TC39x TC39x TC39x Temperature range (ambient) -40°C up to +150°C -40°C up to +150°C -40°C up to +150°C -40°C up to +125°C -40°C up to +125°C -40°C up to +125°C -40°C up to +125°C Chip ID Attention: The value of SCU_CHIPID in the UCODE field contains the default value 0 not the µCode version. 0xAF019993 0x8F019993 0x8F019793 0x8F019993 0xAF019993 0x8F019793 0xBF019793 Cores / checker cores Maximum frequency (MHz) 300 300 300 300 300 300 300 Program flash (MB) 16 16 16 16 16 16 16 Data flash 0 (single-ended) (KB) 1024 1024 1024 1024 1024 1024 1024 Total SRAM (without EMEM and Cache) (KB) 2528 2528 2528 2528 2528 2528 2528 EMEM Size (KB) 4096 0 0 0 4096 0 4096 AURIX™ TC39x variants Datasheet Addendum 3 v1.3 2019-06 OPEN MARKET VERSION

Table 1 TC39x variants (continued) SAL- TC399XX-256F 300S SAL- TC399XP-256 F300S SAL- TC397XP-256 F300S SAK- TC399XP-256 F300S SAK- TC399XX-256 F300S SAK- TC397XP-256 F300S SAK- TC397XA-256 F300S DSPR (KB) 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other DLMU (KB) 64 per CPU 64 per CPU 64 per CPU 64 per CPU 64 per CPU 64 per CPU 64 per CPU PSPR (KB) 64 64 64 64 64 64 64 LMU (KB) 768 768 768 768 768 768 768 DAM (KB) 128 128 128 128 128 128 128 AMU1) No No No No No No No ADC (primary groups/channels) 8/64 8/64 5/40 8/64 8/64 5/40 4/26 ADC (secondary groups/channels) 4/42 4/60 4/60 4/60 4/60 4/60 4/42 ADC (fast compare channels) 8 8 8 8 8 8 8 ADC (EDSADC channels) 14 14 6 14 14 6 6 CAN (modules/nodes) 3/3x4 3/3x4 3/3x4 3/3x4 3/3x4 3/3x4 3/3x4 FlexRay (modules/channels) 2/2x2 2/2x2 2/2x2 2/2x2 2/2x2 2/2x2 2/2x2 HSSL modules 2 2 2 2 2 2 2 ASCLIN modules / with ASC and LIN / with 3-wire SPI 12/12/12 12/12/12 12/12/11 12/12/12 12/12/12 12/12/11 12/12/9 QSPI modules / with LVDS 1 AMU is abbreviated as ASC Modeling Unit. For Additional details about AMU, Contact an Infineon Representative AURIX™ TC39x variants Datasheet Addendum 4 v1.3 2019-06 OPEN MARKET VERSION

Table 1 TC39x variants (continued) SAL- TC399XX-256F 300S SAL- TC399XP-256 F300S SAL- TC397XP-256 F300S SAK- TC399XP-256 F300S SAK- TC399XX-256 F300S SAK- TC397XP-256 F300S SAK- TC397XA-256 F300S SENT channels 25 25 20 25 25 20 17 MSC modules 4 4 2 4 4 2 1 PSI5 channels 4 4 4 4 4 4 4 PSI5-S module Yes Yes Yes Yes Yes Yes Yes SDMMC module Yes Yes Yes Yes Yes Yes Yes Maximum Ethernet availability: 1GBit/100Mbit/No 1Gbit/s 1Gbit/s 1Gbit/s 1Gbit/s 1Gbit/s 1Gbit/s 1Gbit/s MCDS availability MCDS MCDS MCDS MCDS MCDS MCDS MCDS ADAS cluster available No No No No No No Yes HSM available Yes Yes Yes Yes Yes Yes Yes AURIX™ TC39x variants Datasheet Addendum 5 v1.3 2019-06 OPEN MARKET VERSION

