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Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 10

Technical content

Features

■ 23.5dBm Typical Output Power ■ 0dB to 28dB Variable Gain ■ 45% Efficiency at Max Output ■ On-Board Power Down Mode ■ 2.4GHz to 2.5GHz Operation ■ 902MHz to 928MHz Operation

Applications

■ Bluetooth™ PA ■ 2.4GHz to 2.5GHz ISM Band Systems ■ 902MHz to 928MHz ISM Band Systems ■ 3.6V Spread-Spectrum Cordless Phones ■ Portable Battery-Powered Equipment ■ Spread-Spectrum Systems RFPA2172

RFMD + TriQuint = Qorvo Absolute Maximum Ratings Parameter Rating Unit Supply Voltage (RF off) -0.5 to +6.0 VDC APC Current (Maximum) +10 mA Control Voltage (VPD) -0.5 to +6.0 VDC Input RF Power +10 dBm Operating Case Temperature -40 to +85 °C Storage Temperature -55 to +155 °C Caution! ESD sensitive device. RFMD Green: RoHS status based on EU Directive 2011/65/EU (at time of this document revision), halogen free per IEC 61249-2-21, < 1000ppm each of antimony trioxide in polymeric materials and red phosphorus as a flame retardant, and <2% antimony in solder. Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied. Nominal Operating Parameters Parameter Specification Unit Condition Min Typ Max Overall T= 25°C, VCC= 3.6V, VPD= 3.6V, VAPC= 3.0V Usable Frequency Range 400 to 2500 MHz Input Impedance 50 Ω Input VSWR 1.8:1 Without Input Match Output Load VSWR <10:1 0≤VAPC≤3.0V <6:1 0≤VAPC≤3.6V 2.45GHz Operation Freq= 2.4GHz to 2.5GHz, PIN= 0dBm Operating Frequency 2.4 to 2.5 GHz Maximum Output Power 22 +23.5 24.5 dBm Total Efficiency 45 % Reverse Isolation -45 dB Second Harmonic -38 -34 dBc Third Harmonic -45 -40 dBc All Other Spurious -50 dBc Gain Control Voltage 0 to VCC V High Gain 23.5 dB VAPC= 3.6V, VCC= 3.6V, PIN= 0dBm Low Gain -9 dB VAPC= 0V, VCC= 3.6V, PIN= 0dBm 900MHz Operation Freq= 902MHz to 928MHz, PIN= 3.0dBm Operating Frequency 902 to 928 MHz Maximum Output Power +26 dBm Total Efficiency 58 % Reverse Isolation -35 dB Second Harmonic -40 dBc Third Harmonic -40 dBc All Other Spurious -50 dBc Gain Control Voltage 0 to VCC V Gain Control Slope 20 dB/V Gain 0 to 28 dB

RFMD + TriQuint = Qorvo Parameter Specification Unit Condition Min Typ Max Power Supply Power Supply Voltage 3.0 3.6 V Power Supply Current 155 mA VCC= 3.6V , VAPC= 3.6V, PIN= -3dBm, VPD= 3.6V Power Supply Current – Low Power Mode 25 mA T= 25°C, VCC= 3.6V, VPD= 3.6V, VAPC= 0V, PIN = 0dBm Idle Current 35 65 mA VAPC= 3.6V, PIN≤ -30dBm, VPD= 3.6V Power Down Current 2.8 10 µA VCC= 3.6V , VAPC= 0V, VPD= 0V total ICC I(PD) 4.5 mA VCC= 3.6V , VPD= 3.6V into PD pin I(PD) 2.25 mA VCC= 3.0V , VPD= 3.0V into PD pin Application Schematic 915MHz 131415161 98765 22 nF RF IN 8.2 nH RAPC 3 kΩ VAPC 2.7 nH 22 nF 4 pF 3.9 nH 2.4 pF RF OUT Bias 22 nF 22 nF 22 nF22 nF VPD VCC VCC

