S2AF FOSHAN | Alldatasheet
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S2AF~S2MF Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 1 / 6 超快恢复二极管，反向电压：50V~1000V，正向电流：2.0A，薄型 SMAF 封装。 Surface Mount Ultrafast Recovery Rectifier,Reverse Voltage:50 to1000V,Forward Current:2.0A, SMAF thin package. 玻璃钝化芯片，效率高，无铅符合欧盟 RoHS 指令 2011/65/EU，适用于表面贴装。无卤产品。 Glass Passivated Chip Junction，High efficiency，Lead free in comply with EU ROHS 2011/65/EU directives，For surface mounted applications. Halogen free product. 一般用途. General purpose. 印章代码 / M a r k i n g 见印章说明。See Marking Instructions. 描述 / D e s c r i p t i o n s 特征 / Features 用途 / Applications 内部等效电路 / Equivalent Circuit 引脚排列 / P i n n i n g
S2AF~S2MF Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 2 / 6 Note: 1）Measured at 1 MHz and applied reverse voltage of 4 V D.C 参数 Parameter 参数符号 Symbol 测试条件 Test condition 数值 Rating 单位 Unit Maximum Instantaneous Forward Voltage VF IF=2.0A 1.1 V Maximum DC Reverse Current at Maximum DC Blocking Voltage IR Ta=25℃ 5.0 uA Ta=125℃ 100 极限参数 / Absolute Maximum Ratings(Ta=25 ℃) 参数 Parameter 参数符号 Symbol 数值 Rating 单位 Unit S2AF S2BF S2DF S2GF S2JF S2KF S2MF Maximum Repetitive Peak Reverse Voltage VRRM 50 100 200 400 600 800 1000 V Maximum RMS voltage VRMS 35 70 140 280 420 560 700 V Maximum DC Blocking Voltage VDC 50 100 200 400 600 800 1000 V Maximum Average Forward Rectified Current at Ta = 65℃ IF（AV） 2.0 A Peak Forward Surge Current 8.3 ms Single Half Sine Wave Superimposed on Rated Load (JEDEC Method) IFSM 55 A Typical Junction Capacitance 1） Cj 30 pF Typical Thermal Resistance2) RθJA 85 /W℃ Operating and Storage Temperature Range Tj,Tstg -55~+150 ℃ 电性能参数 / Electrical Characteristics(Ta=25 ℃)
S2AF~S2MF Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 3 / 6 电参数曲线图 / Electrical Characteristic Curve
S2AF~S2MF Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 4 / 6 外形尺寸图 / Package Dimensions
S2AF~S2MF Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 5 / 6 印章说明 / Marking Instructions
S2AF~S2MF Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 6 / 6 回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free) 说明： N o t e : 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150 ℃, Time:60~90sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：260±5℃ 时间：10±1 sec. Temp.:260 ±5℃ Time:10 ±1 sec 包装规格 / Packaging SPEC. 卷盘包装 / R E E L Package Type 封装形式 Units 包装数量 Dimension 包装尺寸 (unit ：mm Units/Reel 只/卷盘 Reels/Inner Box 卷盘/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Reel Inner Box 盒 Outer Box 箱 SMAF 3000 5 15000 5 75000 7 〞×11 185X180X105 550X210X220 使用说明 / N o t i c e s