1.2 TC39x BD step (part 2)

A continuation of the TC39x BD step variants. Table 2 TC39x BD step (part 2) SAK- TC397QA-160F30 SAK- TC397XX-256F3 00S SAK- TC397QP-192F3 00S SAK- TC397QP-256F3 00S SAK- TC397XZ-256F3 00S SAK- TC397XM-256F3 00S Step BD BD BD BD BD BD Production status Standard Standard Customer specific Customer specific Customer specific Standard Package type PG-LFBGA-292 PG-LFBGA-292 PG-LFBGA-292 PG-LFBGA-292 PG-LFBGA-292 PG-LFBGA-292 Pinout Reference silicon TC39x TC39x TC39x TC39x TC39x TC39x Temperature range (ambient) -40°C up to +125°C -40°C up to +125°C -40°C up to +125°C -40°C up to +125°C -40°C up to +125°C -40°C up to +125°C Chip ID Attention: The value of SCU_CHIPID in the UCODE field contains the default value 0 not the µCode version. 0xCC019793 0xAF019793 0xCD019793 0xCF019793 0xFF019793 0x8F019793 Cores / checker cores Maximum frequency (MHz) 300 300 300 300 300 300 Program flash (MB) 10 16 12 16 16 16 Data flash 0 (single-ended) (KB) 1024 1024 1024 1024 1024 1024 Total SRAM (without EMEM and Cache) (KB) 1696 2528 1184 2080 1632 2528 EMEM Size (KB) 4096 4096 0 0 0 0 DSPR (KB) AURIX™ TC39x variants Datasheet Addendum 6 v1.3 2019-06 OPEN MARKET VERSION

Table 2 TC39x BD step (part 2) (continued) SAK- TC397QA-160F30 SAK- TC397XX-256F3 00S SAK- TC397QP-192F3 00S SAK- TC397QP-256F3 00S SAK- TC397XZ-256F3 00S SAK- TC397XM-256F3 00S 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other DLMU (KB) 64 per CPU 64 per CPU 64 per CPU 64 per CPU 64 per CPU 64 per CPU PSPR (KB) 64 64 64 64 64 64 LMU (KB) 512 768 0 768 0 768 DAM (KB) 0 128 0 128 0 128 AMU2) No No No No No No ADC (primary groups/channels) 4/26 5/40 5/40 5/40 5/40 5/40 ADC (secondary groups/channels) 4/42 4/60 4/60 4/60 4/60 4/60 ADC (fast compare channels) 8 8 8 8 8 8 ADC (EDSADC channels) 6 6 6 6 6 6 CAN (modules/nodes) 3/3x4 3/3x4 3/3x4 3/3x4 3/3x4 3/3x4 FlexRay (modules/channels) 2/2x2 2/2x2 2/2x2 2/2x2 2/2x2 2/2x2 HSSL modules 2 2 2 2 2 2 ASCLIN modules / with ASC and LIN / with 3-wire SPI 12/12/9 12/12/11 12/12/11 12/12/11 12/12/11 12/12/11 QSPI modules / with LVDS SENT channels 2 AMU is abbreviated as ASC Modeling Unit. For Additional details about AMU, Contact an Infineon Representative AURIX™ TC39x variants Datasheet Addendum 7 v1.3 2019-06 OPEN MARKET VERSION

Table 2 TC39x BD step (part 2) (continued) SAK- TC397QA-160F30 SAK- TC397XX-256F3 00S SAK- TC397QP-192F3 00S SAK- TC397QP-256F3 00S SAK- TC397XZ-256F3 00S SAK- TC397XM-256F3 00S 17 20 20 20 20 20 MSC modules 1 2 2 2 2 2 PSI5 channels 4 4 4 4 4 4 PSI5-S module Yes Yes Yes Yes Yes - SDMMC module Yes Yes Yes Yes Yes Yes Maximum Ethernet availability: 1GBit/100Mbit/No 1Gbit/s 1Gbit/s 1Gbit/s 1Gbit/s 1Gbit/s 1Gbit/s MCDS availability MCDS MCDS MCDS MCDS MCDS MCDS ADAS cluster available Yes No No No No No HSM available Yes Yes Yes Yes Yes Yes AURIX™ TC39x variants Datasheet Addendum 8 v1.3 2019-06 OPEN MARKET VERSION