RFMD + TriQuint = Qorvo Application Schematic 2.45GHZ 131415161 98765 22 nF RF IN 200 Ω VAPC 22 nF 1.5 pF 1.5 nH RF OUT Bias 4 pF 22 nF 22 nF22 nF VCC VCC 10 Ω 22 nF 5 pF5 pF 10 ΩVCC 0.5 pF

RFMD + TriQuint = Qorvo Evaluation Board Schematic 915 MHz 131415161 98765 22 nF 8.2 nH 3 kΩ VAPC 22 nF 4 pF 3.9 nH 2.4 pF Bias 22 nF 22 nF 22 nF 22 nF R1* OPEN VCC2 VCC3 2.7 nH 50 Ω µstrip Ω2 RF OUT VCC1 50 Ω µstripΩ1 RF IN CON3 P1-1 VCC2 GND P1-3 VCC3 CON3 P2-1 VAPC GND P2-3 VCC1

RFMD + TriQuint = Qorvo Evaluation Board Schematic 2.45GHz 131415161 98765 200 Ω VAPC 22 nF 1.5 pF 1.5 nH Bias C10 4 pF 22 nF 22 nF 22 nF 10 Ω C11 22 nF 5 pF 5 pF 10 Ω 0.5 pF VCC2 VCC3 VCC1 22 nF RF IN 50 Ω µstrip RF OUT 50 Ω µstrip CON3 P1-1 VCC2 GND P1-3 VCC3 CON3 P2-1 VAPC GND P2-3 VCC1 2172401-

RFMD + TriQuint = Qorvo Pin Out 1 131516 14 5 976 8 GND GND GND GND GND GND GND GND GND GND VCC VPD APC RF OUT RF OUTRF IN Package Outline and Branding Drawing (Dimensions in millimeters)

thickness is 3 µinch to 8 µinch gold over 180µinch nickel. Figure 1. PCB Metal Land Pattern (Top View)

create solder mask clearance can be provided in the master data or requested from the PCB fabrication supplier. Figure 2. PCB Solder Mask (Top View) accommodating routing strategies. design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results.

RFMD + TriQuint = Qorvo Pin Names and Descriptions Pin Name Description Interface Schematic 1 GND Ground connection. For best performance, keep traces physically short and connect immediately to the ground plane. GND Ground connection for the driver stage. For best performance, keep traces physically short and connect immediately to the ground plane. RF IN RF input. This is a 50Ω input. No external matching is needed. An external DC blocking capacitor is required if this port is connected to a DC path to ground or a DC voltage. See pin 15 4 GND See pin 1. 5 GND See pin 1. VPD Power down pin. When this pin is OV, the device will be in power down mode, dissipating minimum DC power. This pin also serves as the VCC supply pin for the bias circuitry. VPD should be at the supply voltage when the part is not in power down mode. 7 APC Analog power control. Output power varies as a function of the voltage on this pin. See graph. This pin must be driven through a series resistor with a voltage between OV and VCC. Series resistor determines dynamic range of power control. See plot “POUT versus Gain Control versus Gain Control Resistor”. APC Bias Network RF IN 1st Stage 8 GND See pin 1. 9 GND See pin 1. 10 GND See pin 1. 11 RF OUT RF output. An external matching network is required to provide the optimum load impedance at this pin. See pin 15 RF OUT RF output and power supply for the output stage. Bias voltage for the output stage is provided through this pin. A shunt cap resonating with the bond wire inductance at 2xf0 can also be used at this pin to provide a second harmonic trap. See pin 15 13 GND See pin 1. 14 GND See pin 1. VCC Power supply for driver stage and interstage matching. This pin forms the shunt inductance needed for proper tuning of the interstage. Refer to the application schematic for the proper configuration. Note: Position and value of the components are important. GND External Cap VCC Inductor Bond Wire Pin 15 RF OUT 1st Stage 2nd Stage RF IN RF OUT 16 GND See pin 1. Pkg Base GND Ground connection for the output stage. This pad should be connected to the groundplane by vias directly under the device. A short path is required to obtain optimum performance, as well as provide a good thermal path to the PCB for maximum heat dissipation.