PP6N-FLVE-3SC

PP6N-FLXX-3SC ELITE | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 19

Technical content

Features

• Good color uniformity
• Industry best moisture senstivity level - JEDEC 1
• Low-temp. & lead free reflow soldering
• RoHS compliant
• More energy efficient than incandescent and most halogen lamps
• Low Voltage DC operated
• Instant light (less than 100ns)
• No UV Typical Applications
• Reading lights (car, bus, aircraft)
• Portable (flashlight, bicycle)
• Uplighters/Downlighters
• Decorative/Entertainment
• Bollards/Security/Garden
• Cove/Undershelf/Task
• Indoor/Outdoor Commercial and Residential Architectural
• Automotive Ext (Stop-Tail-Turn, CHMSL, Mirror Side Repeat)
• LCD backlights 1 2010/04

Emitter Mechanical Dimensions Notes: 1. The cathode side of the device is denoted by the chamfer on the part body. 2. Electrical insulation between the case and the board is required --- slug of device is not electrically neutral. Do not electrically connect either the anode or cathode to the slug. 3. Drawing not to scale. 4. All dimensions are in millimeters. 5. All dimendions without tolerances are for reference only. 6. Please do not solder the emitter by manual hand soldering, otherwise it will damage the emitter. 7. Please do not use a force of over 3kgf impact or pressure on the lens of the LED, otherwise it will cause a catastrophic failure. *The appearance and specifications of the product may be modified for improvement without notice.

Star Mechanical Dimensions Notes: 1. Slots in aluminum-core PCB for M3 or #4 mounting screw. 2. Electrical interconnection pads labeled on the aluminum-core PCB with "+" and "-" to denote positive and negative, respectively. All positive pads are interconnected, as are all negative pads, allowing for flexibility in array interconnection. 3. Drawing not to scale. 4. All dimensions are in millimeters. 5. All dimendions without tolerances are for reference only. 6. Please do not use a force of over 3kgf impact or pressure on the lens of the LED, otherwise it will cause a catastrophic failure. *The appearance and specifications of the product may be modified for improvement without notice.

Flux Characteristics at 50mA, TJ = 25°C Radiation Pattern Emitter Star Minimum Typical White PP6N-FLWE-3SC PP6N-FLWS-3SC 23.5 32 Warm White PP6N-FLVE-3SC PP6N-FLVS-3SC 23.5 30

• ProLight maintains a tolerance of ± 10% on flux and power measurements.
• Please do not drive at rated current more than 1 second without proper heat sink. Electrical Characteristics at 50mA, TJ = 25°C Color Min. Typ. Max. White 9.9 11.1 12.0 Warm White 9.9 11.1 12.0 Optical Characteristics at 50mA, TJ = 25°C Total included Viewing Angle Angle (degrees) (degrees) Min. Typ. Max. θ0.90V 2 θ1/2 White 6020 K 6535 K 7050 K 160 140 Warm White 2870 K 3045 K 3220 K 160 140
• ProLight maintains a tolerance of ± 1nm for dominant wavelength measurements.
• ProLight maintains a tolerance of ± 5% for CCT measurements. Color Dominant Wavelength λD, or Color Temperature CCT Forward Voltage VF (V) Thermal Resistance Junction to Slug (°C/ W) Color Part Number Lumious Flux ΦV (lm) Lambertian

DC Forward Current (mA) Peak Pulsed Forward Current (mA) Average Forward Current (mA) ESD Sensitivity (HBM per MIL-STD-883E Method 3015.7) LED Junction Temperature (°C) Aluminum-core PCB Temperature (°C) Storage & Operating Temperature (°C) Soldering Temperature(°C) Photometric Luminous Flux Bin Structure Color Bin Code P Q R P Q *When CCT is less than 3050K, Q bin is not available.

• ProLight maintains a tolerance of ± 10% on flux and power measurements.
• The flux bin of the product may be modified for improvement without notice. White Warm White 23.5 30.6 30.6 39.8 30.6 39.8 39.8 51.7 235°C Minimum Photometric Flux (lm) 23.5 30.6 120 Maximum Photometric Flux (lm) White/Warm White > ±500V 105 -40 to +105

White Binning Structure Graphical Representation White Bin Structure Bin Code x y Typ. CCT (K) 0.321 0.348 0.303 0.330 0.307 0.311 0.322 0.326

• Tolerance on each color bin (x , y) is ± 0.01 X0 6500 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 y x 7050 K 6020 K X0 Planckian (BBL) White

Warm White Binning Structure Graphical Representation Warm White Bin Structure Bin Code x y Typ. CCT (K) 0.456 0.426 0.430 0.417 0.415 0.381 0.437 0.389

