DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 10

Technical content

Features

■ Tx Output Power = 18dBm ■ Integrated RF Front End Module with Rx Balun, PA, Filter, LNA with Bypass Mode, and DP2T Switch ■ Single Bidirectional Differential Transceiver Interface. ■ Voltage Range = 2.0V to 3.6V

Applications

■ ZigBee® 802.15.4 Based Systems for Remote Monitoring and Control ■ Set-top Boxes ■ AA Battery Operation ■ 2.4GHz ISM Band Applications ■ Smart Meters for Energy Management RF6555

RFMD + TriQuint = Qorvo Absolute Maximum Ratings Parameter Rating Unit DC Supply Voltage 5.0 V DC Supply Current 150 mA Operating Case Temperature -40 to +85 ºC Storage Temperature -40 to +150 ºC ESD Human Body Model RF Pins 1000 V ESD Human Body Model All Other Pins 500 V ESD Charge Device Model All Pins 500 V Moisture Sensitivity Level MSL 2 Maximum Tx Input Power +5 dBm Maximum Rx Input Power +8 dBm Caution! ESD sensitive device. RFMD Green: RoHS status based on EU Directive 2011/65/EU (at time of this document revision), halogen free per IEC 61249-2-21, < 1000ppm each of antimony trioxide in polymeric materials and red phosphorus as a flame retardant, and <2% antimony in solder. Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied. Nominal Operating Parameters Parameter Specification Unit Condition Min Typ Max Parameter VBATT 2.0 3.0 3.6 VDC Operating Temperature Range -40 +25 +85 ºC ZO 50 Ω Off Mode Current 0.05 1.0 µA All logic low, Temp = 25°C; Over Voltage. Storage Temperature -40 +150 °C ESD, HBM 1000 V RF pins ESD, HBM 500 V All other pins ESD, CDM 500 V All pins MSL MSL3 Current Sourced through CT Pin 18 mA Voltage Drop from CT Pin to RXP/RXN 0.1 V Tx Path Frequency 2405 2480 MHz Input Return Loss 10 dB Pins 5, 6 (RFM, RFP) 100Ω differential Output Return Loss 10 dB Gain 22 25 dB 2.7V to 3.6V 21 dB VCC=2.0V; Temp=25oC Gain Flatness -0.8 +0.8 dB Rated Output Power 20 dBm Nominal conditions (VB=3.3 to 3.6, All Temp) 18 dBm Nominal conditions (VB=3.0 to 3.3, All Temp) 16 dBm Nominal conditions (VB=2.7, All Temp) 14 dBm Nominal conditions (VB=2.0, All Temp) Saturated Output Power 22 dBm VB=3.6, Temp = 25C 20 dBm VB=3.0, Temp = 25C Supply Current 110 125 mA PO =21dBm 802.15.4 OQPSK (VB=3.6, All Temp) 105 120 mA PO =20dBm 802.15.4 OQPSK (VB=3.0, All Temp) 70 95 mA PO =18dBm 802.15.4 OQPSK (VB=3.0, All Temp)

RFMD + TriQuint = Qorvo Parameter Specification Unit Condition Min Typ Max 50 mA PO =14dBm 802.15.4 OQPSK (VB=2.0, All Temp) Thermal Resistance 78 oC/W VCC = 3.0V, POUT = 18dBm, TREF = 85oC Harmonics 2f0 to 5f0 -45 -42 dBm/MHz At 18dBm, VCC = 3.0V to 3.6V VSWR Stability and Load 4:1 VSWR No Damage 8:1 Gain Settling Time 1 10 µS Rx Path Frequency 2405 2480 MHz Gain 8.5 11 13 dB Noise Figure 3 dB Temp = 25°C; over voltage and frequency Current 8 12 mA Nominal conditions IIP3 7 dBm Gain Flatness -0.5 +0.5 dB Input Return Loss 10 15 dB Output Return Loss 10 dB Pins 5, 6 (RFM, RFP) 100Ω differential Amplitude Imbalance -1 +1 dB Phase Imbalance -15 +15 dB Maximum Input Power 5 dBm Bypass Mode Frequency 2405 2480 MHz Insertion Loss/Noise Figure 5 6.5 dB SW1dB, Bypass 2.5dB, Balun 1.5dB Current 50 µA IIP3 23 dBm Gain Flatness -0.5 0.5 dB Input Return Loss 10 12 dB Output Return Loss 10 dB Pins 5, 6 (RFM, RFP) 100Ω differential Amplitude Imbalance -1 +1 dB Phase Imbalance -15 +15 dB Maximum Input Power 10 dBm Logic Logic Level “HIGH” Input Voltage VBATT -0.2 VBATT V Logic Level “LOW” Input Voltage 0.0 0.2 V Input Source Current at Logic “HIGH” 5 10 µA Switch Leakage Current at Logic “LOW” 1 µA Antenna Switch RF to Control Isolation 50 dB ANT1 to ANT2 Isolation 20 dB T/R Switching Time 1 µS

RFMD + TriQuint = Qorvo Control Logic Table Mode CE C_RX_TX C_LNA ANTSEL TX-ANT1 High High Low Low TX-ANT2 High High Low High RX-ANT1 LNA High Low Low Low RX-ANT1 BYP High Low High Low RX-ANT2 LNA High Low Low High RX-ANT2 BYP High Low High High Power Down Low Low Low Low

RFMD + TriQuint = Qorvo Applications Schematic ANT1 CE VCC ANT2 VCC C_Rx_Tx CT 50Ω µstrip 50Ω µstrip 50Ω µstrip J1 RF_COM C_LNA ANT SEL 0.1µF (0402) 50Ω µstrip 50Ω µstrip 8 9 10 11 12 24 23 22 21 20 RF6555 BALUN 2450MHz 50Ω - 100Ω

RFMD + TriQuint = Qorvo Pin Out

RFMD + TriQuint = Qorvo Package Drawing

RFMD + TriQuint = Qorvo PCB Patterns Thermal vias for center slug “D” should be incorporated into the PCB design. The number and size of thermal vias will depend on the application, power dissipation and electrical requirements. Example of the number and size of vias can be found on the RFMD evaluation board layout (gerber files are available upon request).

RFMD + TriQuint = Qorvo RF6555 2.4 GHz Front End Module

RFMD + TriQuint = Qorvo Pin Names and Descriptions Pin Name Description 1 GND Ground. 2 CE Control voltage pin for chip enable. See logic table. 3 GND Ground. 4 CT Center tap for passing DC voltage to RFN/RFP pins that connect to the TXVR SoIC. 5 RFN Differential bi-directional RF port. Matched to 50Ω single-ended, 100Ω differential. 6 RFP Differential bi-directional RF port. Matched to 50Ω single-ended, 100Ω differential. 7 GND Ground. 8 VCC_DIG Voltage supply pin for digital logic circuitry. 9 GND Ground. 10 VCC_PA Voltage supply pin for Tx power amplifier. 11 N/C Not connected. 12 GND Ground. 13 GND Ground. 14 GND Ground. 15 ANT1 Antenna port 1. Match to 50Ω and DC blocked internally. 16 GND GND Ground. 17 ANT2 Antenna port 2. Matched to 50Ω and DC blocked internally. 18 GND Ground. 19 GND Ground. 20 ANTSEL Control pin for antenna selection. See logic table. 21 N/C Not connected. 22 VCC_LNA Voltage supply pin for Rx low noise amplifier. 23 C_LNA Control voltage for pin for LNA/bypass modes. See logic table. 24 C_RX_TX Control voltage pin for Tx/Rx modes. See logic table.