RS2A FUJI | Alldatasheet
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1.5 AMP SURFACE MOUNT GLASS
e For surface mount application Reliable low cost construction utilizing molded ‘ . plastic technique i Outline Drawing © Glass passivated junction ., q a Fr UL recognized 94V-0 plastic material SMB sez, e High temperature soldering: 250 °C/10 seconds i Agpe0 at terminal ¢ Fast switching for high efficienc ig 9) y Ls en | Ye0(4 08) = Sap . 008¢' i Mechanical Data TH I © Case: Molded Plastic ‘team = e Polarity: Indicated on cathode aT © Weight: 0.003 ounces, 0.093 grams seer bese BH gen Dimensions in inches and (millimeters) Hf Maximum Ratings & Characteristics © Ratings at 25° C ambient temperature unless otherwise specified ® Single phase, half wave, 60Hz, resistive or inductive load © For capacitive load, derate current by 20% Po 2A T R828 T RSD | RS2G [RSI [| RS2K | RSM | Units | | Maximum Recurrent Peak Reverse Voltage [| Vram | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | v | | Maximum RMS input Voltage | Vs | 35 | 70 | 140 | 280 | 420 | 560 | 700 | v | | Maximum DC Blocking Voltage | Voc [50 | 100 | 200 | 400 | 600 | 800 | 1000 | v | Maximum Average Forward @TL=120°C| | ayy a | Output Current ¢ | Peak Forward Surge Current | 8.3 ms Single Half-Sine-Wave | Superimposed On Rated Load | Maximum DC Forward Voltage Drop Per Element Ve 13 Vv At1.5A DC 7 Maximum Reverse Current AtRated @ Ta = 25°C vA DC Blocking Voltage per Element @ Ta = 125°C BA | Maximum Reverse Recovery Time “(See Note) [tr | T80SSSCSCSC*~*~dSC<iaSYSSC*«OSSC*CS |_Typical Junction Capacitance **(See Note) A a | Maximum Thermal Resistanoe'*"(See Note) | Row | SSSCSSSSCSC~S~SCS SC | Storage Temperature Range tre [SC SHOHIDSCSCSC*dSC CY Note: *Test Conditions: IF = 0.5A, IR = 1.0A, Irr = 0.25A **Measured at 1.0MHz and applied reverse voltage of 4.0V DC Collmer Semiconductor, Inc.