RB0540C2 CYSTEKEC | Alldatasheet

Document overview

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  • PDF pages: 6

Technical content

Features

  • High current capability, low forward voltage drop
  • High surge current capability
  • Guardring for over voltage protection
  • Low power loss, high efficiency
  • Ultra high-speed switching
  • Low profile surface mounted package in order to minimize board space Mechanical data
  • Case : Molded plastic, SC-79/SOD523.
  • Epoxy : UL94-V0 rated flame retardant
  • Terminals : Plated terminals, solderable per MIL-STD-750 method 2026.
  • Polarity : Indicated by cathode band.
  • Mounting position : Any. Symbol Outline RB0540C2

Ordering Information

(Pb-free lead plating and halogen-free package) 8000 pcs / tape & reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T5 : 8000 pcs / tape & reel, 7” reel Product rank, zero for no rank products Product name

CYStech Electronics Corp. Spec. No. : C291C2 Issued Date : 2011.03.15 Revised Date : 2014.03.07 Page No. : 2/6 RB0540C2 CYStek Product Specification Absolute Maximum Ratings (TA=25℃, unless otherwise noted) Parameters Conditions Symbol Min Typ Max Units Repetitive peak reverse voltage VRRM 40 V RMS voltage VRMS 28 V Continuous reverse voltage VR 40 V IO 0.5 Forward rectified current Single phase half wave, 60Hz @TJ=25°C IF(AV) 1 A Forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC method) IFSM 15 A Total Device Dissipation TA=25°C (Note) PD 200 mW Thermal resistance Junction to Ambient (Note) RθJA 625 °C/W Storage temperature range Tstg -65 175 °C Operating junction temperature range Tj -55 125 °C Note : When device mounted on FR-5 PCB with minimum pad. Characteristics (TA=25°C) Characteristic Symbol Condition Min. Typ Max. Unit VR IR=600μA 40 - - V VF 1 IF=100mA - - 370 Forward V oltage VF 2 IF=500mA - - 500 mV IR 1 VR=20V - - 100 μA IR 2 VR=40V - - 500 μA Reverse Leakage Current IR 3 VR=40V , TA=75°C - - 10 mA Capacitance Between Terminals CT VR=4V , f=1MHz - 18.3 - pF

CYStech Electronics Corp. Spec. No. : C291C2 Issued Date : 2011.03.15 Revised Date : 2014.03.07 Page No. : 3/6 RB0540C2 CYStek Product Specification Characteristic Curves Forward Current Derating Curve 0.1 0.2 0.3 0.4 0.5 0.6 0 25 50 75 100 125 150 175 Ambient Temperature---T A(℃) Average Forward Current---Io(A)resistive or inductive load Maximum Non-Repetitive Forward Surge Current 1 10 100 Number of Cycles at 60Hz Peak Forward Surge Current---IFSM(A) Tj=25℃, 8.3ms Single Half Sine Wave, JEDEC method Forward Current vs Forward Voltage 100 1000 0 0.2 0.4 0.6 Forward Voltage---VF(V) Instantaneous Forward Current---IF(mA) Pulse width=300μs, 1% Duty cycle Tj=25℃ Tj=75℃ Tj=125℃ Junction Capacitance vs Reverse Voltage 100 0.1 1 10 Reverse Voltage---V R(V) Junction Capacitance---C J(pF) Tj=25℃, f=1.0MHz Reverse Leakage Current vs Reverse Voltage 100 1000 10000 0 20 40 60 80 100 120 140 Percent of Rated Peak Reverse Voltage---(%) Reverse Leakage Current---I R(μA) Tj=75℃ Tj=25℃

CYStech Electronics Corp. Spec. No. : C291C2 Issued Date : 2011.03.15 Revised Date : 2014.03.07 Page No. : 4/6 RB0540C2 CYStek Product Specification Reel Dimension Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C291C2 Issued Date : 2011.03.15 Revised Date : 2014.03.07 Page No. : 5/6 RB0540C2 CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : C291C2 Issued Date : 2011.03.15 Revised Date : 2014.03.07 Page No. : 6/6 RB0540C2 CYStek Product Specification SOD-523 Dimension 1 2 Style : Pin 1. Cathode 2. Anode 2-lead SOD-523 Plastic Package CYStek Package Code : C2 Marking Code : 1 2 C5 *: Typical Millimeters Inches Millimeters Inches DIM Min. Max. Min. Max. DIM D 0.750 0.850 0.030 0.033 θ 7° REF 7° REF Notes: 1.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 2.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:

  • Lead: Pure tin plated.
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.