PT480E00000F SHARP | Alldatasheet

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1 Sheet No.: D1-A01901EN Date Marcch 30, 2007 ©SHARP Corporation PT480E00000F PT480E00000F Phototransistor Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. ■ Features 1. Side view detection type 2. Plastic mold with resin lens 3. Narrow directivity angle 4. Transparent resin 5. Lead free and RoHS directive component ■ Agency Approvals/Compliance 1. Compliant with RoHS directive (2002/95/EC) 2. Content information about the six substances specified in “Management Methods for Control of Pollution Caused by Electronic Information Prod- ucts Regulation” (popular name: China RoHS) (Chinese: ); refer to page 8 ■ Applications 1. Optoelectronic switches 2. Automatic stroboscopes 3. Office automation equipment 4. Audio visual equipment 5. Home appliances 6. Telecommunication equipment 7. Measuring equipment 8. Tooling machines 9. Computers

Sheet No.: D1-A01901EN PT480E00000F ■ Outline Dimensions R0.8 ±0.1 2-C0.5 2.15 2.95 (6°) 1.6 (6°) (6°) (6°) (6°)(6°) 2.8 (2.54) 3.0 0.15 0.2 MAX. Resin burr 0.5 MAX. Gate burr1.0 MAX. resin burr 0.5 MIN. 17.5 1.4 (1.7) 1.5 4.0 +1.5 -1.0 2 - 0.4 +0.3 -0.1 0.5 0.75 1.15 60° 2 - 0.45 +0.3 -0.1 2 - 0.87 0.15 MAX. φ1.5 E. PIN R0.5 1 2 Emitter Collector No. Name Pin Arrangement 1 2 Terminal connection NOTES: 1. Units: mm 2. Unspecified tolerence: ±0.2 mm 3. ( ): Reference dimensions 4. Package: Transparent epoxy resin 5. The thin burr thickness and the gate burr (0.5 mm MAX.) are not included in outline dimensions

Sheet No.: D1-A01901EN PT480E00000F ■ Absolute Maximum Ratings *1 5 s (MAX.) positioned 1/4 mm from resin edge. see Figure 13 ■ Electro-optical Charactertistics *1 Ee: Irradiance by CIE standard light source A (tungsten lamp) Parameter Symbol Rating Unit Collector-emitter voltage V CEO 35 V Emitter-collector voltage V ECO 6V Collector current I C 20 mA Collector power dissipation P C 75 mW Operating temperature Topr -25 to +85 °C Storage temperature Tstg -40 to +85 °C Soldering temperature *1 Tsol 260 °C Parameter Symbol Conditi ons *1 MIN. TYP. MAX. Unit Collector current I C Ee = 1 mW/cm2, VCE = 5 V 0.4 1.7 6.0 mA Dark current I CEO Ee = 0, VCE = 20 V – 1.0 100 nA Collector-emitter saturation voltage V CE(sat) Ee = 10 mW/cm2, IC = 0.5 mA – 0.1 0.4 V Collector-emitter breakdown voltage BV CEO IC = 0.1 mA, Ee = 0 35 – – V Emitter-collector breakdown voltage BV ECO IE = 0.01 mA, Ee = 0 6.0 – – V Peak sensitivity wavelength λp – – 800 – nm Response time (Rise) tr VCE = 2 V, IC = 2 mA, RL = 100 Ω –3 . 0 – µ s Response time (Fall) tf – 3.5 – µs Fig. 1 Collector Po wer Dissipation vs. Ambient Temperature 0-25 0 25 Ambient temperature Ta (°C) Collector power dissipation Pc (mW) 50 75 851 0 0 Fig. 2 Spectral Sensitivity 100 Ta = 25°C 400 500 600 700 wavelength λ (nm) 800 900 1,000 1,100 Relative sensitivity (%) (Ta = 25°C) (Ta = 25°C)

Sheet No.: D1-A01901EN PT480E00000F Fig. 3 Sensitivity Diagram Fig. 4 Collector Dark Current vs. Ambient Temperature Relative sensitivity (%) 100 +30° +40° +50° +60° +70° +80° +90° -30° -20° -10° (Ta = 25°C) 0° +10° +20° -40° -50° -60° -70° -80° -90° Angular displacement θ Collector dark c urrent I CEO (A) VCE = 20 V 10-6 10-7 10-8 10-9 10-10 02 5 Ambient temperature Ta (°C) 50 75 100 Fig. 5 Relative Coll ector Current vs. Ambient Temperature Fig. 6 Collector Current vs. Irradience Relati ve collector c urrent (%) 0 1 02 03 04 05 06 07 00 100 120 140 160 V CE = 5 V Ee = 1 mW/cm2 Ambient temperat ure Ta (°C) VCE = 5 V Ta = 25°C 11 0 0.1 0.2 0.5 2 5 20 0.1 0.2 0.5 Collector c urrent I C (mA) Irradiance Ee (m W/cm2)

