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Technical content
Features
Broadband 50MHz to 4000MHz Operation 6-Bit Digital Step Attenuator Serial Mode Programming Gain = -13.5dB to +18dB (0.5dB Step Size) High OIP3/P1dB = +36dB/20dBm Single +5V Supply Small 32-Pin, 5.2mm x 5.2mm, MCM (Footprint Compatible with 5mm x 5mm 32-Pin QFN)
Applications
Cellular, 3G Infrastructure WiBro, WiMax, LTE Microwave Radio High Linearity Power Control DS120828 Package: MCM, 32-Pin, 5.2mm x 5.2mm RDA1005LDig- ital Controlled Variable Gain Amplifier 50MHz to 4000MHz, 6 Bit RDA1005LSQ Sample bag with 25 pieces RDA1005LSR 7” Sample reel with 100 pieces RDA1005LTR7 7” Reel with 750 pieces RDA1005LTR13 13” Reel with 2500 pieces RDA1005LPCK-410 50MHz to 4000MHz PCBA with 5-piece sample bag
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support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com. Typical RF Performance at Key Operating Frequencies (Note: Broadband Application Circuit) Absolute Maximum Ratings Parameter Rating Unit Supply Voltage +5.5 V DC DC Supply Current 110 mA Power Dissipation 605 mW Max RF Input Power 20 dBm Operating Temperature (TCASE)- 4 0 t o + 8 5 ° C Storage Temperature -40 to +150 °C Junction Temp 165* °C ESD Rating (HBM) 1000 (Class 1C) V Moisture Sensitivity Level MSL3 * MTTF = 1.0E6 hours at 165°C junction temperature Parameter Specification Unit ConditionMin. Typ. Max. General Parameters TA = 25°C, VDD = 5V Frequency Range 50 4000 MHz Gain Max 500MHz 17.5 19.0 20.5 dB Attenuation = 0dB Gain Max 2700MHz 15.5 17.5 18.5 dB Step Accuracy + (0.1 +5% attenuation setting) dB Majo r state max error up to 2700MHz Output P1dB 1900MHz 20 dBm Attenuation = 0dB Output P1dB 2700MHz 19 dBm Output IP3 1900MHz 36 dBm Output IP3 2700MHz 33 dBm Control Interface 6 bit Serial mode Settling Time 250 ns tON, tOFF (10/90% RF) Noise Figure 1900MHz 6.3 dB Attenuation = 0dB Impedance 50 Input Return Loss -15 dB Output Return Loss -15 dB Supply Voltage 4.75 5.0 5.25 V Supply Current 82 mA Thermal Resistance 80.7 °C/W Junc tion to backside of device Parameter Unit 500MHz 850MHz 1.95GHz 2.4GHz 3.5GHz 4GHz Output IP3 dBm 39 40 36 34.8 28.5 27.1 Input Return Loss dB -36 -24 -16 -15 -14 -10 Output Return Loss dB -18 -22 -15 -11 -16 -27 Noise Figure dB 5.5 5.5 5.9 6.2 - - Caution! ESD sensitive device. Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical perfor- mance or functional operation of the device under Absolute Maximum Rating condi- tions is not implied. The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended appli- cation circuitry and specifications at any time without prior notice. RFMD Green: RoHS compliant per EU Directive 2002/95/EC, halogen free per IEC 61249-2-21, < 1000ppm each of antimony trioxide in polymeric materials and red phosphorus as a flame retardant, and <2% antimony in solder.
