QH05TZ600_V01 POWER-INTEGRATIONS | Alldatasheet

Document overview

  • Manufacturer or author: Peter
  • PDF pages: 9

Technical content

Features

  • Low QRR, low IRRM, low tRR
  • High dIF/dt capable (1000 A / µs)
  • Soft recovery Benefits
  • Increases efficiency
  • Eliminates need for snubber circuits
  • Reduces EMI filter component size & count
  • Enables extremely fast switching Absolute Maximum Ratings Absolute maximum ratings are the values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Symbol Parameter Conditions Rating Units VRRM Peak repetitive reverse voltage TJ = 25 °C 600 V IF(AVG) Average forward current TJ = 150 °C, TC = 109 °C 5 A IFSM Non-repetitive peak surge current 60 Hz, ½ cycle, TC = 25 °C 50 A IFSM Non-repetitive peak surge current ½ cycle of t = 28 µs Sinusoid, TC = 25 °C 350 A TJ Operating junction temperature range -55 to 150 °C TSTG Storage temperature -55 to 150 °C Lead soldering temperature Leads at 1.6 mm from case, 10 sec 300 °C VISOL Isolation voltage (leads-to-tab) AC, TO-220 2500 V VISOL Isolation voltage (leads-to-tab) AC, TO-263 1500 V PD Power dissipation TC = 25 °C 36.8 W Pin Assignment K K A K K K K A A KA K NC NC C NC C

Rev 1.3 11/15 QH05TZ600, QH05BZ600 Dimensional Outline Drawings TO-220AC Millimeters Dim MIN MAX A 4.32 4.70 A1 1.14 1.40 A2 2.03 2.79 C 0.34 0.610 D 9.65 10.67 E 2.49 2.59 E1 4.98 5.18 F 0.508 1.016 F1 1.14 1.78 H 14.71 16.51 H1 5.84 6.795 H2 8.40 9.00 H3 3.53 3.96 H4 2.54 3.05 L 12.70 14.22 L1 - 6.35

Rev 1.3 11/15 QH05TZ600, QH05BZ600 Dimensional Outline Drawings TO-263AB Millimeters Dim MIN MAX A 4.40 4.70 A1 0.00 0.25 A2 2.59 2.79 b 0.77 0.90 b2 1.23 1.36 c2 1.22 1.32 D 9.05 9.25 E 10.06 10.26 e 2.54 BSC 2.54 BSC H 14.70 15.50 L 2.00 2.60 L1 1.17 1.40 L2 – 1.75 L3 0.25 BSC 0.25 BSC L4 2.00 BSC 2.00 BSC Θ 0° 8° Θ1 5° 9° Θ2 1° 5° Mechanical Mounting Method Maximum Torque / Pressure specification Screw through hole in package tab 1 Newton Meter (nm) or 8.8 inch-pounds (lb-in) Clamp against package body 12.3 kilogram-force per square centimeter (kgf/cm2) or 175 lbf/in2

Rev 1.3 11/15 QH05TZ600, QH05BZ600 Footprint and Solder Pad Dimensions Pad Dimensions in mm: TO-263AB Soldering time and temperature: This product has been designed for use with high- temperature, lead -free solder. The component leads can be subjected to a maximum temperature of 300 °C, for up to 10 seconds. See Application Note AN -303, for more details.

Ordering Information

Part Number Package Packing QH05TZ600 TO-220AC 50 units/tube QH05BZ600 TO-263AB 800 units/reel The information contained in this document is subject to change without notice.

Rev 1.3 11/15 QH05TZ600, QH05BZ600 Revision Notes Date

1.0 Released by Qspeed 01/10

1.1 Converted to Power Integrations Document 01/11

1.2 Added QH05BZ600 02/13

1.3 Updated with new Brand Style. Added footprint and solder pad dimension for TO-263AB package. 11/15

Rev 1.3 11/15 QH05TZ600, QH05BZ600 For the latest updates, visit our website: www.power.com Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS. Patent Information The products and applications illustrated herein (including transformer construction and circuits’ external to the products) may be covered by one or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power Integrations. A complete list of Power Integrations’ patents may be found at www.power.com. Power Integrations grants its customers a license under certain patent rights as set forth at http://www.power.com/ip.htm. Life Support Policy POWER INTEGRATIONS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF POWER INTEGRATIONS. As used herein: 1. A Life support device or system is one which, (i) is intended for surgical implant into the body, or (ii) supports or sustains life, and (iii) whose failure to perform, when properly used in accordance with instructions for use, can be reasonably expected to result in significant injury or death to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. The PI Logo, TOPSwitch, TinySwitch, LinkSwitch, LYTSwitch, InnoSwitch, DPA-Switch, PeakSwitch, CAPZero, SENZero, LinkZero, HiperPFS, HiperTFS, HiperLCS, Qspeed, EcoSmart, Clampless, E-Shield, Filterfuse, FluxLink, StackFET, PI Expert and PI FACTS are trademarks of Power Integrations, Inc. Other trademarks are property of their respective companies. ©Copyright 2015 Power Integrations, Inc. Power Integrations Worldwide Sales Support Locations WORLD HEADQUARTERS

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