RB715S3 CYSTEKEC | Alldatasheet

Document overview

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Technical content

Features

  • Small surface mounting type (SC-70/SOT-323).
  • Low reverse current and low forward voltage.
  • High reliability.
  • Pb-free lead plating and halogen-free package.

Applications

Low current rectification and high speed switching. Symbol Outline SOT-323 Anode Anode Common Cathode 1：Anode 2：Anode 3：Common cathode RB715S3

Ordering Information

Device Package Shipping Marking RB715S3 SOT-323 (Pb-free lead plating and halogen-free package) 3000 pcs / Tape & Reel 3D

CYStech Electronics Corp. Spec. No. : C345S3 Issued Date : 2010.10.19 Revised Date : Page No. : 2/6 RB715S3 CYStek Product Specification Absolute Maximum Ratings @TA=25℃ Parameters Symbol Min Max Unit Repetitive peak reverse voltage VRRM - 40 V Reverse voltage(DC) VR - 40 V Average rectified forward current IO - 30 mA Repetitive peak forward current (60Hz, 1 cyc) (Note 1) IFRM 200 mA Total power dissipation PD 200 mW Operating Junction and Storage Temperature Range Tj; Tstg -40 +125 °C Note : 1.Rating of per diode. Characteristics (Ta=25°C) Characteristic Symbol Condition Min. Typ Max. Unit Forward V oltage VF IF=1mA - - 370 mV Reverse Leakage Current IR VR=30V - - 0.5 μA Capacitance Between Terminals CT VR=1V , f=1MHz - 2 - pF Thermal Characteristics Symbol Parameter Conditions Value Unit Rth, j-a thermal resistance from junction to ambient Note 1 500 ℃/W Recommended Footprint

CYStech Electronics Corp. Spec. No. : C345S3 Issued Date : 2010.10.19 Revised Date : Page No. : 3/6 RB715S3 CYStek Product Specification Typical Characteristics Forward Current Derating Curve 100 120 0 25 50 75 100 125 150 Ambient Temperature---T A(℃) Percentage of Rated Forward Current---(%) Mounting on glass epoxy PCBs Forward Current vs Forward Voltage 0.01 0.1 100 0 0 . 10 . 20 . 30 . 40 Forward Voltage---V F(V) Forward Current---I F(mA) . 5 - 25℃ 25℃ 75℃ 125℃ Typ. pulse measurement Reverse Leakage Current vs Reverse Voltage 0.001 0.01 0.1 100 01 02 0 3 0 Reverse Voltage---VR(V) Reverse Leakage Current---IR(μA) Ta= 75℃ Ta= 25℃ Ta= 125℃ Ta=-25℃ Typ. pulse easurement Capacitance vs Reverse Voltage 02468 1 0 1 2 1 Reverse Voltage---V R(V) Capacitance between terminals---C T(pF) f=1MHz Ta=25℃

CYStech Electronics Corp. Spec. No. : C345S3 Issued Date : 2010.10.19 Revised Date : Page No. : 4/6 RB715S3 CYStek Product Specification Reel Dimension Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C345S3 Issued Date : 2010.10.19 Revised Date : Page No. : 5/6 RB715S3 CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : C345S3 Issued Date : 2010.10.19 Revised Date : Page No. : 6/6 RB715S3 CYStek Product Specification SOT-323 Dimension *: Typical Inches Marking: TE3D 3-Lead SOT-323 Plastic Surface Mounted Package CYStek Package Code: S3 Style : Pin 1. Anode 2.Anode 3. Common Cathode He E A Q Lp e bp D W B v A Z detail Z A C θ 0 12 scale mm Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:

  • Lead: Pure tin plated.
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.