DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 11
Technical content
Features
TX Output Power: 22dBm RX NF: 1.5dB Integrated RF Front End Module with TX/RX balun, PA, filter, and SP2T switch. Dual Differential Transceiver interface.
Applications
ZigBee® 802.15.4 Based Systems for Remote Monitoring and Control Smart Meters for Energy Management. 2.4GHz ISM Band applications. Portable battery powered equipment. RF6515SQ Standard 25 piece bag RF6515SR Standard 100 piece reel RF6515TR7 Standard 750 piece reel RF6515TR13 Standard 2500 piece reel RF6515PCK-410 Fully assembled evaluation board tuned for 2.4GHz to 2.5GHz and 5 piece loose samples DS120904 Package Style: QFN, 20-Pin, 3.5mmx3.5mmx0.5mm
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Absolute Maximum Ratings Parameter Rating Unit DC Supply Voltage 5 V Operating Case Temperature -40 to +85 °C Storage Temperature -40 to +150 °C ESD Human Body Model RF Pins 1000 V ESD Human Body Model All Other Pins 500 V ESD Charge Device Model All Pins 500 V Moisture Sensitivity Level MSL 2 Maximum Input Power to PA and RX Ports (no damage) +5 dBm Parameter Specification Unit ConditionMin. Typ. Max. Overall Specifications must be met across supply volt- age, control voltage, and temperature ranges unless otherwise noted. Typical conditions: T=25°C, V CC=3.3V , P AEN=ON Operating Frequency Range 2400 2500 MHz Operating Voltage (VCC) 2.85 3.3 4.2 V Leakage Current 10 40 uA V CC=3.3V , RF=OFF , P AEN=0V Transmit Parameters Frequency 2400 2483 MHz Input Return Loss -13 -9 dB Over frequency, V CC, and Temperature Amplitude Imbalance -1 1 dB Phase Imbalance -15 15 deg Output Return Loss -13 -9 Over frequency, V CC, and Temperature Gain 26 28 dB At rated power 22dBm Gain Flatness -1 +1 dB Over frequency Gain Variation -1.5 +1.5 dB Over temperature at 22dBm Rated Output Power 22 dBm VBAT=3.0V, Temp=25°C. Using 802.15.4 OQPSK modulation waveform Output Power 20 d Bm All conditions Supply current 200 mA P O=22dBm 802.15.4 OQPSK. Over frequency, VCC, and Temperature Supply current 170 mA P O=20dBm 802.15.4 OQPSK. Over frequency, VCC, and Temperature Thermal Resistance 53 °C/W V CC = 3.6V, POUT = 22dBm, TREF = 85°C 2nd harmonic level -47 -43 dBm/MHz At nominal conditions 3rd harmonic level -50 -43 dBm/MHz At nominal conditions Caution! ESD sensitive device. Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical perfor- mance or functional operation of the device under Absolute Maximum Rating condi- tions is not implied. RoHS status based on EUDirective2002/95/EC (at time of this document revision). The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended appli- cation circuitry and specifications at any time without prior notice.
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Parameter Specification Unit ConditionMin. Typ. Max. Transmit Parameters, cont. VSWR No damage 10:1 Gain settling time 1 2 uS Current sourced through TXCT pin 18.0 mA Voltage drop from TXCT pin to TXP/TXN 0.1 V Receive Parameters Frequency 2400 2483 MHz Noise Figure/Insertion Loss 1.7 2.3 dB From antenna to RX pin (entire RX path). Over frequency, VCC, and Temperature Gain flatness -0.5 0.5 dB Input return loss -13 -10 dB Over frequency, V CC, and Temperature Output return loss -13 -10 dB Over frequency, V CC, and Temperature Amplitude imbalance -1 1 dB Phase imbalance -15 15 deg Current sourced through RXCT pin 1 mA Voltage drop from RXCT pin to RXP/RXN 0.1 V Antenna Switch RF-to-ANT Isolation 17 20 dB Measured from Antenna to RX port while in Transmit mode. Measured from Antenna to TX port while in Receive mode. PAEN = HIGH 1.6 1.8 2.0 V TX mode. PAEN = LOW 0.0 0.2 V RX mode. Switch Control Current. Logic HIGH 10 A Switch Control Current. Logic LOW 0.1 A T/R Switching Time 1 uS
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. RF6515 Biasing Instructions TX Mode
- With the RF source disabled, apply 3.3V to V CC with PAEN set to 0V
- A p p l y 1 . 8 V t o P A E N
- V CC current should rise to 70mA to 80mA quiescent current
- Enable the RF source; V CC current should rise to a maximum of 200mA depending on output power RX Mode
- With the RF source disabled, apply 3.3V to V CC with PAN set to 0V
