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Technical content
Features
Single Power Supply 3.0V to 5V +21dBm, <4.0%EVM, 185mA at VCC=3.3V +23dBm, <4% EVM, 250mA at V CC=5.0V 28dB Typical Small Signal Gain 50 Input and Interstage Match- ing 2400MHz to 2500MHz Frequency Range
Applications
IEEE802.11b/g/n WiFi Applica- tions 2.5GHz ISM Band Applications Commercial and Consumer Sys- tems Portable Battery-Powered Equip- ment Spread-Spectrum and MMDS Systems RF5102 Standard 25 piece bag RF5102SR Standard 100 piece reel RF5102TR7 Standard 2500 piece reel RF5102PCK-41X Fully Assembled Evaluation Board Kit (3.3V tune) RF5102WL50PCK-41X Fully Assembled Evaluation Board Kit (5.0V Tune) DS110617 Package Style: QFN, 16-Pin, 3mmx3mmx0.9mm
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Absolute Maximum Ratings Parameter Rating Unit Supply Voltage 5 V Power Control Voltage (VREG)3 . 3 V DC Supply Current 500 mA Input RF Power +5 dBm Operating Ambient Temperature -40 to +85 °C Storage Temperature -40 to +150 °C Moisture Sensitivity MSL2 Parameter Specification Unit ConditionMin. Typ. Max. Compliance and Nominal Conditions IEEE802.11g, IEEE802.11b, FCC CFG 15.247, .205, .209, EN and JDEC VCC=3.3V , VREG=2.85V pulsed at 1% to 99% duty cycle ,Temp=+25°C, Freq=2.4GHz to 2.5GHz, OFDM 54Mbps signal, unless noted otherwise. Frequency Range 2400 2500 MHz Linear Output Power 21.0 dBm V CC=3.3V. Meets 802.11g spectral mask 23.0 dBm V CC=5.0V. Meets 802.11g spectral mask EVM 3.3 4.0 % P OUT=+21dBm, 54M OFDM, V CC=3.3V DC 3.3 4.0 % P OUT=+23dBm, 54M OFDM, V CC=5.0V DC Gain 26 28 dB Both P OUT=+21dBm and +23dBm. V CC=3.3V and 5.0V. Input Impedance 50 Internally Matched Input and Interstage Output VSWR 10:1 No spurs above -43dBm Power Detector (P_detect) POUT=21dBm 0. 13 1. 10 V V CC=3.3V POUT=23dBm 0. 13 2.2 V V CC=5.0V Power Supply Operating Voltage 3.0 3.3 5.0 V DC 5V operation requires output match revision VREG (Bias) Voltage (VREG1, VREG2) 2.75 2.85 2.95 V DC Current Consumption 185 mA RF P OUT=+2 1dBm, VCC=3.3V , 54Mbps OFDM 250 RF P OUT=+23dBm, V CC=5.0V , 54Mbps OFDM Quiescent Current 95 mA RF=OFF Leakage Current 10 uA V CC=ON; RF In=OFF; V REG OFF VREG (Bias) Current (Total) 3 mA V CC=3.3V 3m A V CC=5.0V Caution! ESD sensitive device. Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical perfor- mance or functional operation of the device under Absolute Maximum Rating condi- tions is not implied. RoHS status based on EUDirective2002/95/EC (at time of this document revision). The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended appli- cation circuitry and specifications at any time without prior notice.
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Pin Function Description Interface Schematic 1N C Not connected. May be connected to ground (GND). 2R F I N RF input. See evaluation board schematic for details. 3R F I N RF input. See evaluation board schematic for details. See pin 2. 4N C Not connected. May be connected to ground (GND). 5N C Do not connect. Note: VCC voltage may be applied to this pin without damage to, or affect- ing the performance of, the RF5102. 6V R E G 1 Bias current control voltage for the first stage. 7V R E G 2 Bias current control voltage for the second stage. The VREG2 pin may be connected to VREG1 through an external resistor bridge. 8P D E T E C T ( o r N/C*) Provides an output voltage proportional to the output RF level. *In applications where the PDETECT function is not desired, this pin may be left unconnected. 9N C No-connect. 10 RF OUT RF output. 11 RF OUT Same as pin 10. See pin 10. 12 VCC2 Power supply for second stage amplifier. Connect as shown on evaluation board schematic. 13 NC Not connected. May be connected to ground (GND). 14 VCC1 Power supply for first stage amplifier. Connect as shown on evaluation board schematic. 15 NC Not connected. May be connected to ground (GND). 16 VCC B Supply voltage for the bias reference and control circuits. May be con- nected with VC1 and VC2 (single-supply voltage). Pkg Base GND The center metal base of the QFN package provides DC and RF ground as well as heat sink for the amplifier. INPUT MATCH VCC INTERSTAGE MATCH RF OUT BIAS
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Package Drawing Pin Out Shaded lead is pin 1. Dimensions in mm. 0.90 0.85 0.05 C 0.05 0.00 0.70 0.65 12° MAX -C- SEATING PLANE 0.60 0.24 TYP 0.50 0.30 PIN 1 ID R.20
0.10 C ABM
0.30 0.18 0.50 1.65 1.35 SQ.
