ES1A FUJI | Alldatasheet
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1 AMP SURFACE MOUNT GLASS
SUPER FAST RECOVERY RECTIFIER i Wi FEATURES e Super fast recovery time ¢ For surface mount applications ¢ Reliable low cost construction utilizing molded plastic technique Hi Outline Drawing © Low forward voltage drop e UL recognized 94V-O plastic material SMA —_ | a e High temperature soldering: 250 °C/10 seconds coats) F 512.92) at terminals coat | | | mee © Glass passivated junction i +-—384-—| H Mechanical Data Tr © Case: Molded plastic aroean | orn or2¢1 © Polarity: Indicated on cathode seen es pans e Weight: 0.021 ounces, 0.064 grams aoanre | zis a Dimensions in inches and (millimeters) i Maximum Ratings & Characteristics @ Ratings at 25° C ambient temperature unless otherwise specified @ Single phase, half wave, 60Hz, resistive or inductive load © For capacitive load, derate current by 20% sia Tesi | esic | esip [sic | units | | Maximum Recurrent Peak Reverse Voltage | Vrrw | 50 | 100 | 150 | 200 | 400 | VV | | Maximum RMS inputVoltage | Ves | 85 | 70 | 05 | 140 | 280 | VI Maximum DC Blocking Voltage | t00 | 150 [200 | 400 Vv Maximum Average Forward Output Current la | _.375" 9.5mm lead length @T-110°C “ | | Peak Forward Surge Current | | 8.3 ms Single Half-Sine-Wave 30 A Superimposed On Rated Load MaximumForward Voltage Drop AtO.6A Ve 0.90 Vv Att.OA 0.98 1.25 Maximum Reverse Current At Rated @ TA=25°C 5 pA DC Blocking Voltage per Bridge Element @ Ta= 100°C 200 nA Typical Junction Capacitance™* (See Note) [Cy Pt | ‘Typical Thermal Resistance**(See Note) [Roy] HC Note: *Test conditions: IF=0.5A, IR = 1.0A, Irr = 0.254 Measured at 1.0 MHZ and applied reverse voltage of 4.0V DC *Thermal resistance junction to lead measured on PC board 5.0mm? X (0.013mm thick) Collmer Semiconductor, Inc.