Q65110A3764

LAP47B AMSCO | Alldatasheet

Document overview

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• PDF pages: 23

Technical content

1 Version 1.2 | 2019-07-16 Discontinued Produktdatenblatt | Version 1.1 www.osram-os.com

Applications

PointLED ® With a diameter of just 2 mm, the PointLED is one of the smallest packages in its class and achieves high luminous efficacies. Due to its round and flat package, measuring only 0.775 mm high, it is ideal for application where space is a sensitive issue. —Cluster, Button Backlighting —Electronic Equipment —Gaming, Amusement, Gambling —Transportation, Plane, Ship —White Goods Features: —Package: white SMT package, colorless clear resin —Chip technology: InGaAlP —Typ. Radiation: 120° (Lambertian emitter) —Color: λdom = 617 nm (● amber) —Corrosion Robustness Class: 3B —ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM)

2 Version 1.2 | 2019-07-16 Discontinued

Ordering Information

Type Luminous Intensity 1) Mounting methode Ordering Code IF = 30 mA Iv LA P47B-S2U1-24-1 224 ... 560 mcd Reverse Q65110A5329 LA P47B-T2V1-24-1 355 ... 900 mcd Reverse Q65110A3764 LA P47B-T2V1-24-1-F 355 ... 900 mcd Top Q65110A1749

3 Version 1.2 | 2019-07-16 Discontinued Maximum Ratings Parameter Symbol Values Operating Temperature Top min. max. -40 °C 100 °C Storage Temperature Tstg min. max. -40 °C 100 °C Junction Temperature T j max. 125 °C Forward current TS = 25 °C IF max. 60 mA Surge Current t ≤ 10 µs; D = 0.1 ; TS = 25 °C IFS max. 100 mA Reverse voltage 2) TS = 25 °C VR max. 12 V ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM) VESD 2 kV

4 Version 1.2 | 2019-07-16 Discontinued Characteristics IF = 30 mA; TS = 25 °C Parameter Symbol Values Peak Wavelength λpeak typ. 624 nm Dominant Wavelength 3) IF = 30 mA λdom min. typ. max. 612 nm 617 nm 624 nm Spectral Bandwidth at 50% Irel,max ∆λ typ. 18 nm Viewing angle at 50% IV 2φ typ. 120 ° Forward Voltage 4) IF = 30 mA VF min. typ. max. 1.80 V 2.10 V 2.40 V Reverse current 2) VR = 12 V IR typ. max. 0.01 µA 10 µA Temperature Coefficient of Peak Wavelength -10°C ≤ T ≤ 100°C TCλpeak typ. 0.15 nm / K Temperature Coefficient of Dominant Wavelength -10°C ≤ T ≤ 100°C TCλdom typ. 0.07 nm / K Temperature Coefficient of Forward Voltage -10°C ≤ T ≤ 100°C TCVF typ. -3.7 mV / K Real thermal resistance junction/ambient 5)6) RthJA real max. 420 K / W Real thermal resistance junction/solderpoint 5) RthJS real max. 200 K / W

5 Version 1.2 | 2019-07-16 Discontinued Brightness Groups Group Luminous Intensity 1) Luminous Intensity. 1) Luminous Flux 7) IF = 30 mA IF = 30 mA IF = 30 mA min. max. typ. Iv Iv ΦV S2 224 mcd 280 mcd 800 mlm T1 280 mcd 355 mcd 1000 mlm T2 355 mcd 450 mcd 1200 mlm U1 450 mcd 560 mcd 1500 mlm U2 560 mcd 710 mcd 1900 mlm V1 710 mcd 900 mcd 2400 mlm Forward Voltage Groups Group Forward Voltage 4) Forward Voltage 4) IF = 30 mA IF = 30 mA min. max. VF VF 3A 1.80 V 1.95 V 3B 1.95 V 2.10 V 4A 2.10 V 2.25 V 4B 2.25 V 2.40 V Wavelength Groups Group Dominant Wavelength 3) Dominant Wavelength 3) IF = 30 mA IF = 30 mA min. max. λdom λdom 2 612 nm 616 nm 3 616 nm 620 nm 4 620 nm 624 nm

6 Version 1.2 | 2019-07-16 Discontinued Group Name on Label Example: S2-2-3A Brightness Wavelength Forward Voltage S2 2 3A

