DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 8

Technical content

Features

 HSDPA Compliant  Low Voltage Positive Bias Supply (3.0 V to 4.2 V)  +28.0 dBm Linear Output Power (+26.5 dBm HSDPA)  High Efficiency Operation 40% at P OUT = +28.0 dBm  Internal Voltage Regulator Eliminates the Need for Exter- nal Reference Voltage (V REF)  2-Mode Power States with Digital Control Interface  Supports DC/DC Converter Operation  Integrated Power Coupler  Integrated Blocking and Col- lector Decoupling Capacitors

Applications

 WCDMA/HSDPA Wireless Data Cards RF7401 3 V W-CDMA Band 1 Linear PA Module RF7401PCBA-410 Fully Assembled Evaluation Board DS100630 CONFIDENTIAL: NDA REQUIRED   Package Style: Module, 10-Pin, 3 mm x 3 mm x 1.0 mm

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Absolute Maximum Ratings Parameter Rating Unit Supply Voltage in Standby Mode 5.5 V Supply Voltage in Idle Mode 5.5 V Supply Voltage in Operating Mode, 50  Load 5.5 V Supply Voltage, V BAT 5.5 V Control Voltage, VMODE 5.5 V Control Voltage, VEN 5.5 V RF - Input Power +10 dBm RF - Output Power +30 dBm Output Load VSWR (Ruggedness) 10:1 Operating Ambient Temperature -30 to +110 °C Storage Temperature -55 to +150 °C Parameter Specification Unit ConditionMin. Typ. Max. Recommended Operating Conditions Operating Frequency Range 1920 1980 MHz VEN 0 0.5 V PA disabled. 1.35 1.80 3.10 V PA enabled. VMODE 0 0.5 V Logic “low”. 1.35 1.80 3.10 V Logic “high”. POUT Maximum Linear Output (HPM) 28.02,3 dBm High Power Mode (HPM) Maximum Linear Output (LPM) 162,3 dBm Low Power Mode (LPM) Ambient Temperature -20 +25 +85 °C Notes: 1Minimum VCC for max POUT indicated. VCC down to 0.5 V may be used for backed-off power when using DC/DC converter to conserve battery current. 2For operation at VCC = +3.0 V, derate POUT by 0.6 dB. 3POUT is specified for 3GPP (Voice) modulation. For HSDPA operation, derate POUT by 1.5 dB: HSDPA Configuration: c  12, d  15, hs  24 Caution! ESD sensitive device. Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical perfor- mance or functional operation of the device under Absolute Maximum Rating condi- tions is not implied. RoHS status based on EU Directive 2002/95/EC (at time of this document revision). The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended appli- cation circuitry and specifications at any time without prior notice.

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Parameter Specification Unit ConditionMin. Typ. Max. Electrical Specifications T = +25C, VCC = VBAT = +3.2 V, VEN = +1.8 V, 50  system, unless otherwise specified. Gain 26 28.5 31 dB HPM, P OUT = 28.0 dBm 11.75 14.5 16 dB LPM, P OUT  16.0 dBm Gain Linearity ±0.2 dB HPM, 16.0 dBm  POUT  28.0 dBm ACLR - 5 MHz Offset -40 -36 dBc HPM, P OUT = 28.0 dBm -47 -36 dBc LPM, P OUT = 16.0 dBm ACLR - 10 MHz Offset -58 -48 dBc HPM, P OUT = 28.0 dBm -65 -48 dBc LPM, P OUT = 16.0 dBm PAE Without DC/DC Converter 36 40 % HPM, P OUT = 28.0 dBm 5 7.2 % LPM, P OUT = 16.0 dBm Current Drain 170 mA LPM, P OUT = 16.0 dBm Quiescent Current 70 100 150 mA HPM, DC only Enable Current 0.1 mA Source or sink current. V EN = 1.8 V. Mode Current (IMODE) 0.1 mA Source or sink current. V MODE = 1.8 V. Noise Power in Receive Band -140 dBm/Hz All power modes, measured at duplex offset frequency (FTX + 190 MHz). Rx: 2110 MHz to

2170 MHz, P

OUT  28.0 dBm Input Impedance 1.5:1 VSWR No ext. matching, P OUT  28 dBm, all modes. Harmonic, 2FO -22 -7 dBm P OUT  28.0 dBm, all power modes. Harmonic, 3FO -30 -12 dBm P OUT  28.0 dBm, all power modes. Spurious Output Level -70 dBc All spurious, P OUT  28 dBm, all conditions, load VSWR  6:1, all phase angles. Insertion Phase Shift -30 +30 ° Phase shift at 16 dBm when switching from HPM to LPM. DC Enable Time 10 S DC only. Time from V EN = high to stable idle cur- rent (90% of steady state value). RF Rise/Fall Time 6 SP OUT  28.0 dBm, all modes. 90% of target, DC settled prior to RF. Coupling Factor -20.7 dB P OUT  28.0 dBm, all modes. Coupling Accuracy - Temp/Voltage ±0.2 dB P OUT  28.0 dBm, all modes. -20 °C  T  85 °C, 3.0 V  VCC & VBAT  4.2 V, referenced to 25 °C, 3.2 V conditions. Coupling Accuracy - VSWR ±0.25 dB P OUT  28 dBm, all modes, load VSWR = 2.5:1, ±0.3 dB accuracy corresponds to 22 dB direc- tivity.

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Operating Mode Truth Table Package Drawing Pin Function Description 1 VBAT Supply voltage for bias circuitry. 2 RF IN RF input internally matched to 50  and DC blocked. The RF input matching circuit has a shunt inductor to ground which would short any DC voltage placed on this pin. 3N C No connection. 4 VMODE Digital control input for power mode selection (see Operating Modes truth table). 5 VEN Digital control input for PA enable and disable (see Operating Modes truth table). 6 CPL_OUT Coupler output. 7 GND This pin must be grounded. 8 CPL_IN Coupler input used for cascading couplers in series. Terminate this pin with a 50  resistor if not connected to another coupler. 9 RF OUT RF output internally matched to 50 and DC blocked. 10 VCC Supply voltage for the first and second stage amplifiers, which can be connected to battery supply or output of DC-DC converter. Pkg Base GND Ground connection. The package backside should be soldered to a topside ground pad connecting to the PCB ground plane with multiple ground vias. The pad should have a low thermal resistance and low electrical imped- ance to the ground plane. VEN VMODE VBAT VCC Conditions/Comments Low Low 3.0 V to 4.2 V 3.0 V to 4.2 V Power down mode Low X 3.0 V to 4.2 V 3.0 V to 4.2 V Standby Mode High Low 3.0 V to 4.2 V 3.0 V to 4.2 V High power mode High High 3.0 V to 4.2 V 3.0 V to 4.2 V Low power mode

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Preliminary Application Schematic

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. to 8 inch gold over 180 inch nickel. Figure 1. PCB Metal Land Pattern (Top View)

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. provided in the master data or requested from the PCB fabrication supplier. The PCB land pattern has been designed with a thermal pad that matches the die paddle size on the bottom of the device. quantity of vias be increased by a 4:1 ratio to achieve similar results. Figure 2. PCB Solder Mask Pattern (Top View)

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.