2 TC39x BC step variants

2.1 TC39x BC step (part 1)

A table of TC39x BC step variants (part 1). Table 3 TCxxx YY step SAL- TC399XX-256F 300S SAL- TC399XP-256 F300S SAL- TC397XP-256 F300S SAK- TC399XP-256 F300S SAK- TC399XX-256 F300S SAK- TC397XP-256 F300S SAK- TC397XA-256 F300S Step BC BC BC BC BC BC BC Production status Standard Standard Standard Standard Standard Standard Standard Package type PG-LFBGA-516 PG-LFBGA-516 PG-LFBGA-292 PG-LFBGA-516 PG-LFBGA-516 PG-LFBGA-292 PG-LFBGA-292 Pinout Reference silicon TC39x TC39x TC39x TC39x TC39x TC39x TC39x Temperature range (ambient) -40°C up to +150°C -40°C up to +150°C -40°C up to +150°C -40°C up to +125°C -40°C up to +125°C -40°C up to +125°C -40°C up to +125°C Chip ID Attention: The value of SCU_CHIPID in the UCODE field contains the default value 0 not the µCode version. 0xAF019992 0x8F019992 0x8F019792 0x8F019992 0xAF019992 0x8F019792 0xBF019792 Cores / checker cores Maximum frequency (MHz) 300 300 300 300 300 300 300 Program flash (MB) 16 16 16 16 16 16 16 Data flash 0 (single-ended) (KB) 1024 1024 1024 1024 1024 1024 1024 Total SRAM (without EMEM and Cache) (KB) 2528 2528 2528 2528 2528 2528 2528 EMEM Size (KB) 4096 0 0 0 4096 0 4096 AURIX™ TC39x variants Datasheet Addendum 9 v1.3 2019-06 OPEN MARKET VERSION

Table 3 TCxxx YY step (continued) SAL- TC399XX-256F 300S SAL- TC399XP-256 F300S SAL- TC397XP-256 F300S SAK- TC399XP-256 F300S SAK- TC399XX-256 F300S SAK- TC397XP-256 F300S SAK- TC397XA-256 F300S DSPR (KB) 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other DLMU (KB) 64 per CPU 64 per CPU 64 per CPU 64 per CPU 64 per CPU 64 per CPU 64 per CPU PSPR (KB) 64 64 64 64 64 64 64 LMU (KB) 768 768 768 768 768 768 768 DAM (KB) 128 128 128 128 128 128 128 AMU3) No No No No No No No ADC (primary groups/channels) 8/64 8/64 5/40 8/64 8/64 5/40 4/26 ADC (secondary groups/channels) 4/60 4/60 4/60 4/60 4/60 4/60 4/42 ADC (fast compare channels) 8 8 8 8 8 8 8 ADC (EDSADC channels) 14 14 6 14 14 6 6 CAN (modules/nodes) 3/3x4 3/3x4 3/3x4 3/3x4 3/3x4 3/3x4 3/3x4 FlexRay (modules/channels) 2/2x2 2/2x2 2/2x2 2/2x2 2/2x2 2/2x2 2/2x2 HSSL modules 2 2 2 2 2 2 2 ASCLIN modules / with ASC and LIN / with 3-wire SPI 12/12/12 12/12/12 12/12/11 12/12/12 12/12/12 12/12/11 12/12/9 QSPI modules / with LVDS 3 AMU is abbreviated as ASC Modeling Unit. For Additional details about AMU, Contact an Infineon Representative AURIX™ TC39x variants Datasheet Addendum 10 v1.3 2019-06 OPEN MARKET VERSION

Table 3 TCxxx YY step (continued) SAL- TC399XX-256F 300S SAL- TC399XP-256 F300S SAL- TC397XP-256 F300S SAK- TC399XP-256 F300S SAK- TC399XX-256 F300S SAK- TC397XP-256 F300S SAK- TC397XA-256 F300S SENT channels 25 25 20 25 25 20 17 MSC modules 4 4 2 4 4 2 1 PSI5 channels 4 4 4 4 4 4 4 PSI5-S module Yes Yes Yes Yes Yes Yes Yes SDMMC module Yes Yes Yes Yes Yes Yes Yes Maximum Ethernet availability: 1GBit/100Mbit/No 1Gbit/s 1Gbit/s 1Gbit/s 1Gbit/s 1Gbit/s 1Gbit/s 1Gbit/s MCDS availability MCDS MCDS MCDS MCDS MCDS MCDS MCDS ADAS cluster available No No No No No No Yes HSM available Yes Yes Yes Yes Yes Yes Yes AURIX™ TC39x variants Datasheet Addendum 11 v1.3 2019-06 OPEN MARKET VERSION