Sheet No.: D1-A01901EN PT480E00000F Fig. 7 Collector Current vs. Collector-Emitter Voltage Fig. 8 Response Time vs. Load Resistance Ta = 25°C 0 5 10 15 20 25 30 35 400 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Collector current IC (mA) Collector-emitter voltage VCE (V) 0.5 mW/cm 0.25 mW/cm2 0.1 mW/cm2 0.75 mW/cm Ee = 1.0 m W/cm 0.1 0.2 0.5 2 10 5 100 Load resistance RL (kΩ) Response time tr, tf (µs) tr tf tr tf VCE = 2 V IC = 2 mA Ta = 25°C Fig. 9 Test Circuit to Determine Response Time Fig. 10 Collector-to-Emitter Saturation Voltage vs. Irradience Fig. 11 Relative Output vs Distance Output Output VCC RL Input tftr 90% 10% 0.05 0.1 0.2 0.4 Collector-emitter saturation voltage VCE (sat) (V) 0.6 0.8 1.0 1.2 IC = 0.1 mA 0.5 mA 1 mA 2 mA 1.4 0.2 0.5 1 2 5 10 Irradiance Ee (mW/cm2) Ta = 25°C 100 Distance between emitter and detector (mm) Relative output (%) 51 0 5 0 20 0.5 0.50.2

Sheet No.: D1-A01901EN PT480E00000F ■ Packing Specifications Fig. 12 Packing Method Inner packing Vinyl bag with products (2 bags) Cellophane tape Packing case Model No., Quantity, and Lot No. Cushioning material (2 sheets) Vinyl bag Product (1,000 pieces) NOTES: 1. Inner packing material : Vinyl bag (Polyethylene) 2. Quantity: 1,000 pieces/bag NOTES: 1. Outer material : Packing case (Corrugated cardboard), Cushioning material (Urethane), Cellophane tape 2. Quantity: 2,000 pieces/ box 3. Regular packaged mass: Approximately 270 g 4. Indication: Model No., Quantity, and Lot No. Outer packing Cushioning material (2 sheets)

Sheet No.: D1-A01901EN PT480E00000F ■ Packing Specifications 1. Parts are packed in a vinyl bag, at an average quantity of 1,000 pieces per bag. 2. Bags are secured in a box as shown in illustration on page 6. 3. Product mass: 0.09 g (approx.) ■ Design Notes 1. This product is not designed to resist el ectromagnetic and ionized-particle radiation. ■ Manufacturing Guidelines

  • Cleaning Instructions 1. Confirm this device's resistance to process chemicals be fore use, as certain process chemicals may affect the optical characteristics. 2. Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less. 3. Ultrasonic cleaning: The effect upon devices varies d ue to cleaning bath size, ultrasonic power output, cleaning time, PCB size and device mounting circumstances. Sharp recommends testing using actual production condi- tions to confirm the harmlessness of the ultrasonic cleaning methods. 4. Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol.
  • Soldering Instructions 1. Sharp recommends not soldering this part using preheat or solder reflow methods. 2. If hand soldering, use temperatures ≤ 260° for ≤5 seconds. 3. When mounting this device, care should be taken to prevent any boundary exfoliation (pad lifting) between the solder, the pad, and the circuit board. 4. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack- age due to the PCB flexing during the soldering process. Fig. 13 Soldering Area 1.4 mm Solderable

Sheet No.: D1-A01901EN PT480E00000F ■ Presence of ODCs (RoHS Compliance) This product shall not contain the following materials, and they are not used in the production process for this product:  Regulated substances: CFCs, Halon, Carbon tetrachloride, 1,1,1-Trichloroethane (Methylchloroform). Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).  Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE).  Content information about the six substances specified in “Management Methods for Control of Pollution Caused by Electronic Information Products Regulation” (Chinese: ) NOTE: ✓ indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the conc entration limit requirement as described in SJ/T 11363-2006 standard. Category Toxic and Hazdardous Substances Lead (Pb) mercury (Hg) Cadmium (Cd) Hexavalent chromiun (Cr6+) Polybrominated biphenyls (PBB) Polybrominated diphenyl ethers (PBDE) Infrared Emitting Diode ✓ ✓ ✓ ✓✓✓

■ Important Notices

  • The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP’s devices.
  • Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristi cs, data materials, struc- ture, and other contents described herein at any time without notice in order to im prove design or reliability. Manufacturing locations are also subject to change without notice.
  • Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment (terminal) --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to en sure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliabilty such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connec- tion with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment (trunk lines) --- Nuclear power control equipment --- Medical and other life support equipment (e.g. scuba)
  • If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices.
  • This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be repro- duced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party.
  • Contact and consult with a SHARP representative if there are any questions about the contents of this pub- lication. Sheet No.: D1-A01901EN PT480E00000F