7 Version 1.2 | 2019-07-16 Discontinued Relative Spectral Emission 7) Irel = f (λ); IF = 30 mA; TS = 25 °C OHL00013 400 100 450 500 550 600 650 700nm Irel λ Vλ amberyellow Radiation Characteristics 7) Irel = f (ϕ); TS = 25 °C 0.2 0.4 1.0 0.8 0.6 ϕ 1.0 0.8 0.6 0.4 50˚ 60˚ 70˚ 80˚ 90˚ 100˚

8 Version 1.2 | 2019-07-16 Discontinued Forward current 7), 8) IF = f(VF); TS = 25 °C OHL00590 10-2 10-1 100 101 FV 102 FI mA Relative Luminous Intensity 7), 8) Iv/Iv(30 mA) = f(IF); TS = 25 °C mA OHL00874 10 010 101 IV V (30 mA)I IF 102

9 Version 1.2 | 2019-07-16 Discontinued Relative Luminous Intensity 7) Iv/Iv(25 °C) = f(Tj); IF = 30 mA OHL00740 -40 ˚C T (25 ˚C)IV IV 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 2.0 -20 0 20 40 60 100 j

10 Version 1.2 | 2019-07-16 Discontinued Max. Permissible Forward Current IF = f(T) 402000 1008060 ˚C T IF mA OHL02161 TSTA AT TS temp. solder point temp. ambient Permissible Pulse Handling Capability IF = f(tp); D: Duty cycle; TA = 25 °C OHL02164 10-5 pt FI 10-4 10-3 10-2 10-1 100 1010 A 210s D tP T Pt IF 0.01 0.05 0.1 0.005 0.02 D = 0.02 0.04 0.06 0.08 0.10 0.12 0.16 0.5 0.2 Permissible Pulse Handling Capability IF = f(tp); D: Duty cycle; TA = 85 °C OHL02163 10-5 pt FI 10-4 10-3 10-2 10-1 100 1010 A 210s D tP T Pt IF 0.01 0.05 0.2 0.1 0.005 0.02 0.5 D = 0.02 0.04 0.06 0.08 0.10 0.12 0.16

11 Version 1.2 | 2019-07-16 Discontinued Dimensional Drawing 9) Further Information Approximate Weight: 6.0 mg Corrosion test: Class: 3B Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC 60068-2-43)

12 Version 1.2 | 2019-07-16 Discontinued Recommended Solder Pad 9) Recommended Solder Pad 9) For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning.

13 Version 1.2 | 2019-07-16 Discontinued Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 00 s OHA04525 100 150 200 250 300 50 100 150 200 250 300 t T St t Pt Tp240 ˚C 217 ˚C 245 ˚C 25 ˚C L Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C 2 3 K/s Time tS TSmin to TSmax tS 60 100 120 s Ramp-up rate to peak*) TSmax to TP 2 3 K/s Liquidus temperature TL 217 °C Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 10 20 30 s Ramp-down rate* TP to 100 °C 3 6 K/s Time 25 °C to TP 480 s All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

14 Version 1.2 | 2019-07-16 Discontinued Taping 9) Taping 9)

15 Version 1.2 | 2019-07-16 Discontinued Tape and Reel 10) Reel Dimensions A W Nmin W1 W2 max Pieces per PU 180 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 3000 330 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 12000

16 Version 1.2 | 2019-07-16 Discontinued Barcode-Product-Label (BPL) Dry Packing Process and Materials 9) OHA00539 OSRAM Moisture-sensitive label or print Barcode label Desiccant Humidity indicator Barcode label OSRAM Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. WET Do not eat. Comparator check dot parts still adequately dry. examine units, if necessary examine units, if necessary 15% 10%bake units bake units If wet, change desiccant If wet, Humidity Indicator MIL-I-8835 If wet, M oisture Level 3 Floor tim e 168 Hours M oisture Level 6 Floor tim e 6 Hours a) Hum idity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package 2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 m onths at < 40 ˚C and < 90% relative hum idity (RH). M oisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) M ounted within b) Stored at body tem 3. Devices require baking, before m ounting, if: Bag seal date M oisture Level 1 M oisture Level 2 M oisture Level 2a4. If baking is required, b) 2a or 2b is not m et. Date and tim e opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor tim e see below If blank, see bar code label Floor tim e > 1 Year Floor tim e 1 Year Floor tim e 4 W eeks10% RH. M oisture Level 4 M oisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag contains CAUTION Floor tim e 72 Hours Floor tim e 48 Hours Floor tim e 24 Hours 30 ˚C/60% RH. LEVEL If blank, see bar code label Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.