support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com. Typical Performance - Broadband Application Circuit 0 1 2 3 4 5 6 7 8 S21 (dB) Freq (GHz) S21 Over Temperature +25C -40C +85C -30 -25 -20 -15 -10 IRL (dB) Freq (GHz) Input Return Loss at Major States +25C 0dB 0.5dB 1dB 2dB 4dB 8dB 16dB 31.5dB -20 -15 -10 Gain (dB) Freq (GHz) Gain at Major States +25C 0dB 0.5dB 1dB 2dB 4dB 8dB 16dB 31.5dB -30 -25 -20 -15 -10 0 1 2 3 4 5 6 7 8 S11(dB) Freq(GHz) S11 Over Temperature +25C -40C +85C -30 -25 -20 -15 -10 ORL (dB) Freq (GHz) Output Return Loss at Major States +25C 0dB 0.5dB 1dB 2dB 4dB 8dB 16dB 31.5dB -30 -25 -20 -15 -10 0 1 2 3 4 5 6 7 8 S22 (dB) Freq (GHz) S22 Over Temperature +25C -40C +85C
support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com. Typical Performance - Broadband Application Circuit -50 -45 -40 -35 -30 -25 -20 -15 -10 0 1 2 3 4 5 6 7 8 S12(dB) Freq(GHz) S12 Over Temperature +25C -40C +85C -1.5 -1.0 -0.5 0.0 0.5 1.0 Error (dB) Freq (GHz) Step Error at Major States +25C 0dB 0.5dB 1dB 2dB 4dB 8dB 16dB 31.5dB -1.5 -1.0 -0.5 0.0 0.5 1.0 Error(dB) Freq(GHz) Step Error at Major States -40C 0dB 0.5dB 1dB 2dB 4dB 8dB 16dB 31.5dB -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 Error (dB) Freq (GHz) Step Error at Major States +85C 0dB 0.5dB 1dB 2dB 4dB 8dB 16dB 31.5dB -20 -10 Phase (°) Freq(GHz) Normalized Phase Error at Major States +25C 0dB 0.5dB 1dB 2dB 4dB 8dB 16dB 31.5dB -0.5 -0.4 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 0.4 0.5 0 5 10 15 20 25 30 Error (dB) Attenuation (dB) Bit Error versus Attenuation 850MHz 1950MHz 2700MHz 3300MHz
support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com. Typical Performance - Broadband Application Circuit OIP3 (dBm) Freq (GHz) Max Gain OIP3 versus Frequency Over Temperature +25C -40C +85C P1dB (dBm) Freq (GHz) Max Gain P1dB versus Frequency Over Temperature +25C -40C +85C NF (dB) Freq (GHz) Max Gain NF versus Frequency Over Temperature +25C +85C
support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com. Serial Port Interface: SPI Timing Diagram Programming example - 6-bit Specifications: SPI Timing Diagram Truth Table Control Bit Gain Relative to Maximum Gain D5 D4 D3 D2 D1 D0 111111 0 d B 111110 - 0 . 5 d B 111101 - 1 d B 111011 - 2 d B 110111 - 4 d B 101111 - 8 d B 011111 - 1 6 d B 000000 - 3 1 . 5 d B Parameter Limit Unit Comment t1 25 MHz max CLK Frequency t2 20 ns min CLK High t3 20 ns min CLK Low t4 5 ns min DATA to CLK Setup Time t5 5 ns min DATA to CLK Hold Time t6 30 ns min DATA Valid t7 5 ns min LE to CLK Setup Time t8 5 ns min CLK to LE Setup Time t9 10 ns min LE Pulse Width t10 20 ns max Output Set Control Voltage Table Power-up Programming Truth Table State V DD = +3V V DD = +5V PUP Attenuator Setting Low 0V to 0.8V 0V to 0.8V Low Attenuation at Max, 31.5dB High 2.0 to V DD 2.0 to VDD High Attenuation at Min, 0dB CLK DATA LE t2 t3 t4 t5 DOUT t10 MSB LSB D4 D3 D2 D0 D1D5 CLK DATA LE
