RF7206 RFMD | Alldatasheet
Document overview
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Technical content
Features
HSDPA and HSPA+ Compliant Low Voltage Positive Bias Supply (3.0 V to 4.35 V) +28.5 dBm Linear Output Power (+27.0 dBm HSDPA and HSPA+) High Efficiency Operation 39% at P OUT = +28.5 dBm 19% at POUT = +19.0 dBm (Without DC/DC Converter) Low Quiescent Current in Low Power Mode: 17 mA Internal Voltage Regulator Eliminates the Need for Exter- nal Reference Voltage (V REF) 3-Mode Power States with Digital Control Interface Supports DC/DC Converter Operation Integrated Power Coupler Integrated Blocking and Col- lector Decoupling Capacitors
Applications
WCDMA/HSDPA/HSPA+ Wireless Handsets and Data Cards Dual-Mode UMTS Wireless Handsets RF7206 3 V W-CDMA Band 2 Linear PA Module RF7206PCBA-410 Fully Assembled Evaluation Board DS100805 Package Style: Module, 10-Pin, 3 mm x 3 mm x 1.0 mm
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Absolute Maximum Ratings Parameter Rating Unit Supply Voltage in Standby Mode 6.0 V Supply Voltage in Idle Mode 6.0 V Supply Voltage in Operating Mode, 50 Load 6.0 V Supply Voltage, V BAT 6.0 V Control Voltage, VMODE0, VMODE1 3.5 V Control Voltage, VEN 3.5 V RF - Input Power +6 dBm RF - Output Power +30 dBm Output Load VSWR (Ruggedness) 10:1 Operating Ambient Temperature -30 to +110 °C Storage Temperature -55 to +150 °C Parameter Specification Unit ConditionMin. Typ. Max. Recommended Operating Conditions Operating Frequency Range 1850 1910 MHz VEN 0 0.5 V PA disabled. 1.4 1.8 3.0 V PA enabled. VMODE0, VMODE1 0 0.5 V Logic “low”. 1.5 1.8 3.0 V Logic “high”. POUT Maximum Linear Output (HPM) 28.52,3 dBm High Power Mode (HPM) Maximum Linear Output (MPM) 19.02,3 dBm Medium Power Mode (MPM) Maximum Linear Output (LPM) 8.02,3 dBm Low Power Mode (LPM) Ambient Temperature -30 +25 +85 °C Notes: 1Minimum VCC for max POUT is indicated. VCC down to 0.5 V may be used for backed-off power when using DC/DC converter to conserve battery current. 3POUT is specified for 3GPP (Voice) modulation. For HSDPA and HSPA+ operation, derate POUT by 1.5 dB: HSDPA Configuration: c 12, d 15, hs 24, HSPA+ Configuration: 3GPP Release 7 Subtest 1 Caution! ESD sensitive device. Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical perfor- mance or functional operation of the device under Absolute Maximum Rating condi- tions is not implied. RoHS status based on EU Directive 2002/95/EC (at time of this document revision). The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended appli- cation circuitry and specifications at any time without prior notice.
