PT481E00000F SHARP | Alldatasheet

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1 Sheet No.: D1-A01301EN Date: November 30, 2007 ©SHARP Corporation PT481E00000F PT481E00000F Pale Blue Transparent Resin, Narrow Angle, Darlington Phototransistor Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. ■ Features 1. Side view detection package 2. Molded plastic with pale blue transparent resin lens 3. Peak sensitivity wavelength: 800 nm (TYP.) 4. High sensitivity (I C: 10 mA @ Ee = 0.1 mW/cm2) 5. Narrow acceptance angle (±13° TYP.) 6. Lead-free and RoHS directive compliant ■ Agency Approvals/Compliance 1. Compliant with RoHS directive (2002/95/EC) 2. Content information about the six substances specified in “Management Methods for Control of Pollution Caused by Electronic Information Prod- ucts Regulation” (popular name: China RoHS) (Chinese: ); refer to page 7. ■ Applications 1. Optoelectronic switches 2. Automatic stroboscopes 3. Mechanical Systems 4. Office automation equipment 5. Audio visual equipment

Sheet No.: D1-A01301EN PT481E00000F ■ External Dimensions R0.8 ±0.1 2-C0.5 2.15 2.95 (6°) 1.6 (6°) (6°) (6°) (6°)(6°) 2.8 (2.54) 3.0 0.15 0.2 MAX. Resin burr 0.5 MAX. Gate burr1.0 MAX. resin burr 0.5 MIN. 17.5 1.4 (1.7) 1.5 4.0 +1.5 -1.0 2 - 0.4 +0.3 -0.1 0.5 0.75 1.15 (60°) 2 - 0.45 +0.3 -0.1 2 - 0.8 (4°) 0.15 MAX. (4°) (4°)(4°) φ1.5 E. PIN R0.5 1 2 1 2 Emitter Collector No. Name Pin Arrangement Terminal connection NOTES: 1. Units: mm 2. Unspecified tolerence: ±0.2 mm 3. ( ): Reference dimensions 4. Package: Light blue transparent epoxy resin 5. Mold burrs (0.05 mm MAX.) are not included in outline dimensions 6. Resin protrusion: 1.0 mm MAX. 7. Lead step is 1.4 mm MAX. from the part’s resin

Sheet No.: D1-A01301EN PT481E00000F ■ Absolute Maximum Ratings *1 5 s (MAX.) no closer than 1.4 mm from resin edge. ■ Electro-optical Charactertistics *1 Ee: Irradiance by CIE standard light source A (tungsten lamp) Parameter Symbol Rating Unit Collector-emitter voltage V CEO 35 V Emitter-collector voltage V ECO 6V Collector current I C 50 mA Collector power dissipation P C 75 mW Operating temperature Topr -25 to +85 °C Storage temperature Tstg -40 to +85 °C Soldering temperature *1 Tsol 260 °C Parameter Symbol Conditi ons *1 MIN. TYP. MAX. Unit Collector current I C Ee = 0.1 mW/cm2, VCE = 2 V 1.5 10 25 mA Dark current I CEO Ee = 0, VCE = 10 V – 1.0 1000 nA Collector-emitter saturation voltage V CE(sat) Ee = 1 mW/cm 2, Ic = 2.5 mA – 0.7 1.0 V Collector-emitter breakdown voltage BV CEO IC = 0.1 mA, Ee = 0 35 – – V Emitter-collector breakdown voltage BV ECO IE = 0.01 mA, Ee = 0 6 – – V Peak sensitivity wavelength λp – – 800 – nm Response time (Rise) tr VCE = 2 V, IC = 10 mA, RL = 100 Ω –8 0 – µ s Response time (Fall) tf – 70 – µs Fig. 1 Collector Po wer Dissipation vs. Ambient Temperature 0-25 0 25 Ambient temperature Ta (°C) Collector power dissipation PC (mW) 50 75 851 0 0 Fig. 2 Spectral S ensitivity (TYP.) 100 Ta = 25°C Wavelength λ(nm) 400 500 600 700 800 900 1000 1100 Relative sensitivity (%) (Ta = 25°C) (Ta = 25°C)

Sheet No.: D1-A01301EN PT481E00000F Fig. 3 Collector Dark Current vs. Ambient Temperature Fig. 4 Collector Cu rrent vs. Irradiance Collector dark c urrent I CEO (A) VCE = 10 V 10-6 10-8 10-7 10-9 10-10 10-11 10-12 10-13 02 5-25 Ambient temperature Ta (°C) 50 75 100 10-1 Irradiance Ee (mW/cm2) Collector current IC (mA) VCE = 2 V Ta = 25°C Fig. 5 Relative Coll ector Current vs. Ambient Temperature Fig. 6 Collector Current vs. Collector-Emitter Voltage 175 150 125 100 50-25 0 25 Ambient temperature Ta (°C) Relative collector current (%) 50 75 100 VCE = 2 V Ee = 0.1 mW/cm2 Collector current IC (mA) Collector-emitter voltage VCE (V) 23456 Ta = 25°C Pc (MAX.) 0.06 mW/cm2 0.04 mW/cm2 0.02 mW/cm2 0.08 mW/cm2 0.1 mW/cm2 0.15 mW/cm Ee = 0.2 mW/cm2

