RS2AF FOSHAN | Alldatasheet

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RS2AF~RS2MF Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 1 / 6 快恢复二极管，反向电压：50V~1000V，正向电流：2.0A，薄型 SMAF 封装。 Surface Mount Fast Recovery Rectifiers, Reverse Voltage：50 to1000V,Forward Current:2.0A ,SMAF thin package. 玻璃钝化芯片，反向恢复时间快，无铅符合欧盟 RoHS 指令 2011/65/EU，适用表面贴装。无卤产品。 Features: Glass Passivated Chip Junction,Fast reverse recovery time,Lead free in comply with EU ROHS 2011/65/EU directives,For surface mounted applications.Halogen free product. 一般用途. General purpose. 印章代码 / M a r k i n g 见印章说明。See Marking Instructions. 描述 / D e s c r i p t i o n s 特征 / Features 用途 / Applications 内部等效电路 / Equivalent Circuit 引脚排列 / P i n n i n g

RS2AF~RS2MF Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 2 / 6 参数 Parameter 符号 Symbol 数值 Rating 单位 Unit RS2AF RS2BF RS2DF RS2GF RS2JF RS2KF RS2MF Maximum Repetitive Peak Reverse Voltage VRRM 50 100 200 400 600 800 1000 V Maximum RMS voltage V RMS 35 70 140 280 420 560 700 V Maximum DC Blocking Voltage VDC 50 100 200 400 600 800 1000 V Maximum Average Forward Rectified Current at Ta = 125℃ IF（AV） 2.0 A Peak Forward Surge Current 8.3 ms Single Half Sine Wave Superimposed on Rated Load (JEDEC Method) IFSM 50 A Typical Junction Capacitance 1） Cj 35 pF Typical Thermal Resistance 2） RθJA 60 ℃/W Operating and Storage Temperature Range Tj,Tstg -55~+150 ℃ Note: 1）Measured at 1MHz and applied reverse voltage of 4V D.C 参数 Parameter 符号 Symbol 测试条件 Test Conditions 数值 Rating 单位 Unit RS2AF RS2BF RS2DF RS2GF RS2JF RS2KF RS2MF Maximum Instantaneous Forward Voltage VF IF=2.0A 1.3 V Maximum DC Reverse Current at Rated DC Blocking Voltage IR Ta=25℃ 5.0 μA Ta=125℃ 100 μA Maximum Reverse Recovery Time trr IF=0.5A IR=1.0A Irr=0.25A 150 250 500 ns 极限参数 / Absolute Maximum Ratings(Ta=25 ℃) 电性能参数 / Electrical Characteristics(Ta=25 ℃)

RS2AF~RS2MF Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 3 / 6 电参数曲线图 / Electrical Characteristic Curve

RS2AF~RS2MF Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 4 / 6 外形尺寸图 / Package Dimensions

RS2AF~RS2MF Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 5 / 6 印章说明 / Marking Instructions

RS2AF~RS2MF Rev.C Feb.-2015 DATA SHEET http://www.fsbrec.com 6 / 6 回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free) 说明： N o t e : 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150 ℃, Time:60~90sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：260±5℃ 时间：10±1 sec. Temp.:260 ±5℃ Time:10 ±1 sec 包装规格 / Packaging SPEC. 卷盘包装 / R E E L Package Type 封装形式 Units 包装数量 Dimension 包装尺寸 (unit ：mm Units/Reel 只/卷盘 Reels/Inner Box 卷盘/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Reel Inner Box 盒 Outer Box 箱 SMAF 3000 5 15000 5 75000 7 〞×11 185X180X105 550X210X220 使用说明 / N o t i c e s