• Tolerance on each color bin (x , y) is ± 0.01 N0 3000 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 y x 3220 K 2870 K N0 Planckian (BBL) Warm White

Color Spectrum, TJ = 25°C 1. White 2. Warm White 0.0 0.2 0.4 0.6 0.8 1.0 350 400 450 500 550 600 650 700 750 800 850 Wavelength(nm) Relative Spectral Power Distribution Standard Eye Response Cruve White 0.0 0.2 0.4 0.6 0.8 1.0 350 400 450 500 550 600 650 700 750 800 850 Wavelength(nm) Relative Spectral Power Distribution Standard Eye Response Cruve Warm White

Light Output Characteristics Relative Light Output vs. Junction Temperature at 50mA Forward Current Characteristics, TJ=25℃ 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 10 20 30 40 50 60 Relative Luminous Flux Forward Current (mA) 0 2 4 6 8 10 12 Average Forward Current (mA) Forward Voltage (V) 100 120 140 160 1 2 3 4 5 6 7 8 Relative Light Output (%) Junction Temperature, TJ (℃) -20 0 20 40 60 80 100 120 White, Warm White Fig 1. Forward Current vs. Forward Voltage for White, Warm White. Fig 2. Relative Luminous Flux vs. Forward Current for White, Warm White at TJ=25℃ maintained.

Typical Representative Spatial Radiation Pattern Lambertian Radiation Pattern 100 -100 -80 -60 -40 -20 0 20 40 60 80 100 Angular Displacement (Degrees) Relative Intensity (%)

Moisture Sensitivity Level - JEDEC 1 Level Time Conditions Time (hours) Conditions Time (hours) Conditions ≤30°C / 85°C / 85% RH 85% RH

• The standard soak time includes a default value of 24 hours for semiconductor manufature's exposure time (MET) between bake and bag and includes the maximum time allowed out of the bag at the distributor's facility.
• Table below presents the moisture sensitivity level definitions per IPC/JEDEC's J-STD-020C. Level Time Conditions Time (hours) Conditions Time (hours) Conditions ≤30°C / 85°C / 85% RH 85% RH ≤30°C / 85°C / 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH Time on Label ≤30°C / Time on Label 30°C / (TOL) 60% RH (TOL) 60% RH NA NA NA 6 NA 5a 24 hours 48 +2/-0 10 +0.5/-0 5 48 hours 72 +2/-0 15 +0.5/-0 4 72 hours 96 +2/-0 20 +0.5/-0 3 168 hours 192 +5/-0 40 +1/-0 2a 4 weeks 696 +5/-0 120 +1/-0 2 1 year 168 +5/-0 NA

1 Unlimited 168 +5/-0 NA

Floor Life Standard Accelerated Environment Floor Life Standard Accelerated Environment Soak Requirements NA Soak Requirements

Qualification Reliability Testing Stress Test Stress Duration Failure Criteria Room Temperature Operating Life (RTOL) Wet High Temperature Operating Life (WHTOL) Wet High Temperature Storage Life (WHTSL) High Temperature Storage Life (HTSL) Low Temperature Storage Life (LTSL) Non-operating Temperature Cycle (TMCL) Non-operating Thermal Shock (TMSK) Variable Vibration Frequency Solder Heat Resistance (SHR) Solder coverage on lead Notes: 1. Depending on the maximum derating curve. 2. Criteria for judging failure Min. I F = max DC - VR = 5V - * The test is performed after the LED is cooled down to the room temperature. 3. A failure is an LED that is open or shorted. 1000 hours Note 2 Note 3 Note 3 Note 2 Note 2 1000 hours 1000 hours 200 cycles 200 cycles Note 3 Note 3 Note 2 Note 2 1000 hours 1000 hours Note 2 Note 2 Natural Drop <20 sec. transfer 1500 G, 0.5 msec. pulse, 5 shocks each 6 axis On concrete from 1.2 m, 3X Mechanical Shock -40°C, non-operating -40°C to 120°C, 30 min. dwell, <5 min. transfer -40°C to 120°C, 20 min. dwell, Stress Conditions 25°C, I F = max DC (Note 1) 85°C/60%RH, IF = max DC (Note 1) 110°C, non-operating 85°C/85%RH, non-operating 10-2000-10 Hz, log or linear sweep rate, 20 G about 1 min., 1.5 mm, 3X/axis 260°C ± 5°C, 10 sec. Steam age for 16 hrs., then solder dip Test Condition Solderability 50 μA -Initial Level x 0.7 Item Reverse Current (IR) Max. Initial Level x 1.1 at 260°C for 5 sec. IF = max DC Criteria for Judgement Forward Voltage (VF) Luminous Flux or Radiometric Power (ΦV)

Recommended Solder Pad Design

• All dimensions are in millimeters.
• Electrical isolation is required between Slug and Solder Pad.