- VCC current should rise to 100uA
- Enable the RF source Pin Function Description 1N C No connect. This pin is not connected internally . It can be left floating or connected to ground. 2N C No connect. This pin is not connected internally . It can be left floating or connected to ground. 3N C No connect. This pin is not connected internally . It can be left floating or connected to ground. 4P A E N Enable pin for PA + TX switch (HIGH) and RX switch (LOW). See Control Logic Table for operation. 5N C No connect. This pin is not connected internally . It can be left floating or connected to ground. 6N C No connect. This pin is not connected internally . It can be left floating or connected to ground. 7G N D Ground. 8A N T This is the common port (antenna). It is matched to 50 Ω and DC-block is provided internally 9G N D Ground. 10 VCC Voltage Supply. An external 1uF capacitor might be needed for low frequency decoupling 11 ISO No connect pin. Must be left floating. 12 VCC Voltage Supply. An external 1uF capacitor might be needed for low frequency decoupling 13 VCC Voltage Supply. An external 1 uF capacitor might be needed for low frequency decoupling 14 NC No connect. This pin is not connected internally . It can be left floating or connected to ground. 15 TXCT Center tap for passing thru voltage to TXVR SOIC. 16 TXN Single Ended; 200Ω differential. 17 TXP Single Ended; 200Ω differential. 18 RXCT Center tap for passing thru voltage to TXVR SOIC. 19 RXBN Single Ended; 200Ω differential. 20 RXBP Single Ended; 200Ω differential. Mode PAEN (Logic) VBATT_PA (mA) PAEN (mA TX-ANT HIGH 170 0.01 RX-ANT LOW 0.0001 0.0001 Operating currents at nominal conditions.
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Package Drawing
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Evaluation Board Schematic balanced line* 1uF VCC * These lines need to be balanced 100and should be short relative to a wavelength at the frequency of operation. balanced line* 0.1uF 31 4 121415 BALUN BALUN 1113 4.3 nH 1.8nH N/C PAEN ANT RXN RXP TXN TXP RXCT BALUN BALUN
50 Ohms
100 Ohms
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Evaluation Board Layout
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. PCB Design Requirements PCB Surface Finish The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3inch to 8inch gold over 180inch nickel. PCB Land Pattern Recommendation PCB land patterns for RFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern shown has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is recommended. PCB Metal Land and Solder Mask Pattern Thermal vias for center slug “C” should be incorporated into the PCB design. The number and size of thermal vias will depend on the application, the power dissipation, and this electrical requirements. Example of the number and size of vias can be found on the RFMD evaluation board layout.
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. -35 -30 -25 -20 -15 -10 02468 1 0 1 2 1 4 1 6 1 8 2 0 2 2 2 4 Input Power (dBm) Output Power (dBm) Input Power versus Output Power VCC=3.3V; PA_EN=1.6V
2400 MHz
2441.5 MHz
2483 MHz
-35 -30 -25 -20 -15 -10 02468 1 0 1 2 1 4 1 6 1 8 2 0 2 2 2 4 Input Power (dBm) Output Power (dBm) Input Power versus Output Power (Over Temperature at 2441.5MHz) VCC= 3.3V; PA_EN=1.6V -40 C 25 C 85 C 02468 1 0 1 2 1 4 1 6 1 8 2 0 2 2 2 4 Gain (dB) Output Power (dBm) Gain versus Output Power VCC=3.3V; PA_EN=1.6V 02468 1 0 1 2 1 4 1 6 1 8 2 0 2 2 2 4 Gain (dB) Output Power (dBm) Gain versus Output Power (Over Temperature at 2441.5 MHz) VCC=3.3V; PA_EN=1.6V -40 C 25 C 85 C 0.00 0.05 0.10 0.15 0.20 0.25 0.30 02468 1 0 1 2 1 4 1 6 1 8 2 0 2 2 2 4 Operating Current (mA) Output Power (dBm) Operating Current vs Output Power Vcc = 3.3V; PA_EN = 1.6V 0.00 0.05 0.10 0.15 0.20 0.25 0.30 02468 1 0 1 2 1 4 1 6 1 8 2 0 2 2 2 4 Operating Current (mA) Output Power (dBm) Operating Current versus Output Power (Over Temperature at 2441.5 MHz) VCC=3.3V; PA_EN=1.6V -40 C 25 C 85 C
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 2400 2420 2440 2460 2480 2500 S21 (dB) Frequency (MHz) RX S21 vs Frequency (Over Temperature ) Vcc = 3.0V; PA_EN = 1.6V -40 C 25 C 85 C