Sheet No.: D1-A01301EN PT481E00000F Fig. 7 Response Time vs. Load Resistance Fig. 8 Test Circuit for Response Time Fig. 9 Collector-to- Emitter Saturation Voltage vs. Irradience Response time (/g109 s) VCE = 2 V IC = 10 mA Ta = 25°C 100 Load resistance RL (/g87 ) 1000 100 5000 1000 tr tf td ts Output Output VCC RL Input tftr td ts 90% 10% 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Irradiance Ee (mW/cm 0.05 0.2 Collector-emitter saturation voltage VCE(sat) (V) IC = 0.5 mA 1 mA 2 mA 5 mA 10 mA 20 mA (Ta = 25°C) Fig. 10 Relative Output vs Distance Fig. 11 Sensitivity vs. Axis (TYP.) Relative output (%) 11 0 Emitter: GL480E00000F 100 Distance between emitter and detector (mm) Angular displacement θ Relative sensitivity (%) -30° -40° -50° -60° -70° -80° -90° +30° (Ta = 25°C) +40° +50° +60° +70° +80° +90° 100 Graph data is for reference only and is not guaranteed data.

Sheet No.: D1-A01301EN PT481E00000F ■ Design Notes 1. This product is not designed to resist el ectromagnetic and ionized-particle radiation. ■ Manufacturing Guidelines

  • Soldering Instructions 1. Sharp does not recommend soldering this part using pre heat or solder reflow methods. Leads on this part are pre-coated with lead-free solder. See Figure 12. 2. If hand soldering, use temperatures ≤260° for ≤5 seconds. 3. When mounting this device, care should be taken to prevent any boundary exfoliation (pad lifting) between the solder, the pad, and the circuit board. 4. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack- age due to the PCB flexing during the soldering process.
  • Cleaning Instructions 1. Confirm this device's resistance to process chemicals be fore use, as certain process chemicals may affect the optical characteristics. 2. Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less. 3. Ultrasonic cleaning: The effect upon devices varies d ue to cleaning bath size, ultrasonic power output, cleaning time, PCB size and device mounting circumstances. Sharp recommends testing using actual production condi- tions to confirm the harmlessness of the ultrasonic cleaning methods. 4. Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol. Fig. 12 Soldering Area 1.4 mm Solderable

Sheet No.: D1-A01301EN PT481E00000F ■ Presence of ODCs (RoHS Compliance) This product shall not contain the following materials, and they are not used in the production process for this product:  Regulated substances: CFCs, Halon, Carbon tetrachloride, 1,1,1-Trichloroethane (Methylchloroform). Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).  Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE).  Content information about the six substances specified in “Management Methods for Control of Pollution Caused by Electronic Information Products Regulation” (Chinese: ) NOTE: ✓ indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the conc entration limit requirement as described in SJ/T 11363-2006 standard. Category Toxic and Hazdardous Substances Lead (Pb) mercury (Hg) Cadmium (Cd) Hexavalent chromiun (Cr6+) Polybrominated biphenyls (PBB) Polybrominated diphenyl ethers (PBDE)

Sheet No.: D1-A01301EN PT481E00000F ■ Packing Specifications 1. Parts are packed in a plastic zip-top bag, with a quantity of 1000 pieces per bag. 2. Bags are secured in a box as shown in Figure 13. 3. Product mass: 0.09 g (approximately) Fig. 13 Packing Composition Inner packing Plastic zipper bag with products (2 bags) Cellophane tape Packing case Model No., Quantity, and Lot No. Cushioning material (2 sheets) Plastic zipper bag Product (1000 pcs) NOTES: 1. Inner packing material : Plastic zipper Bag (Polyethylene) 2. Quantity: 1000 pcs/bag NOTES: 1. Outer material : Packing case (Corrugated cardboard), Cushioning material (Urethane), Cellophane tape 2. Quantity: 2000 pcs/ box 3. Regular packaged mass: Approximately 270 g 4. Indication: Model No., Quantity, and Lot No. Outer packing Cushioning material (2 sheets)

■ Important Notices

  • The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP’s devices.
  • Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristi cs, data materials, struc- ture, and other contents described herein at any time without notice in order to im prove design or reliability. Manufacturing locations are also subject to change without notice.
  • Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment (terminal) --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to en sure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliabilty such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connec- tion with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment (trunk lines) --- Nuclear power control equipment --- Medical and other life support equipment (e.g. scuba)
  • If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices.
  • This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be repro- duced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party.
  • Contact and consult with a SHARP representative if there are any questions about the contents of this pub- lication. Sheet No.: D1-A01301EN PT481E00000F