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Parameter Specification Unit ConditionMin. Typ. Max. Electrical Specifications T = +25C, VCC = VBAT = +3.4 V, VEN = +1.8 V, 50 system, WCDMA Rel 99 Modulation unless oth- erwise specified. Gain 25.0 26.5 dB HPM, P OUT = 28.5 dBm 15 17.5 dB MPM, P OUT 19.0 dBm 10.51 14.5 dB LPM, P OUT 8.0 dBm Gain Linearity ±0.2 dB HPM, 19.0 dBm POUT 28.5 dBm ACLR - 5 MHz Offset -39 -36 dBc HPM, P OUT = 28.5 dBm -42 -36 dBc MPM, P OUT = 19.0 dBm -42 -36 dBc LPM, P OUT = 8.0 dBm ACLR - 10 MHz Offset -52 -47 dBc HPM, P OUT = 28.5 dBm -58 -47 dBc MPM, P OUT = 19.0 dBm -60 -47 dBc LPM, P OUT = 8.0 dBm PAE Without DC/DC Converter 35 39 % HPM, P OUT = 28.5 dBm 16 19 % MPM, P OUT = 19.0 dBm Current Drain 80 mA MPM, P OUT = 16.0 dBm 38 mA LPM, P OUT = 8.0 dBm 20 mA LPM, P OUT = 0.0 dBm Quiescent Current 85 125 mA HPM, DC only 20 28 mA MPM, DC only 17 24 mA LPM, DC only Enable Current 0.3 1.0 mA Source or sink current. V EN = 1.8 V. Leakage Current 5.0 15.0 A DC only. V CC = VBAT = 4.35 V, VEN = VMODE0 = VMODE1 = 0.5 V. Noise Power in Receive Band -137 -134 dBm/Hz All power modes, measured at duplex offset frequency (FTX + 80 MHz). Rx: 1930 MHz to
1990 MHz, P
OUT 28.5 dBm Input Impedance 1.7:1 VSWR No ext. matching, P OUT 28.5 dBm, all modes. Harmonic, 2FO -27 -15 dBm P OUT 28.5 dBm, all power modes. Harmonic, 3FO -35 -20 dBm P OUT 28.5 dBm, all power modes. Spurious Output Level -70 dBc All spurious, P OUT 28.5 dBm, all conditions, load VSWR 6:1, all phase angles. Insertion Phase Shift -30 +30 ° Phase shift at 19 dBm when switching from HPM to MPM and MPM to LPM at 8 dBm. DC Enable Time 10 S DC only. Time from V EN = high to stable idle cur- rent (90% of steady state value). RF Rise/Fall Time 6 SP OUT 28.5 dBm, all modes. 90% of target, DC settled prior to RF. Coupling Factor 19.5 dB P OUT 28.5 dBm, all modes. Coupling Accuracy - Temp/Voltage ±0.5 dB P OUT 28.5 dBm, all modes. -30 °C T 85 °C, 3.0 V VCC & VBAT 4.35 V, referenced to 25 °C, 3.4 V conditions. Coupling Accuracy - VSWR ±0.7 dB P OUT 28.5 dBm, all modes, load VSWR = 2:1, ±0.7 dB accuracy corresponds to 12 dB direc- tivity. Coupler termination resistance = 33 . Note: 1Excludes DC/DC converter operation. Gain may be lower when using DC/DC converter to conserve battery current.
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Package Drawing Pin Function Description 1 VBAT Supply voltage for bias circuitry and the first stage amplifier. 2 RF IN RF input internally matched to 50 and DC blocked. Input matching includes a shunt inductor to ground which would short DC voltage placed on this pin. 3 VMODE1 Digital control input for power mode selection (see Operating Modes truth table). 4 VMODE0 Digital control input for power mode selection (see Operating Modes truth table). 5 VEN Digital control input for PA enable and disable (see Operating Modes truth table). 6 CPL_OUT Coupler output. 7 GND This pin must be grounded. 8 CPL_IN Coupler input used for cascading couplers in series. Terminate this pin with a 50 resistor if not connected to another coupler. 9 RF OUT RF output internally matched to 50 and DC blocked. 10 VCC Supply voltage for the second stage amplifier which can be connected to battery supply or output of DC-DC con- verter. Pkg Base GND Ground connection. The package backside should be soldered to a topside ground pad connecting to the PCB ground plane with multiple ground vias. The pad should have a low thermal resistance and low electrical imped- ance to the ground plane. VEN VMODE0 VMODE1 VBAT VCC Conditions/Comments Low Low Low 3.0 V to 4.35 V 3.0 V to 4.35 V Power down mode Low X X 3.0 V to 4.35 V 3.0 V to 4.35 V Standby Mode High Low Low 3.0 V to 4.35 V 3.0 V to 4.35 V High power mode High High Low 3.0 V to 4.35 V 3.0 V to 4.35 V Medium power mode High High High 3.0 V to 4.35 V 3.0 V to 4.35 V Low power mode High High High 3.0 V to 4.35 V 0.5 V Optional lower V CC in low power mode
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Preliminary Application Schematic
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. to 8 inch gold over 180 inch nickel. Figure 1. PCB Metal Land Pattern (Top View)
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. provided in the master data or requested from the PCB fabrication supplier. The PCB land pattern has been designed with a thermal pad that matches the die paddle size on the bottom of the device. quantity of vias be increased by a 4:1 ratio to achieve similar results. Figure 2. PCB Solder Mask Pattern (Top View)
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.