1.50 TYP
0.10 C A
2 PLCS-A-
3.00
0.10 C B
2 PLCS
1.37 TYP
2 PLCS 2.75 SQ 3.00 -B- RF IN RF IN NC NCNC NC VREG1 VREG2 PDETECT RF OUT VCC B VCC1 NC RF OUT VCC2 16 15 14 13 5 6 7 8 NC
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Evaluation Board Schematic - 3.3V 50 stripJ1 RF IN 1 nF 1 nF C9 330 pF 68 VREG1 and 2 PDETECT C10 2. 2 pF 6. 8 nH Coilcraft 7. 5 nH 1 F 1 FC1 1 nF VCC GND P2-1 PDETECT P2-3 VREG 2 P2-4 VREG 1 HDR_1x4
1 GND
50 strip RF OUT C12 10 pF 16 15 14 13 5 6 7 8 1 1 1P3-1 VCC 2C8 4. 7 F C11 DNP TLTL TL = 112 mils ( 50 ) from IC ( Measured to center of C10 pad) GND VCCP1-1 5125400 , r.- 27 0 Notes: 1. Pins 1, 4, 13, and 15 may be left as No Connect. 2. C2 and C3 bypass caps can be removed if VREG1 and VREG 2 are cupplied with clean voltages. *DNP = Do Not Place
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Evaluation Board Schematic - 5V 50 stripJ1 RF IN 1 nF 1 nF C9 330 pF 0 VREG1 and 2 PDETECT C10 1.5 pF 6.8 nH Coilcraft 7.5 nH 1 F 1 FC1 1 nF VCC GND P2-1 PDETECT P2-3 VREG2 P2-4 VREG1 HDR_1x4 50 strip RF OUT C12 10 pF 16 15 14 13 5 6 7 8 Notes: 1. Pins 1, 4, 13, and 15 may be left as No Connect. *DNP=Do Not Place 2. C2 and C3 bypass caps can be removed if VREG1 and VREG2 are supplied with clean voltages. 1 1 1P3-1 VCC 2C8 4.7 F C13 DNP* TL TL = 200 mils (50 ) from IC (or 55 mils from center of C13 pad to center of C11 pad) TL TL = 90 mils (50 ) from IC (Measured to the center of C10 pad) GND VCCP1-1 5125400, r.- 56 TL C11 1.0 pF 3 1.8 k
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Evaluation Board Layout Board Size 2.0” x 2.0” Board Thickness 0.031”, Board Material FR-4, Multi-Layer
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 3.3V Operation Typical Performance EVM versus Output Power versus Frequency VCC=3.3V, OFDM 54Mbps, 50% Duty Cycle, Temp=25°C 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 Output Power (dBm) EVM (%)
2400 MHz
2450 MHz
2500 MHz
Gain versus Output Power versus Frequency VCC=3.3V, OFDM 54Mbps, 50% Duty Cycle, Temp=25°C 24.0 26.0 28.0 30.0 32.0 Output Power (dBm) Gain (dB) ICC versus Output Power versus Frequency VCC=3.3V, OFDM 54Mbps, 50% Duty Cycle, Temp=25°C 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 Output Power (dBm) ICC (A) PDETECT versus Output Power versus Frequency VCC=3.3V, OFDM 54Mbps, 50% Duty Cycle, Temp=25°C 0.0 0.5 1.0 1.5 2.0 Output Power (dBm) PDETECT (V)
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. to 8inch gold over 180inch nickel. Figure 1. PCB Metal Land Pattern (Top View)
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. provided in the master data or requested from the PCB fabrication supplier. The PCB land pattern has been designed with a thermal pad that matches the die paddle size on the bottom of the device. quantity of vias be increased by a 4:1 ratio to achieve similar results. Figure 2. PCB Solder Mask Pattern (Top View)
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. RoHS Compliant: Yes Package total weight in grams (g): 0.015 Compliance Date Code: N/A Bill of Materials Revision: - Pb Free Category: e3 Pb Cd Hg Cr VI PBB PBDE Die 000000 Molding Compound 000000 Lead Frame 000000 Die Attach Epoxy 000000 Wire 000000 Solder Plating 000000 * DIRECTIVE 2002/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment RoHS* Banned Material Content Bill of Materials Parts Per Million (PPM) This RoHS banned material content declaration was prepared solely on information, including analytical data, provided to RFMD b y its suppliers, and applies to the Bill of Materials (BOM) revision noted above.