RF9908 RFMD | Alldatasheet

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Functional Block Diagram RF Micro Devices, Inc.

7628 Thorndike Road

Greensboro, NC 27409, USA T el (336) 664 1233 Fax (336) 664 0454 http://www.rfmd.com Optimum Technology Matching® Applied Si BJT GaAs MESFETGaAs HBT Si Bi-CMOS SiGe HBT Si CMOS IF+ IF- GND LO+ RF OUT VCC GND LO- RF9908 CDMA/FM UPCONVERTER/BPSK MODULATOR

  • CDMA/FM Cellular Systems  Supports Dual-Mode AMPS/CDMA  Supports Dual-Mode TACS/CDMA  Commercial and Consumer Systems  3-Cell Battery-Operated Systems The RF9908 is a complete upconverter designed for CDMA/FM cellular applications. The IC contains a dou- ble-balanced mixer stage and an output buffer amplifier stage. This device may also be used to directly BPSK modulate a carrier. The mixer is a Gilbert cell with emitter degeneration resistors to provide high IP3. The output stage is a class-B, push-pull configuration to reduce the overall current and still provide a good 50Ω output match. The unit operates at 3.6V and does not require any exter- nal matching components other than coupling capacitors. This circuit is designed as part of the RFMD CDMA Chip Set, consisting of a Transmit IF AGC Amp, this Transmit Upconverter, a Receive LNA/Mixer, and a Receive IF AGC Amp.  Supports Dual Mode Operation  +8dBm Input/Output Intercept Point  Single 3.6V Power Supply  Internally Matched Inputs and Outputs  Buffered Output  Double-Balanced Mixer RF9908 CDMA/FM Upconverter/BPSK Modulator RF9908 PCBA Fully Assembled Evaluation Board Rev A2 010720 0.244 0.229 0.157 0.150 0.018 0.014 0.050 0.068 0.053 NOTES: 1. Shaded lead is Pin 1. 2. All dimensions are excluding mold flash. 3. Lead coplanarity - 0.005 with respect to datum "A". Dimensions in mm 0.196 0.189 0.008 0.004 -A- 8° MAX 0° MIN 0.034 0.016 0.009 0.007 Package Style: SOIC-8

Supply Voltage -0.5 to 7.0 V DC Input RF Power +6 dBm Operating Ambient Temperature -40 to +85 °C Storage Temperature -40 to +150 °C Parameter Specification Unit ConditionMin. Typ. Max. Overall T=25°C, VCC =3.6V , RF=840MHz, LO=970MHz, IF=130MHz RF Output Frequency Range 500 to 1500 MHz Conversion Gain 0 dB Over temperature and frequency Noise Figure 14 dB Output IP3 +8 dBm Output ACP -54 dB Referenced to a 1.23MHz in-band power. (±885kHz offset) Output ALT -75 dB Referenced to a 1.23MHz in-band power. (±1.98MHz offset) Output VSWR 1.5:1 50 Ω Spurious Product Rejection 30 dBc Referenced to RF output IF Input IF Frequency DC to 200 MHz Differential Input Impedance 265 Ω IF to RF Output Isolation 30 dB IF to LO Isolation 30 dB LO Input LO Frequency Range 300 to 1700 MHz LO Level -6 to 0 dBm LO to RF Output Leakage -30 -20 dBm RF to LO Isolation 30 dB LO Input VSWR 2:1 50 Ω Power Supply Voltage 3.6±5% V Current Consumption 18 mA Caution!ESD sensitive device. RF Micro Devices believes the furnished information is correct and accurate at the time of this printing. However, RF Micro Devices reserves the right to make changes to its products without notice. RF Micro Devices does not assume responsibility for the use of the described product(s).

Pin Function Description Interface Schematic 1I F + Balanced IF Input Pin. This pin is internally DC biased and should be DC blocked if connected to a device with a DC level present. For single- ended input operation, one pin is used as an input and the other IF input is AC coupled to ground. The balanced, as well as single-ended, input impedance is 265Ω . 2I F - Same as pin 1, except complementary input. See pin 1. 3G N D Ground connection. Keep traces physically short and connect immedi- ately to ground plane for best performance. 4L O + Balanced LO Input Pin. This pin is internally DC biased and should be DC blocked if connected to a device with a DC level present. For single- ended input operation, one pin is used as an input and the other LO input is AC coupled to ground. The balanced, as well single-ended, input impedance is 50Ω . 5L O - Same as pin 4, except complementary input. See pin 4. 6G N D Same as pin 3. 7V C C Supply Voltage pin. External bypassing is required. External RF , LO, and IF bypassing is required. The trace length between the pin and the bypass capacitors should be minimized. The ground side of the bypass capacitors should connect immediately to ground plane. 8R F O U T RF Output Pin. This pin is internally DC blocked. The output impedance is 50Ω . BIAS IF-IF+ BIAS LO-LO+ RF OUT RF OUTIF+ IF- LO+ 1n F 1n F 100 pF 100 pF 100 nF VCC 100 pF

Evaluation Board Schematic (Download Bill of Materialsfrom www.rfmd.com.) Evaluation Board Layout Board Size 1.4” x 1.4” Board Thickness 0.031”, Board Material FR-4 2.2 nF 2.2 nF 8p F C4 10 nF 50 Ω Microstrip 10 nF 50 Ω Microstrip 47 pF 100 nF P1-1 1:4IF IN LO- RF OUT P1-1 NC GND VCC1

9908400 Rev -