PG1C-5LVE-R7

PG1C-5LWE ELITE | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 17

Technical content

Features

• High Color rendering index (CRI>70 and >80 available)
• High flux per LED
• Good color uniformity
• RoHS compliant
• Industry best moisture senstivity level - JEDEC 2a 4 week floor life without reconditioning
• Low-temp. & lead free reflow soldering
• More energy efficient than incandescent and most halogen lamps
• Low Voltage DC operated
• Instant light (less than 100ns)
• No UV
• Superior ESD protection Typical Applications
• Reading lights (car, bus, aircraft)
• Portable (flashlight, bicycle)
• Uplighters/Downlighters
• Decorative/Entertainment
• Bollards/Security/Garden
• Cove/Undershelf/Task
• Indoor/Outdoor Commercial and Residential Architectural
• Automotive Ext (Stop-Tail-Turn, CHMSL, Mirror Side Repeat)
• LCD backlights 1 2010/04

Emitter Mechanical Dimensions Notes: 1. The Anode side of the device is denoted by a hole in the lead frame. 2. Electrical insulation between the case and the board is required --- slug of device is not electrically neutral. Do not electrically connect either the anode or cathode to the slug. 3. Drawing not to scale. 4. All dimensions are in millimeters. 5. All dimendions without tolerances are for reference only. 6. Please do not bend the leads of the LED, otherwise it will damage the LED. 7. Please do not use a force of over 3kgf impact or pressure on the lens of the LED, otherwise it will cause a catastrophic failure. *The appearance and specifications of the product may be modified for improvement without notice. TOP VIEW BOTTOM VIEW

Flux Characteristics at 700mA, TJ = 25°C Radiation Part Number CRI Pattern Emitter Minimum Typical Typical White PG1C-5LWE 324.5 350 75 Warm White PG1C-5LVE-R7 249.6 280 75 White PG1C-5LWE-R8 249.6 295 83 Warm White PG1C-5LVE-R8 192 220 83

• ProLight maintains a tolerance of ± 10% on flux and power measurements.
• Please do not drive at rated current more than 1 second without proper heat sink. Electrical Characteristics at 700mA, TJ = 25°C Color Min. Typ. Max. White 5.7 7.0 8.2 Warm White 5.7 7.0 8.2 Optical Characteristics at 700mA, TJ = 25°C Total included Viewing Angle Angle (degrees) (degrees) Min. Typ. Max. θ0.90V 2 θ1/2 White 4100 K 5500 K 10000 K 160 140 Warm White 2700 K 3300 K 4100 K 160 140
• ProLight maintains a tolerance of ± 1nm for dominant wavelength measurements.
• ProLight maintains a tolerance of ± 5% for CCT measurements. Color Lumious Flux ΦV (lm) Lambertian Forward Voltage VF (V) Thermal Resistance Junction to Slug (°C/ W) Dominant Wavelength λD, or Color Temperature CCT Color

DC Forward Current (mA) Peak Pulsed Forward Current (mA) Average Forward Current (mA) ESD Sensitivity (HBM per MIL-STD-883E Method 3015.7) LED Junction Temperature (°C) Aluminum-core PCB Temperature (°C) Storage & Operating Temperature (°C) Soldering Temperature(°C) Photometric Luminous Flux Bin Structure

• ProLight maintains a tolerance of ± 10% on flux and power measurements.
• The flux bin of the product may be modified for improvement without notice. 【1】The rest of color bins are not 100% ready for order currently. Please ask for quote and order possibility. White/Warm White 700 1000 700 ±4000V (Class III) 120 105 -40 to + 105 235°C Part Number Bin Code Minimum Maximum Available Photometric Flux (lm) Photometric Flux (lm) Color Bins PG1C-5LWE 324.5 369.9 All 369.9 421.9 Xx, Wx【1】 PG1C-5LVE-R7 249.6 284.5 All 284.5 324.5 【1】 【1】 PG1C-5LWE-R8 249.6 284.5 All 284.5 324.5 Xx, Wx【1】 PG1C-5LVE-R8 192 218.9 All 249.6218.9

White and Warm White Binning Structure Graphical Representation 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 y x 10000 K 7000 K 6300 K 5650 K 5000 K 4500 K 4100 K 3800 K 3500 K 3250 K 3050 K