2.2 TC39x BC step (part 2)

A table of TC39x BC step variants (part 2). Table 4 TC39x BC step (part 2) SAK- TC397QA-160F300S SAK- TC397XX-256F300S SAK- TC397QP-192F300S SAK- TC397QP-256F300S SAK- TC397XZ-256F300S Step BC BC BC BC BC Production status Standard Standard Customer specific Customer specific Customer specific Package type PG-LFBGA-292 PG-LFBGA-292 PG-LFBGA-292 PG-LFBGA-292 PG-LFBGA-292 Pinout ADAS LFBGA 0.8 mm LFBGA 0.8 mm LFBGA 0.8 mm LFBGA 0.8 mm Reference silicon TC39x TC39x TC39x TC39x TC39x Temperature range (ambient) -40°C up to +125°C -40°C up to +125°C -40°C up to +125°C -40°C up to +125°C -40°C up to +125°C Chip ID Attention: The value of SCU_CHIPID in the UCODE field contains the default value 0 not the µCode version. 0xCC019792 0xAF019792 0xCD019792 0xCF019792 0xFF019792 Cores / checker cores Maximum frequency (MHz) 300 300 300 300 300 Program flash (MB) 10 16 12 16 16 Data flash 0 (single-ended) (KB) 1024 1024 1024 1024 1024 Total SRAM (without EMEM and Cache) (KB) 1696 2528 1184 2080 1632 EMEM Size (KB) 4096 4096 0 0 0 DSPR (KB) 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other 240 in CPU0&1; 96 other DLMU (KB) AURIX™ TC39x variants Datasheet Addendum 12 v1.3 2019-06 OPEN MARKET VERSION

Table 4 TC39x BC step (part 2) (continued) SAK- TC397QA-160F300S SAK- TC397XX-256F300S SAK- TC397QP-192F300S SAK- TC397QP-256F300S SAK- TC397XZ-256F300S 64 per CPU 64 per CPU 64 per CPU 64 per CPU 64 per CPU PSPR (KB) 64 64 64 64 64 LMU (KB) 512 768 0 768 0 DAM (KB) 0 128 0 128 0 AMU4) No No No No No ADC (primary groups/channels) 4/26 5/40 5/40 5/40 5/40 ADC (secondary groups/channels) 4/42 4/60 4/60 4/60 4/60 ADC (fast compare channels) 8 8 8 8 8 ADC (EDSADC channels) 6 6 6 6 6 CAN (modules/nodes) 3/3x4 3/3x4 3/3x4 3/3x4 3/3x4 FlexRay (modules/channels) 2/2x2 2/2x2 2/2x2 2/2x2 2/2x2 HSSL modules 2 2 2 2 2 ASCLIN modules / with ASC and LIN / with 3-wire SPI 12/12/9 12/12/11 12/12/11 12/12/11 12/12/11 QSPI modules / with LVDS SENT channels 17 20 20 20 20 MSC modules 1 2 2 2 2 4 AMU is abbreviated as ASC Modeling Unit. For Additional details about AMU, Contact an Infineon Representative AURIX™ TC39x variants Datasheet Addendum 13 v1.3 2019-06 OPEN MARKET VERSION

Table 4 TC39x BC step (part 2) (continued) SAK- TC397QA-160F300S SAK- TC397XX-256F300S SAK- TC397QP-192F300S SAK- TC397QP-256F300S SAK- TC397XZ-256F300S PSI5 channels 4 4 4 4 4 PSI5-S module Yes Yes Yes Yes Yes SDMMC module Yes Yes Yes Yes Yes Maximum Ethernet availability: 1GBit/100Mbit/No 1Gbit/s 1Gbit/s 1Gbit/s 1Gbit/s 1Gbit/s MCDS availability MCDS MCDS MCDS MCDS MCDS ADAS cluster available Yes No No No No HSM available Yes Yes Yes Yes Yes AURIX™ TC39x variants Datasheet Addendum 14 v1.3 2019-06 OPEN MARKET VERSION

3 Memory maps of TC39x variants

This section describes the influence of the available feature variants on the memory map. Program Flash Variants:

• 16 MB: umbrella (5 x 3 MB, 1 x 1 MB), see User's Manual.
• 12 MB: 4 x 3 MB (see Figure below).
• 10 MB: 3 + 2 + 3 + 2 MB (see Figure below). 8/A000 0000H PFlash0 (3 MB) PFlash1 (3 MB) 8/A030 0000H PFlash2 (3 MB) 8/A060 0000H PFlash3 (3 MB) 8/A090 0000H

16 MBPFlash Variants:

(1 MB) PS1 (1 MB) PS2 (1 MB) Phys. Sub- Sector S61 S62 S63 S65 S66 S125 S126 S127 S128 S129 S130 S189 S190 S191 Logical Sector S64 16 KB 16 KB 16 KB 16 KB 16 KB 16 KB 16 KB 16 KB 16 KB 16 KB 16 KB 16 KB 16 KB 16 KB 16 KB 16 KB 16 KB 00 0000H 00 4000H 00 8000H 0F 4000H 0F 8000H 0F C000H 10 4000H 10 8000H 1F 4000H 1F 8000H 1F C000H 20 0000H 20 4000H 20 8000H 2F 4000H 2F 8000H 2F C000H Size Offset Address