Reflow Soldering Condition

• All temperatures refer to topside of the package, measured on the package body surface.
• Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a heat plate should be used. It should be confirmed beforehand whether the characteristics of LEDs will or will not be damaged by repairing.
• Reflow soldering should not be done more than two times.
• When soldering, do not put stress on the LEDs during heating.
• After soldering, do not warp the circuit board. 100 °C 150 °C 60-120 seconds 3 °C / second max. 183°C 60-150 seconds 235°C 20 seconds Average ramp-down rate (TP to Tsmax) Time 25°C to Peak Temperature classification temperature (TC) 6 °C/second max. 6 minutes max. Profile Feature Average Ramp-Up Rate (Tsmax to TP) Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP) 20 secondsTime (tP) within 5°C of the specified 138°C 20-50 seconds 185°C Sn-Pb Eutectic Assembly 3 °C/second max. 4 minutes max. (58Bi-42Sn Eutectic Alloy) Low-Temp. & Pb-Free Assembly 90 °C 120 °C 60-120 seconds 2 °C / second max.

Heat Plate Soldering Condition

• Heat plate temperature: 230°C max for Lead Solder and 230°C max for Lead-Free Solder.
• We recommend using the 58Bi-42Sn eutectic alloy for low-temp. and lead free soldering (melting point = 138 °C).
• When soldering, do not put stress on the LEDs during heating.
• After soldering, do not warp the circuit board. MCPCB Place Emitter on MCPCB. Put MCPCB on Heat Plate. Place Solder Wire to the solder pad of MCPCB. MCPCB Solder Paste Heat Plate (1) Soldering Process for Solder Paste (2) Soldering Process for Solder Wire Heat Plate Heat Plate Heat Plate Solder Wire Put Emitter on MCPCB. Take the MCPCB out from Heat Plate within 10 seconds. Emitter Emitter Use Solder Mask to print Solder Paste on MCPCB. Put MCPCB on Heat Plate until Solder Paste melt. The Solder Paste sould be melted within 10 seconds. Take out MCPCB out from Heat Plate within 15 seconds.

Notes: 1. Drawing not to scale. 2. All dimensions are in millimeters. 3. General tolerance is ± 0.10 mm.

178 ± 1 3 ± 0.5 4 ± 0.5 5 ± 0.5 60 ± 0.5 13.2 ± 0.5 16.2 ± 0.5 Φ 13.1 ± 0.5 Φ 21 ± 0.5 Notes: 1. Empty component pockets sealed with top cover tape. 2. 250 or 500 pieces per reel. 3. Drawing not to scale. 4. All dimensions are in millimeters.

Notes: 1. 20 pieces per tube. 2. Drawing not to scale. 3. All dimensions are in millimeters. 4. All dimendions without tolerances are for reference only. **Please do not open the moisture barrier bag (MBB) more than one week. This may cause the leads of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening the MBB. The recommended storage conditions are temperature 5 to 30 °C and humidity less than 40% RH.

Handling of Silicone Lens LEDs

• Storage Please do not open the moisture barrier bag (MBB) more than one week. This may cause the leads of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening the MBB. The recommended storage conditions are temperature 5 to 30°C and humidity less than 40% RH. It is also recommended to return the LEDs to the MBB and to reseal the MBB.
• The slug is is not electrically neutral. Therefore, we recommend to isolate the heat sink.
• The slug is to be soldered. If not, please use the heat conductive adhesive.
• Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering.
• Please avoid rapid cooling after soldering.
• Components should not be mounted on warped direction of PCB.
• Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a heat plate should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
• This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When cleaning is required, isopropyl alcohol should be used.
• When the LEDs are illuminating, operating current should be decide after considering the package maximum temperature.
• The appearance, specifications and flux bin of the product may be modified for improvement without notice. Please refer to the below website for the latest datasheets. h ttp://www.prolightopto.com/ Notes for handling of silicone lens LEDs
• Please do not use a force of over 3kgf impact or pressure on the silicone lens, otherwise it will cause a catastrophic failure.
• The LEDs should only be picked up by making contact with the sides of the LED body.
• Avoid touching the silicone lens especially by sharp tools such as Tweezers.
• Avoid leaving fingerprints on the silicone lens.
• Please store the LEDs away from dusty areas or seal the product against dust.
• When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the silicone lens must be prevented.
• Please do not mold over the silicone lens with another resin. (epoxy, urethane, etc) ╳ ○