S1A FUJI | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 1
Technical content
41 AMP SURFACE MOUNT GLASS
e For surface mount applications ¢ Reliable low cost construction utilizing molded ' . plastic technique I Outline Drawing e UL recognized 94V-O plastic material a ¢ Lead solderable per MIL-STD-202 Method 208 | SMA : fe e Surge overload rating to 30A peak ee ay i Mechanical Data Ze ; e0(4.08) © Case: Molded Plastic a Polarity: Indicated on cathode mam e Weight: 0.002 ounces, 0.064 grams 07916 01) L
1 Sue Stee
.008{'20) | 190(4.89) 1 Dimensions in inches and (millimeters) Hi Maximum Ratings & Characteristics © Ratings at 25° C ambient temperature unless otherwise specified © Single phase, half wave, 60HZz, resistive or inductive load © For capacitive load, derate current by 20% sta sb si sig [sts [sik [sim J units | | Maximum Recurrent Peak Reverse Voltage [| Varw | 60 | 100 | 200 | 400 | 600 | 800 | 1000 | V_| | Maximum DC Blocking Voltage | Woe | 50 | 400 | 200 | 400 [ 600 [00 | 1000 | Vv | | Maximum Average Forward @TL=100°C| | 10 | | wy : | Output Current Peak Forward Surge Current : 8.3 ms Single Half-Sine-Wave 30 A ‘Superimposed On Rated Load Maximum DC Forward Voltage Drop Per Element Ve Vv ‘ At 1.0A DC Maximum Reverse Current At Rated = @ Ta = 25°C HA DC Blocking Voltage per Element — @ Ta = 125°C. BA Typical Junction Capacitance *(See Note) [Cy 0 | Maximum Thermal Resistance" (See Note) | Row [OC [Storage Temperature Range | ssa | SSSCSCSC~—S NO TSSSSCSC*~‘idS CY Note: *Measured at 1.0MHz and applied reverse voltage of 4.0V DC | “Thermal resistance junction to lead, measured on PC board with 5.0mm? X (0.013mm thick) | Collmer Semiconductor, Inc.