support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com. Evaluation Board Schematic Evaluation Board Bill of Materials (BOM) Description Reference Designator Manufacturer Manufacturer's P/N RDA1005L w/USB Evaluation Board PCB Itself Dynamic Details (DDI) Toronto RDA1005L410(C) RDA1005L, 5.2 x 5.2 sq. mm, 32-Pin Laminate U1 RFMD RDA1005LSB CAP, 1000pF, 10%, 50V, X7R, 0402 C2, C9-C10 Murata Electronics GRM155R71H102KA01E CAP, 1µF, 10%, 16V, X7R, 0805 C4, C14 Murata Electronics GRM21BR71C105KA01K CAP, 1000pF, 10%, 50V, X7R, 0603 C5, C13 Murata Electronics GRM188R71H102KA01D CAP, 100pF, 5%, 50V, C0G, 0402 C1, C3, C6-C8, C12 Murata Electronics GRM1555C1H101JD01D IND, 68nH, 5%, W/W, 0603 L1 Coilcraft 1008CS-680XJLC RES, 1K, 1%, 1/16w, 0402 R1 Panasonic Industrial ERJ-2RKF1001 RES ARRAY, 4-ELEM, 1K, 5%, SMD 4 X 0402 RP2 KOA CN1E4KTTD102J CONN, SMA, END LNCH, FLT, 0.062" J1-J4 Emerson Network Power 142-0701-821 CONN, HDR, ST, PLRZD, 14-PIN, 0.100" P1 ITW Pancon MPSS100-14-C CONN, HDR, ST, PLRZD, 2-PIN, 0.100" P2 ITW Pancon MPSS100-2-C CONN, SKT, 24-Pin DIP, 0.600”, T/H P3 Aries Electronics Inc. 24-6518-10 MOD, USB TO SERIAL UART, SSOP-28 M1 [1] Future Technology Devices Int’l UM232R DNP or DNI C11, R2, RP3-RP4 N/A N/A Notes: [1] M1 is to be mounted into P3 with respect to the Pin 1 alignment of M1 and P3. LE DATA C LK RP2 VDD VD D HDR_1 X14 P/S CL K DATA LE GND GND1 GND1 GND GND GND GND GND SM A SM A AT TI N AM P OUT GND HDR_1 X2 100pF 100pF 1000pF 100pF 100pF C4 1uF C5 1000pF C7 100pF 1000pF C10 1000pF C12 100pF C13 1000pF C14 1uF 68nH 50 ohm Micro Str ip 39mil VCC PUP PUP VCC GND CB 212 TXD1 DT R#2 RT S#3 VI O4 RXD5 RI #6 GND7 DS R#8 DCD#9 CT S#10 CB 411 GND 24 SL D 13 US B 14 VCC 15 PU2 16 PU1 17 CB 3 18 3V3 19 RS T 20 VCC 21 CB 1 22 CB 0 23 CB 2 TXD DT R# RT S# VI O RXD RI # GND DS R# DCD# CT S# CB 4 GND SL D US B VCC PU2 PU1 CB 3 3V3 RS T VCC CB 1 CB 0 UM 232R DNP GND PUP LE DATA CL K AMPIN 1 GND 2 GND 3 ATTOUT 4 ACG1 5 ACG 2 6 ACG3 7 A CG4 8 ACG 59 ACG 610 GND11 AT TI N12 GND13 NC14 PUP15 NC16 V DD17 NC18 NC19 NC20 NC21 NC22 NC23 NC24 CL K 25 DATA 26 LE 27 GND 28 AM POUT /VCC 29 GND 30 GND 31 GND 32 RDA10 05L GND GND GND GNDGND GND
support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com. Evaluation Board Assembly Drawing
support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com. Pin Names and Descriptions Pin Name Description 1 AMPIN RF Amplifier Input. 2G N D RF/DC Ground Connection. 3G N D RF/DC Ground Connection. 4A T T O U T Digital Attenuator Output. 5A C G 1 Place external capacitor to ground. 6A C G 2 Place external capacitor to ground. 7A C G 3 Place external capacitor to ground. 8A C G 4 Place external capacitor to ground. 9A C G 5 Place external capacitor to ground. 10 ACG6 Place external capacitor to ground. 11 GND RF/DC Ground Connection. 12 ATTIN Digital Attenuator Input. 13 GND RF/DC Ground Connection. 14 NC No connection; leave open or ground. 15 PUP Power up programming pin. Low = Max attenuation setting at power up, -31.5dB High = Min attenuation setting at power up, 0dB 16 NC No Connection, leave open or GND. 17 VDD Supply Voltage. 18 NC No Connection, leave open or GND. 19 NC No Connection, leave open or GND. 20 NC No Connection, leave open or GND. 21 NC No Connection, leave open or GND. 22 NC No Connection, leave open or GND. 23 NC No Connection, leave open or GND. 24 NC No Connection, leave open or GND. 25 CLK Serial Clock. 26 DATA Serial Data. 27 LE Latch Enable. 28 GND RF/DC Ground Connection. 29 AMPOUT RF Amplifier Output. 30 GND RF/DC Ground Connection. 31 GND RF/DC Ground Connection. 32 GND RF/DC Ground Connection.
support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com. Package Drawing 5.2mm x 5.2mm Laminate Module Branding Diagram