2850 K 2700 K

(BBL) Warm White White

Bin Code x y Typ. CCT (K) Bin Code x y Typ. CCT (K) 0.378 0.382 0.329 0.345 0.374 0.366 0.316 0.333 0.360 0.357 0.315 0.344 0.362 0.372 0.329 0.357 0.382 0.397 0.329 0.331 0.378 0.382 0.329 0.320 0.362 0.372 0.318 0.310 0.365 0.386 0.317 0.320 0.362 0.372 0.308 0.311 0.360 0.357 0.305 0.322 0.344 0.344 0.316 0.333 0.346 0.359 0.317 0.320 0.365 0.386 0.305 0.322 0.362 0.372 0.303 0.333 0.346 0.359 0.315 0.344 0.347 0.372 0.316 0.333 0.329 0.331 0.308 0.311 0.329 0.345 0.317 0.320 0.346 0.359 0.319 0.300 0.344 0.344 0.311 0.293 0.329 0.345 0.308 0.311 0.329 0.357 0.283 0.284 0.347 0.372 0.274 0.301 0.346 0.359 0.303 0.333 0.329 0.345 0.308 0.311 0.329 0.331 0.311 0.293 0.317 0.320 0.290 0.270 0.316 0.333 0.283 0.284

• Tolerance on each color bin (x , y) is ± 0.01 Note: Although several bins are outlined, product availability in a particular bin varies by production run and by product performance. Not all bins are available in all colors. W0 5970 YA 8000 V0 5320 XP 6650 VN 5320 Y0 8000 U0 4750 X0 6650 UN 4750 XN 6650 T0 4300 WN 5970 TN 4300 WP 5970 Y0 V1V0YA WAX1X0 W0 CCT 4500KCCT 5000KCCT 5500KCCT 6000KCCT 7000KCCT 8000K

Bin Code x y Typ. CCT (K) Bin Code x y Typ. CCT (K) 0.453 0.416 0.409 0.400 0.444 0.399 0.402 0.382 0.459 0.403 0.416 0.389 0.467 0.419 0.424 0.407 0.460 0.430 0.414 0.414 0.453 0.416 0.409 0.400 0.467 0.419 0.424 0.407 0.473 0.432 0.430 0.421 0.438 0.412 0.392 0.391 0.429 0.394 0.387 0.374 0.444 0.399 0.402 0.382 0.453 0.416 0.409 0.400 0.444 0.426 0.414 0.414 0.438 0.412 0.409 0.400 0.453 0.416 0.392 0.391 0.460 0.430 0.397 0.406 0.424 0.407 0.392 0.391 0.416 0.389 0.387 0.374 0.429 0.394 0.374 0.366 0.438 0.412 0.378 0.382 0.430 0.421 0.397 0.406 0.424 0.407 0.392 0.391 0.438 0.412 0.378 0.382 0.444 0.426 0.382 0.397

• Tolerance on each color bin (x , y) is ± 0.01 Note: Although several bins are outlined, product availability in a particular bin varies by production run and by product performance. Not all bins are available in all colors. P0 3150 S0 3950 P1 3150 S1 3950 N0 2950 R0 3650 N1 2950 R1 3650 M0 2770 Q0 3370 M1 2770 Q1 3370 Y0 V1V0YA WAX1X0 W0 CCT 4500KCCT 5000KCCT 5500KCCT 6000KCCT 7000KCCT 8000K

Color Spectrum, TJ = 25°C 1. White 2. Warm White For R7 3. White、Warm White For R8 0.0 0.2 0.4 0.6 0.8 1.0 350 400 450 500 550 600 650 700 750 800 850 Relative Spectral Power Distribution Wavelength(nm) Standard Eye Response Cruve White 0.0 0.2 0.4 0.6 0.8 1.0 350 400 450 500 550 600 650 700 750 800 850 Relative Spectral Power Distribution Wavelength(nm) Standard Eye Response Cruve Warm White 0.0 0.2 0.4 0.6 0.8 1.0 350 400 450 500 550 600 650 700 750 800 850 Relative Spectral Power Distribution Wavelength(nm) Standard Eye Response Cruve White Warm White

Light Output Characteristics Relative Light Output vs. Junction Temperature at 700mA Forward Current Characteristics, TJ = 25°C 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 200 400 600 800 Relative Luminous Flux Forward Current (mA) 100 200 300 400 500 600 700 800 0 1 2 3 4 5 6 7 8 Average Forward Current (mA) Forward Voltage (V) Fig 1. Forward Current vs. Forward Voltage for White, Warm White. Fig 2. Relative Luminous Flux vs. Forward Current for White, Warm White at Tj=25℃ maintained. 100 120 140 160 1 2 3 4 5 6 7 8 Relative Light Output (%) Junction Temperature, TJ (℃) -20 0 20 40 60 80 100 120 White, Warm White

