PC354N1TJ00F SHARP | Alldatasheet

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  1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC354) 2. Package resin : UL flammability grade (94V-0) ■ Features ■ Agency approvals/Compliance 1. Hybrid substrates that require high density mounting. 2. Programmable controllers ■ Applications Mini-flat Package, AC Input Photocoupler 1. 4-pin Mini-flat package 2. Double transfer mold package (Ideal for Flow Soldering) 3. AC input type 4. High collector-emitter voltage (V CEO : 80V) 5. High isolation voltage between input and output (Viso(rms) : 3.75kV) 6. Lead-free and RoHS directive compliant ■ Description PC354NJ0000F Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4-pin Mini-flat package. Input-output isolation voltage(rms) is 3.75kV. Collector-emitter voltage is 80V and CTR is 20% to 400% at input current of ±1mA. Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. PC354NJ0000F Series Sheet No.: D2-A00602EN Date Jun. 30. 2005 © SHARP Corporation

■ Internal Connection Diagram AnodeAnode/Cathode Cathode/Anode Emitter Collector Sheet No.: D2-A00602EN ■ Outline Dimensions (Unit : mm) 4 3 1 2 4.4±0.2 5.3±0.3 2.6±0.20.1±0.1 3.6±0.3 2.54±0.25 0.4±0.1 0.5+0.4 −0.2 7.0+0.2 −0.7 Epoxy resin 45˚ 0.2±0.05 354 Primary side mark SHARP mark "S" Rank mark Date code Factory identification mark PC354NJ0000F Series Product mass : approx. 0.1g Plating material : SnCu (Cu : TYP. 2%)

Date code (2 digit) Rank mark Refer to the Model Line-up table A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 Mark A B C D E F H J K L M N Mark P R S T U V W X A B C Mark O N D Month January February March April May June July August September October November December A.D 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012

  • ·· 2nd digit Month of production 1st digit Year of production Factory identification mark Factory identification Mark no mark Country of origin Japan Indonesia China * This factory marking is for identification purpose only. Please contact the local SHARP sales representative to see the actual status of the production. repeats in a 20 year cycle Sheet No.: D2-A00602EN PC354NJ0000F Series

Sheet No.: D2-A00602EN ■ Electro-optical Characteristics Parameter Conditions Forward voltage Terminal capacitance Collector dark current Collector-emitter breakdown voltage Emitter-collector breakdown voltage Transfer charac- teristics Collector current Collector-emitter saturation voltage Isolation resistance Floating capacitance MIN. 0.2 5×10 TYP. 1.2 0.1 1×1011 0.6 MAX. 1.4 250 100 4.0 0.2 1.0 Unit V pF nA V mA V Ω pF V µs µs Symbol V F Ct ICEO BVCEO BVECO IC VCE (sat) RISO tr tf Cf Response time Rise time Fall time Input Output IF=±20mA V=0, f=1kHz VCE=50V, IF=0 IC=0.1mA, IF=0 IE=10µA, IF=0 IF=±1mA, VCE=5V IF=±20mA, IC=1mA V=0, f=1MHz VCE=2V, IC=2mA, RL=100Ω DC500V, 40 to 60%RH (Ta=25˚C) ■ Absolute Maximum Ratings (Ta=25˚C) Parameter Symbol Unit Input Forward current mA *1 Peak forward current A Power dissipation mW Output Collector-emitter voltage V Emitter-collector voltage V Collector current mA Collector power dissipation mW Total power dissipation mW *2 Isolation voltage Operating temperature ˚C Storage temperature ˚C *3 Soldering temperature IF IFM P VCEO VECO IC PC Ptot Viso (rms) Topr Tstg Tsol ˚C *1 Pulse width≤100µs, Duty ratio : 0.001 *2 40 to 60%RH, AC for 1 minute, f=60Hz *3 For 10s Rating ±50 150 170 −30 to +100 −40 to +125 260 3.75 kV PC354NJ0000F Series

Sheet No.: D2-A00602EN ■ Model Line-up IC [mA] (IF=±1mA, VCE=5V, Ta=25˚C) with or without A 0.2 to 4.0 0.5 to 1.5 Rank mark PC354NJ0000F PC354N1J000F PC354NTJ000F PC354N1TJ00F 3 000 pcs/reel Taping 750 pcs/reelPackage Model No. Please contact a local SHARP sales representative to inquire about production status. PC354NJ0000F Series

Sheet No.: D2-A00602EN 300 250 200 150 100 170 05 0 10025 Total power dissipation Ptot (mW) −30 Ambient temperature Ta (˚C) Fig.4 Total Power Dissipation vs. Ambient TemperatureForward current IF (mA) Forward voltage VF (V) 50˚C 25˚C 0˚C 0 0.5 1 1.5 2 2.5 3 3.5 100 −25˚C Ta=75˚C Fig.6 Forward Current vs. Forward Voltage Duty ratio 100 Peak forward current IFM (mA) 10−3 10−2 10−1 Pulse width≤100µs Ta=25˚C 10 000 1 000 Fig.5 Peak Forward Current vs. Duty Ratio 02 5 5 0 7 5 100 125 Forward current IF (mA) −30 Ambient temperature Ta(˚C) Fig.1 Forward Current vs. Ambient Temperature Diode power dissipation P (mW) 100 120 0 05 0 5 5 100 −30 Ambient temperature T a (˚C) Fig.2 Diode Power Dissipation vs. Ambient Temperature 0 02 5 5 07 5 100 125 200 150 100 Collector power dissipation PC (mW) −30 Ambient temperature Ta (˚C) Fig.3 Collector Power Dissipation vs. Ambient Temperature PC354NJ0000F Series

