RS3MAF FOSHAN | Alldatasheet
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Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 1 / 6 快恢复二极管，反向电压：1000V，正向电流：3.0A，薄型 SMAF 封装。 Surface Mount Fast Recovery Rectifiers, Reverse Voltage：1000V, Forward Current:3.0A ,SMAF thin package. 玻璃钝化芯片，反向恢复时间快，无铅符合欧盟 RoHS 指令 2011/65/EU，适用表面贴装。无卤产品。 Glass Passivated Chip Junction, Fast reverse recovery time, Lead free in comply with EU RoHS 2011/65/EU directives, For surface mounted applications. Halogen free product. 一般用途. General purpose. 印章代码 / M a r k i n g 见印章说明。See Marking Instructions. 描述 / D e s c r i p t i o n s 特征 / Features 用途 / Applications 内部等效电路 / Equivalent Circuit 引脚排列 / P i n n i n g
Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 2 / 6 参数 Parameter 符号 Symbol 数值 Rating 单位 Unit Maximum Repetitive Peak Reverse Voltage V RRM 1000 V Maximum RMS voltage V RMS 700 V Maximum DC Blocking Voltage V DC 1000 V Maximum Average Forward Rectified Current at Tc = 100℃ IF（AV） 3.0 A Peak Forward Surge Current 8.3 ms Single Half Sine Wave Superimposed on Rated Load (JEDEC Method) IFSM 80 A Typical Junction Capacitance at1） Cj 60 pF Typical Thermal Resistance 2） R θJA 50 ℃/W Operating and Storage Temperature Range Tj,Tstg -55~+150 ℃ Note: 1)Measured at 1MHz and applied reverse voltage of 4V D.C. 参数 Parameter 符号 Symbol 测试条件 Test Conditions 数值 Rating 单位 Unit Maximum Instantaneous Forward Voltage VF IF=3.0A 1.3 V Maximum DC Reverse Current at Rated DC Blocking Voltage IR Ta=25℃ 5.0 μA Ta=125℃ 150 μA Maximum Reverse Recovery Time t rr IF=0.5A I R=1.0A Irr=0.25A 200 ns 极限参数 / Absolute Maximum Ratings(Ta=25 ℃) 电性能参数 / Electrical Characteristics(Ta=25 ℃)
Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 3 / 6 电参数曲线图 / Electrical Characteristic Curve
Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 4 / 6 外形尺寸图 / Package Dimensions
Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 5 / 6 印章说明 / Marking Instructions
Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 6 / 6 回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free) 说明： N o t e : 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150 ℃, Time:60~90sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：260±5℃ 时间：10±1 sec. Temp.:260 ±5℃ Time:10 ±1 sec 包装规格 / Packaging SPEC. 卷盘包装 / R E E L Package Type 封装形式 Units 包装数量 Dimension 包装尺寸 (unit ：mm Units/Reel 只/卷盘 Reels/Inner Box 卷盘/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Reel Inner Box 盒 Outer Box 箱 SMAF 3000 5 15000 5 75000 7 〞×11 185X180X105 550X210X220 使用说明 / N o t i c e s