17 Version 1.2 | 2019-07-16 Discontinued Schematic Transportation Box 9) OHA02044 PACKVAR:R077Additional TEXT P-1+Q-1 Multi TOPLED Muster OSRAM Opto Semiconductors (6P) BATCH NO (X) PROD NO (9D) D/ 11(1T) LO T NO 210021998 123GH1234 0 24 5 (Q)QTY : 2000 014 (G) GROUP

260 C RT240 C

R 220 C R ML Bin3 :Bin2: Q-1-2 Bin1: P-1-20 LSY T676 2 2a Temp ST R18 DEMY PACKVAR: R077Additional TEXT P-1+Q-1 Multi TOPLED Muster OSRAM Opto Semiconductors (6P) BATCH NO: (X) PROD NO: (9D) D/C: 11(1T) LOT NO: 210021998 123GH1234 0 24 5 (Q)QTY: 2000 0144 (G) GROUP:

260 C RT

240 C R

220 C R

MLBin3:Bin2: Q-1-20 Bin1: P-1-20 LSY T676 2 2a Temp ST R18 DEMY OSRAM Packing Sealing label Barcode label M oisture Leve l 3 Floo r tim e 1

68 Hours

a) Hum idity Indicator Card is > 10% when re ad at 23 ˚C ± 5 ˚C , or reflow, vapor ha se ref low, or equiva lent proce ssing (peak packa ge 2. After this bag is opened, device s that will be su bjecte d to infrared 1. Sh elf life in sea led bag: 24 m on th s at 40 ˚C and < 90% relative hu m idity (R M oisture Le vel 5a at factory co nditions of (if blank, seal date is ide ntica l with da te co de) M ounte d within b) St ored at body tem Devic es re quire baking, bef ore m ounting, if: Bag seal date M oisture Level 1 M oisture Leve l 2 M oisture Level 2a4. If baking is require b) 2a or 2b is not m et. Dat e and tim e op ened: reference IPC/JEDEC J-S TD-033 for bake procedur Floo r tim e se e below If blan k, see ba r code label Floo r tim e >

1 Year

eeks10% RH. M oisture Le ve l 4 M oisture Level 5 ˚C). OPT O SE MICONDUCTOR S MO ISTURE SE NSITIVE This bag contains CA UTIO N Floor tim e 72 Hours Floor tim e 48 Hours Floor time

24 Hours

/60% RH LE VE L If blank, see bar code label Barcode label Dimensions of Transportation Box Width Length Height 200 ± 5 mm 195 ± 5 mm 30 ± 5 mm 352 ± 5 mm 352 ± 5 mm 33 ± 5 mm

18 Version 1.2 | 2019-07-16 Discontinued Type Designation System L A P 4 7 B Chip Technology 3: standard InGaN 6: standard InGaAlP B: HOP 2000 F: Thinfilm InGaAlP G: ThinGaN (Thinfilm InGaN) (Subcon: Sapphire) K: InGaAlP low current Encapsulant Type / Lens Properties 7: colorless clear or white volume conversion (resin encapsulation) S: Silicone (with or without diffuser) Wavelength Emission Color Color coordinates according (λdom typ.) CIE 1931/Emission color: T: 528 nm true green W: white Y: 587 nm yellow CB: color on demand blue A: 617 nm amber B: 470 nm blue R: 625 nm red O: 606 nm orange P: 560 nm pure green S: 633 nm super red G: 570 nm green L: Light emitting diode Package Type P: POINTLED Lead / Package Properties 4: through hole W: folded leads and UX:3, Ag-LF, w/o TO2 jetting

19 Version 1.2 | 2019-07-16 Discontinued Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for expo- sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita- tion, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There- fore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. For further application related information please visit www.osram-os.com/appnotes

20 Version 1.2 | 2019-07-16 Discontinued Disclaimer Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS website. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product and functional safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. OSRAM OS products are not qualified at module and system level for such application. In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi- nate the customer-specific request between OSRAM OS and buyer and/or customer.

21 Version 1.2 | 2019-07-16 Discontinued Glossary 1) Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of k = 3). 2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera- tion is not allowed. 3) Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal repro- ducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k = 3). 4) Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage factor of k = 3). 5) Thermal Resistance: Rth max is based on statistic values (6σ). 6) Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size ≥ 5 mm² per pad) 7) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic- es, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could dif- fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 8) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ- ences between single devices within one packing unit. 9) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 10) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.

22 Version 1.2 | 2019-07-16 Discontinued

Revision History

1.2 2019-07-16 Discontinued

23 Version 1.2 | 2019-07-16 Discontinued Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.