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Technical content

Features

 1750 MHz to 2250 MHz Operation  Gain = 24 dB Typical  Gain Adjustment Range > 19dB  ACPR > -66 dBc Typ. at +12 dBm POUT (Dual Carrier WCDMA)  Small 7 mm x 7 mm, Multi-Chip Module

Applications

 Cellular, 3G Infrastructure  WiBro, WiMax, LTE  Microwave Radio  High Linearity Power Control DS130725 Package: MCM, 7 mm x 7 mm RVA2007LAna- log Controlled Variable Gain Amplifier RVA2007LSQ Sample bag with 25 pieces RVA2007LSR 7” Sample reel with 100 pieces RVA2007LTR7 7” Reel with 1500 pieces RVA2007LTR13 13” Reel with 2500 pieces RVA2007LPCK-410 1750 MHz to 2250 MHz PCBA with 5-piece sample bag

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Absolute Maximum Ratings Parameter Rating Unit Max Device Current 770 mA Max Device Voltage 5.5 V Max Control Line Voltage 6 V Max RF Input Power* 25 dBm Max Junction Temp (T J)+ 1 5 0 ° C Max Storage Temp +150 °C Thermal Resistance (junction to backside of module) 14.8 °C/W ESD Class 1C (1000 V min) Moisture Sensitivity Level MSL3 *Load condition: Z L = 50  Parameter Specification Unit ConditionMin. Typ. Max. All specifications for -40 °C to +85 °C, 4.75 V to 5.25 V, and process variations unless otherwise stated. Frequency 2110 2170 MHz Temperature Range -40 25 85 °C Operating Range Gain 23 24.5 25.5 dB Min attenuator setting, 5 V, 25 C Gain 22 24.5 26.5 dB Over All Conditions Nominal Operating Output Power 12 dBm Operating power for ACPR rating Output IP3 42 45 dBm In high gain setting P1dB 28 29.5 dBm Max gain setting ACPR -60 -66 dBc Dual carrier WCDMA, 7.5 dB CF at nominal operating power; over full attenuation range Gain Flatness 0.2 0.6 dB Over 50 MHz BW Gain Adjustment Range 19 23.5 dB Control Voltage Range 0 3.3 V Noise Figure 3.8 5.0 dB Min attenuator setting Impedance 50  Input Return Loss 15 20 dB Over attenuation range Output Return Loss 14 15 dB Over attenuation range Supply Voltage 4.75 5.0 5.25 V Supply Current (VPC = 0 V) 300 460 600 mA Max current at -40 °C Supply Current (VPC = 0 V) 120 126 140 mA Output amplifier shutdown total current Caution! ESD sensitive device. Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical perfor- mance or functional operation of the device under Absolute Maximum Rating condi- tions is not implied. The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended appli- cation circuitry and specifications at any time without prior notice. RoHS (Restriction of Hazardous Substances): Compliant per EU Directive 2002/95/EC.

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Parameter Specification Unit ConditionMin. Typ. Max. All specifications for -40 °C to +85 °C, 4.75 V to 5.25 V, and process variations unless otherwise stated. Frequency 1750 2250 MHz Temperature Range -40 25 85 °C Operating Range Gain 24.5 dB Over All Conditions Nominal Operating Output Power 12 dBm Operating power for ACPR rating Output IP3 43 dBm In high gain setting P1dB 29.5 dBm Max gain setting ACPR -66 dBc Dual carrier WCDMA, 7.5 dB CF at nominal operating power; over full attenuation range Gain Flatness 0.2 dB Over 50 MHz BW Gain Adjustment Range 23.5 dB Control Voltage Range V Noise Figure 3.8 dB Min attenuator setting Impedance 50  Input Return Loss 20 dB Over attenuation range Output Return Loss 15 dB Over attenuation range

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Evaluation Board Schematic

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Evaluation Board Bill of Materials (BOM) Pin Table and Description Description Reference Designator Manufacturer Manufacturer’s P/N EVALUATION BOARD DDI RFVAx007L410(A) CAP, 1 F, 10%, 10V, X5R, 0402 C7, C9 - C10 MURATA ELECTRONICS GRM155R61A105KE15D RES, 0 0402 R1 KAMAYA, INC RMC1/16SJPTH CONN, SMA, END LAUNCH, UNIV, HYB MNT, FLT J1 - J2 HEILIND ELECTRONICS PER MAT-21-1038 CONN, HDR, ST, PLRZD, 4-PIN, 0.100” P2 ITW PANCON MPSS100-4-C CONN, HDR, ST, PLRZD, 2-PIN, 0.100” P1 ITW PANCON MPSS100-2-C DNP C1, C3 - C4, C6, C11 - C12, R3 - R5 RVA2007L MODULE U1 RFMD RVA2007L Pin Function Description 1 RFIN RF input pin. Internal DC block. 2 GND Ground pin. 3 VPC Power up/down control for 2nd stage amplifier. Apply VCC to power on 2nd stage amplifier. Apply 0 V to disable 2nd stage amplifier. Do not exceed VCC + 0.5 V. Connect to VCC if not needed. Decoupling capacitor may be desired on application board for control line noise. 4N C No connection. 5V C C Power supply for the module. Recommending 1 uF decoupling cap on the application board. 6 GND Ground pin. 7 RFOUT RF output pin. Internal DC block. 8 VCTRL Gain control voltage; 0 V to 3.3 V range. Maximum gain at 0 V. Recommending 0.1 uF decoupling on the applica- tion board. Center Pad GND Center ground pads need to have a good thermal path on the application board. Use solder stencil pattern shown in the document to define solder paste during assembly.

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Application Schematic (Without using final stage amplifier power down control) Application Schematic (Using final stage amplifier power down control)

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Package Drawing Branding Diagram

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Evaluation Board Assembly Drawing PCB Design Requirements Note: This solder stencil pattern is required to prevent solder voiding that may impact thermal dissipation.