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COB type, applicable to lead-free solder refl ow S10625-01CT www.hamamatsu.com 1 The S10625-01CT is a Si photodiode for visible to near infrared range and is compatible with lead-free solder refl ow processes. The small and thin leadless package allows reducing the mount area on a printed circuit board. Applicable to lead-free solder refl ow COB type Photosensitive area: 1.3 × 1.3 mm Small package: 3.2 × 2.7 × 1.1t mm Optical switches Features Applications Absolute maximum ratings Parameter Symbol Condition Value Unit Rev erse voltage VR max Ta=25 °C 10 V Operating temperature Topr -25 to +85 °C Storage temperature Tstg -40 to +100 °C Refl ow soldering conditions*1 Tsol Peak temperature 240 °C max., 1 time (see page 5) - Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the product within the absolute maximum r atings. *1: JEDEC level 4 Structure Parameter Specifi cation Unit Photosensitive area 1.3 × 1.3 mm Package Glass epoxy - Seal material Epoxy resin - Electrical and optical characteristics (Ta=25 °C) Parameter Symbol Condition Min. Typ. Max. Unit Spectral response r ange λ - 320 to 1100 - nm Peak sensitivity wavelength λp - 940 - nm Photosensitivity S λ=λp - 0.54 - A/W Short circuit current Isc 100 lx, 2856K 1.4 1.9 2.4 μA Dark current ID VR=1 V - 1 10 nA Temperature coffi cient of ID TCID - 1.12 - times/°C Rise time tr VR=0 V, RL=1 KΩ 10 to 90% - 0.5 - μs Terminal capacitance Ct V R=0 V, f=10 kHz - 200 400 pF

Spectral response Short circuit current vs. light level Wavelength (nm) (Typ. Ta=25 °C) Photosensitivity (A/W) 600200 800400 0.1 0.2 0.3 0.4 0.5 0.6 0.7 1000 1200 QE=100% Light level (lx) Short circuit current 1 10 100 1000 1 nA 10 nA 100 nA 1 mA 100 μA 10 μA 1 μA 10000 (Typ. Ta=25 °C, VR=0 V, light source: 2856 K) KSPDB0310EA KSPDB0311EA Directivity Relative sensitivity (%) (Typ. Ta=25 °C, light source: tungsten lamp) X direction Y direction Y direction 100 0 20 40 60 8020 90°90° 80° 70° 60° 50° 40° 30° 20°10°0°10°20° 30° 40° 50° 60° 70° 80° 40 60 80 100 X direction KSPDB0312EA

Dimensional outlines (unit: mm) 3.2* 2.1 0.9 1.4 2.7* 0.17 (2.3) 1.15 2.0 0.6 1.1 Photosensitive area 1.3 × 1.3 Photosensitive surface Photosensitive surface Tolerance unless otherwise noted: ±0.2 Chip position accuracy with respect to package dimensions marked * X, Y≤±0.3 Electrode Anode (common) Cathode (common) Index mark (4 ×) (R0.25) KSPDA0207EA 2.5 1.5 1.52.0 Component placement example Recommended land pattern (unit: mm) KSPDC0084EA Dark current vs. reverse voltage Terminal capacitance vs. reverse voltage Reverse voltage (V) Dark current 0.01 0.1 1 10 100 fA 1 nA 100 pA 10 pA 1 pA 100 (Typ. Ta=25 °C) Reverse voltage (V) Terminal capacitance 0.1 1 10 1 pF 1 nF 100 pF 10 pF 100 (Typ. Ta=25 °C) KSPDB0337EA KSPDB0338EA

Standard packing specifications KPINC0024EA (1.65) 4.0 ± 0.1 1.75 ± 0.1 1.55 ± 0.05 (3.35) 3.5 ± 0.1 8.0 ± 0.3 (2.82) Reel feed direction Reel (conforms to JEITA ET-7200) Embossed tape (unit: mm, material: PC) Packing quantity 2000 pcs/reel Packing type Reel and desiccant in moisture-proof packaging (vacuum-sealed) Dimensions Hub diameter Tape width Material Electrostatic characteristics 178 mm 60 mm 8 mm PS -

Cat. No. KSPD1081E01 Nov. 2013 DN www.hamamatsu.com HAMAMATSU PHOTONICS K.K., Solid State Division 1126-1 Ichino-cho, Higashi-ku, Hamamatsu City, 435-8558 Japan, Telephone: (81) 53-434-3311, Fax: (81) 53-434-5184 Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49) 8152-375-0, Fax: (49) 8152-265-8 France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: 33-(1) 69 53 71 00, Fax: 33-(1) 69 53 71 10 United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: (44) 1707-294888, Fax: (44) 1707-325777 North Europe: Hamamatsu Photonics Norden AB: Thorshamnsgatan 35 16440 Kista, Sweden, Telephone: (46) 8-509-031-00, Fax: (46) 8-509-031-01 Italy: Hamamatsu Photonics Italia S.R.L.: Strada della Moia, 1 int. 6, 20020 Arese, (Milano), Italy, Telephone: (39) 02-935-81-733, Fax: (39) 02-935-81-741 China: Hamamatsu Photonics (China) Co., Ltd.: 1201 Tower B, Jiaming Center, No.27 Dongsanhuan Beilu, Chaoyang District, Beijing 100020, China, Telephone: (86) 10-6586-6006, Fax: (86) 10-6586-2866 Product specifications are subject to change without prior notice due to improvements or other reasons. This document has been carefully prepared and the information contained is believed to be accurate. In rare cases, however, there may be inaccuracies such as text errors. Before using these products, always contact us for the delivery specification sheet to check the latest specifications. Type numbers of products listed in the delivery specification sheets or supplied as samples may have a suffix "(X)" which means preliminary specifications or a suffix "(Z)" which means developmental specifications. The product warranty is valid for one year after delivery and is limited to product repair or replacement for defects discovered and reported to us within that one year period. However, even if within the warranty period we accept absolutely no liability for any loss caused by natural disasters or improper product use. Copying or reprinting the contents described in this material in whole or in part is prohibited without our prior permission. Information described in this material is current as of November, 2013. S10625-01CTSi photodiode KSPDB0313EB Measured example of temperature profile with our hot-air reflow oven for product testing ∙ This product supports lead-free soldering. After unpacking, store it in an environment at a temperature of 30 °C or less and a humidity of 60% or less, and perform soldering within 72 hours. ∙ The effect that the product receives during refl ow soldering varies depending on the circuit board and re fl ow oven that are used. Before actual refl ow soldering, check for any problems by tesitng out the refl ow soldering methods in advance. 300 °C 220 °C 190 °C 170 °C Preheat 70ġŵŰġ90 s 240 °C max. Time Temperature Soldering 40 s max. Related information ∙ Notice ∙ Surface mount type products / Precautions Technical information ∙ Si photodiode / Application circuit examples Precautions www.hamamatsu.com/sp/ssd/doc_en.html