16 KB 10 0000H

(3 MB) PFlash1 (3 MB) PFlash2 (3 MB) Reserved 12 MB PFlash0 (3 MB) PFlash1 (2 MB) Reserved 10 MB Sectorization of each 3 MB Bank 8/A0C0 0000H PFlash4 (3 MB) 8/A0F0 0000H PFlash5 (1 MB) 8/A100 0000H Reserved PFlash3 (3 MB) PFlash2 (3 MB) PFlash3 (2 MB) Reserved Reserved Reserved S61 S62 S63 S64 S65 S66 S125 S126 S127 Logical Sector Sectors available in

2 MB Bank

Figure 1 TC39x PFlash variants Cores / checker cores Variants: AURIX™ TC39x variants Datasheet Addendum 15 v1.3 2019-06 OPEN MARKET VERSION

• 6/4: umbrella, see User's Manual
• 4/4: not available are CPU4 and CPU5 including their RAMs (DSPR, DCACHE, DTAG, PSPR, PCACHE, PTAG, DLMU)
• 4/3: not available are CPU4 and CPU5 including their RAMs (DSPR, DCACHE, DTAG, PSPR, PCACHE, PTAG, DLMU) and CPU3 lockstep is not available (LCLCON1.LSEN3 must stay 0B). LMU Variants:
• 768 KB: umbrella, see User's Manual.
• 512 KB: only LMU0 and LMU1 LMU RAM are available (see Figure below).
• 0 KB: no LMURAM is available (see Figure below) 9/B004 0000H LMU0 LMURAM (256 KB) 9/B008 0000H

768 KBLMU Variants:

(256 KB) 9/B00C 0000H LMU2 LMURAM (256 KB) 9/B010 0000H Reserved 0 KB 9/B004 0000H 9/B008 0000H Reserved 9/B00C 0000H Reserved 9/B010 0000H 512 KB 9/B004 0000H 9/B008 0000H 9/B00C 0000H Reserved 9/B010 0000H LMU0 LMURAM (256 KB) LMU1 LMURAM (256 KB) Figure 2 TC39x LMU Variants DAM Variants:

• 128 KB: umbrella, see User's Manual
• 0 KB: none of the DAM RAMs are available ADAS cluster available Variants:
• Yes: umbrella, see User's Manual
• No: the following instances are not available: HSPDM, RIF0, RIF1, SPU0, SPU1, SPUCFG0, SPUCFG1, SPU Lockstep SFR. EMEM availability Variants: AURIX™ TC39x variants

Datasheet Addendum 16 v1.3 2019-06 OPEN MARKET VERSION

• 4096 KB: umbrella, see User's Manual.
• 0 KB: no EMEM available. ADC availability
• Limitation on availability of ADC channels are caused by pin limitations. See Data Sheet for the pinning table of the package. AURIX™ TC39x variants

Datasheet Addendum 17 v1.3 2019-06 OPEN MARKET VERSION

Revision history

V1.0 2018-06-08 • First release. V1.1 2018-08-06 • Added row "Reference Silicon" (needed e.g. for TC37x) to refer user to User's Manual Appx. V1.2 2019-03-01 • In "About this document": Corrected "overloaded" to "overlaid" .

• In "About this document": Added Feature Package "M" and "E" and remove "R" .
• In "About this document": Added clarification concerning AGBT in E, A and T .
• In "About this document": Removed feature packages B, C, H.
• In "Variant Tables of TC39x": added device "SAK-TC397XM-256F300S"
• In "Variant Tables of TC39x": added Feature Package "E" devices (Emulation Devices). V1.3 2019-06-12 • Added the TC39x "BD" step Variants to Chapter 1
• Removed the following Variants SAK-TC397XT-25 6F300S, SAK-TC397TT-25 6F300S for "BC" Step, Chapter 2
• Chapter 1 and 2: TC39x Bx step variants table format changed to fit all the contents.
• Chapter 1 and 2:Added new row in the variant tables called "AMU" with the footnote for additional details.
• Chapter: About this document: Feature package definitions are updated to consistent with the product naming nomenclature definition. AURIX™ TC39x variants

Datasheet Addendum 18 v1.3 2019-06 OPEN MARKET VERSION

All referenced product or service names and trademarks are the property of their respective owners. Edition 2019-06 Published by Infineon Technologies AG

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© 2019 Infineon Technologies AG All Rights Reserved. Do you have a question about any aspect of this document? Email: erratum@infineon.com Document reference IFX-aah1559043745375 IMPORTANT NOTICE The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) . With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. WARNINGS Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury OPEN MARKET VERSION