Sheet No.: D2-A00602EN Fig.11 Collector Dark Current vs. Ambient Temperature 0.01 0.1 1 10 0.1 100 Response time (µs) VCE=2V IC=2mA Ta=25˚C ts td tf tr Load resistance RL (kΩ) Fig.12 Response Time vs. Load Resistance −30 100 02 0 150 100 40 80 60 Ambient temperature Ta (˚C) Relative current transfer ratio (%) IF=5mA VCE=5V Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature 60 8040 0.16 200 100−30 0.14 0.12 0.08 0.1 0.06 0.04 0.02 Collector-emitter saturation voltage VCE (sat) (V) Ambient temperature Ta (˚C) IF=20mA IC=1mA Fig.10 Collector - emitter Saturation Voltage vs. Ambient Temperature 20mA 10mA 5mA 1mA Collector-emitter voltage VCE (V) Collector current IC (mA) Ta=25˚C IF=30mA PC (MAX.) 0123456789 1 0 Fig.8 Collector Current vs. Collector-emitter Voltage 300 200 100 400 500 0.1 1 10 100 Current transfer ratio CTR (%) Forward current IF (mA) VCE=5V Ta=25˚C Fig.7 Current Transfer Ratio vs. Forward Current PC354NJ0000F Series Collector dark current ICEO (A) Ambient temperature Ta (˚C) 806040200−30 100 10−5 10−6 10−7 10−8 10−9 10−10 10−11 VCE=50V

Sheet No.: D2-A00602EN Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. 10% 90% Output Input Input Output RL VCC RD tstd tr tf Please refer to the conditions in Fig.12 VCE Fig.13 Test Circuit for Response Time 5.6 1.4 2.8 4.2 1mA 3mA 5mA 7mA Forward current IF (mA) Collector-emitter saturation voltage VCE (sat) (V) Ta=25˚C IC=0.5mA 0123456789 1 0 Fig.14 Collector-emitter Saturation Voltage vs. Forward Current PC354NJ0000F Series

Sheet No.: D2-A00602EN ■ Design Considerations While operating at IF<1.0mA, CTR variation may increase. Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED.

  • Degradation In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration. ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
  • Design guide PC354NJ0000F Series
  • Recommended Foot Print (reference) 1.5 2.54 0.8 6.3 (Unit : mm)

Sheet No.: D2-A00602EN ■ Manufacturing Guidelines Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice.

  • Soldering Method Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 260˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400˚C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. PC354NJ0000F Series 123 4 300 200 100 0 0 (˚C) Terminal : 260˚C peak ( package surface : 250˚C peak) Preheat 150 to 180˚C, 120s or less Reflow 220˚C or more, 60s or less (min)

Sheet No.: D2-A00602EN Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin.

  • Cleaning instructions This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
  • Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE).
  • Presence of ODC PC354NJ0000F Series

Sheet No.: D2-A00602EN

  • Tape and Reel package 1. 3 000pcs/reel Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions A 12.0±0.3 B 5.5±0.1 C 1.75±0.1 D 8.0±0.1 E 2.0±0.1 H 7.4±0.1 I 0.3±0.05 J 3.1±0.1 K 4.0±0.1 F 4.0±0.1 G φ1.5+0.1 −0 FE I D JGB A C H MAX. K H Dimensions List (Unit : mm) a c e g f b d a 370 b 13.5±1.5 c 80±1.0 d 13±0.5 e 21±1.0 f 2.0±0.5 g 2.0±0.5 Dimensions List (Unit : mm) Pull-out direction [Packing : 3 000pcs/reel] Reel structure and Dimensions Direction of product insertion ■ Package specification PC354NJ0000F Series

Sheet No.: D2-A00602EN 2. 750pcs/reel Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions A 12.0±0.3 B 5.5±0.1 C 1.75±0.1 D 8.0±0.1 E 2.0±0.1 H 7.4±0.1 I 0.3±0.05 J 3.1±0.1 K 4.0±0.1 F 4.0±0.1 G φ1.5+0.1 −0 FE I D JGB A C H Dimensions List (Unit : mm) MAX. K H a c e g f b d a 180 b 13.5±1.5 c 80±1.0 d 13±0.5 e 21±1.0 f 2.0±0.5 g 2.0±0.5 Dimensions List (Unit : mm) Pull-out direction [Packing : 750pcs/reel] Reel structure and Dimensions Direction of product insertion PC354NJ0000F Series

  • The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices.
  • Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice.
  • Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba).
  • If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices.
  • This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party.
  • Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: D2-A00602EN ■ Important Notices PC354NJ0000F Series [E181]