PR5301-XX PREMA | Alldatasheet

Document overview

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Technical content

Sensor IC for Incremental Optical Encoders for resolutions of 50, 150 or 300 lpi PR5301 is a sensor IC with A and B channel digital output. It comes in a small DFN package for easy use in linear or rotary encoders.

  • PR5301-050 for 50 lpi resolution
  • PR5301-150 for 150 lpi resolution
  • PR5301-300 for 300 lpi resolution

FEATURES

  • fixed resolutions of 50, 150 or 300 lpi
  • small DFN package
  • A and B channel digital output
  • photodiodes with antireflective coating
  • high sensitivity for low LED current
  • best for red or near-infrared light BLOCK DIAGRAM PACKAGES The PR5301 is offered as bare die or in a tiny optical DFN package. a) IC as bare die – PR5301-XX-BD Encoder ICs can be delivered as bare dies (2,225 µm x 910 µm) on tested and inked wafers, or singulated dies on adhesive film b) In optical DFN package - PR5301-XX-TM PR5301-300-TM in ODFN-4L 1.8x2.9 package. © PREMA Semiconductor GmbH 2016 I rev. 4416 -- PRELIMINARY DATASHEET -- Page 1/4

Electrical Characteristics

Parameter Min Typ Max Units VCC (supply voltage) -0.3 14 V VPIN (voltage @ other pins) -0.3 VCC+0.3 V Operating Temperature PR5301-BD PR5301-TM -40 -40 Storage Temperature Range PR5301-BD PR5301-TM -55 -40 125 100 TJ (Junction Temperature) PR5201-BD/OC PR5201-CB/TM -40 -40 Electrostatic Discharge (ESD) Protection @ all pins 4 kV OPERATING CHARACTERISTICS VCC = 5 V, TJ = -40...85°C (unless otherwise noted) Symbol Parameter Conditions Min Typ Max Units Vcc Supply voltage 3 6 V ICC Supply current (no load) digital outputs LO digital outputs HI Tj=27°C 0.4 0.4 1.5 1.5 mA Digital outputs A, B, Z, C4, RL, Alarm fOUT Output frequency A, B 300 kHz VSat(Lo) Saturation voltage LO I = 1.3 mA 0.3 V ISC(Lo) Short-circuit current LO V = VCC 1.8 26 mA VSat(Hi) Saturation voltage HI I = 1.3 mA Vcc-1.2 V ISC(Hi) Short-circuit current HI V = 0 V -28 -2 mA Photosensors λar Spectral application range Se( ar)=0.25*λ λ peak 500 950 nm λpeak Peak sensitivity 800 nm Test pins are used for chip test only. Their use is not further described in this document. © PREMA Semiconductor GmbH 2016 I rev. 4416 -- PRELIMINARY DATASHEET -- Page 2/4

Photodiodes – Resolution and Size PR5301-050 for 50 lpi resolution The width of a photodiode for 50 dpi is 254 m with μ a pitch of 381 m.μ PR5301-150 for 150 lpi resolution The width of a photodiode for 150 dpi is 84.7 m μ with a pitch of 127 m.μ PR5301-300 for 300 lpi resolution The width of a photodiode for 150 dpi is 42.3 m μ with a pitch of 63.5 m.μ For all versions:

  • Die size: 2,225 µm x 910 µm (measured between centres of scribe lane)
  • A/B photodiodes track width: 280 µm
  • Pad window: 120 µm x 120 µm PIN DESCRIPTION Left: ODFN-4L 1.8x2.9 package (top view) Pin No Pin Name Pin Function Description

1 Vee negative supply voltage

2 B B channel digital output

3 A B channel digital output

4 Vcc positive supply voltage

Test pins are for chip test only and not described in this document. Chip centre may be offset by up to 250 µm from package centre in any direction. © PREMA Semiconductor GmbH 2016 I rev. 4416 -- PRELIMINARY DATASHEET -- Page 3/4

ODFN-4L-1.8x2.9 PACKAGE A lead-free solder profile with a peak tem pera- ture of 260°C or less, according to J-STD-020 should be followed. Samples shipped without moisture barrier bag must be dry-baked according to JEDEC guide - lines before soldering. Manual soldering may not be possible or must be done with utmost care. Direct infrared heating should be avoided; pure convection heating is recommended. There is no experience with gas phase soldering. PRELIMINARY DATASHEET - DATA MAY CHANGE WITHOUT NOTICE Disclaimer Information provided by PREMA is believed to be accurate and correct. However, no responsibility is assumed by PREMA for its use, nor for any infringements of patents or other rights of third parties which may result from its use. PREMA reserves the right at any time without notice to change circuitry and specifications. Life Support Policy PREMA Semiconductors products are not authorized for use as critical components in life support devices or systems without the express written approval of PREMA Semiconductor. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PREMA Semiconductor GmbH Robert-Bosch-Str. 6

55129 Mainz Germany

Phone: +49-6131-5062-0 Fax: +49-6131-5062-220 Email: prema@prema.com Web site: www.prema.com © PREMA Semiconductor GmbH 2016 I rev. 4416 -- PRELIMINARY DATASHEET -- Page 4/4