Ambient Temperature vs. Maximum Forward Current 1. White, Warm White (TJMAX = 120°C) Typical Representative Spatial Radiation Pattern Lambertian Radiation Pattern 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Relative Intensity Angular Displacement (Degrees) 100 200 300 400 500 600 700 800 0 25 50 75 100 125 150 Forward Current (mA) Ambient Temperature (℃) RθJ-A = 14°C/W RθJ-A = 12°C/W RθJ-A = 8°C/W RθJ-A = 10°C/W

Moisture Sensitivity Level - JEDEC 2a Level Time Conditions Time (hours) Conditions Time (hours) Conditions 60% RH 60% RH 60% RH

• The standard soak time includes a default value of 24 hours for semiconductor manufature's exposure time (MET) between bake and bag and includes the maximum time allowed out of the bag at the distributor's facility.
• Table below presents the moisture sensitivity level definitions per IPC/JEDEC's J-STD-020C. Level Time Conditions Time (hours) Conditions Time (hours) Conditions ≤30°C / 85°C / 85% RH 85% RH ≤30°C / 85°C / 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH Time on Label ≤30°C / Time on Label 30°C / (TOL) 60% RH (TOL) 60% RH Soak Requirements Floor Life Standard Accelerated Environment 2a 4 weeks 696 +5/-0 120 +1/-0 Soak Requirements Floor Life Standard Accelerated Environment

1 Unlimited 168 +5/-0 NA NA

2a 4 weeks 696 +5/-0 120 +1/-0 3 168 hours 192 +5/-0 40 +1/-0 4 72 hours 96 +2/-0 20 +0.5/-0

6 NA NA

5 48 hours 72 +2/-0 15 +0.5/-0 5a 24 hours

Qualification Reliability Testing Stress Test Stress Duration Failure Criteria Room Temperature Operating Life (RTOL) Wet High Temperature Operating Life (WHTOL) Wet High Temperature Storage Life (WHTSL) High Temperature Storage Life (HTSL) Low Temperature Storage Life (LTSL) Non-operating Temperature Cycle (TMCL) Non-operating Thermal Shock (TMSK) Variable Vibration Frequency Solder Heat Resistance (SHR) Solder coverage on lead Notes: 1. Depending on the maximum derating curve. 2. Criteria for judging failure Min. IF = max DC -- VR = 5V -- * The test is performed after the LED is cooled down to the room temperature. 3. A failure is an LED that is open or shorted. Stress Conditions 25°C, IF = max DC (Note 1) 1000 hours Note 2 85°C/60%RH, IF = max DC (Note 1) 1000 hours Note 2 85°C/85%RH, non-operating 1000 hours Note 2 110°C, non-operating 1000 hours Note 2 -40°C, non-operating 1000 hours Note 2 -40°C to 120°C, 30 min. dwell, 200 cycles Note 2<5 min. transfer -40°C to 120°C, 20 min. dwell, 200 cycles Note 2<20 sec. transfer Mechanical Shock 1500 G, 0.5 msec. pulse, Note 35 shocks each 6 axis Natural Drop On concrete from 1.2 m, 3X Note 3 10-2000-10 Hz, log or linear sweep rate, Note 320 G about 1 min., 1.5 mm, 3X/axis 260°C ± 5°C, 10 sec. Note 3 Solderability Steam age for 16 hrs., then solder dip at 260°C for 5 sec. Item Test Condition Criteria for Judgement Max. Reverse Current (IR) 50 μA Forward Voltage (VF) Initial Level x 1.1 Luminous Flux or IF = max DC Initial Level x 0.7 --Radiometric Power (ΦV)

Recommended Solder Pad Design

• All dimensions are in millimeters.
• Electrical isolation is required between Slug and Solder Pad.

Reflow Soldering Condition

• All temperatures refer to topside of the package, measured on the package body surface.
• Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a heat plate should be used. It should be confirmed beforehand whether the characteristics of LEDs will or will not be damaged by repairing.
• Reflow soldering should not be done more than two times.
• When soldering, do not put stress on the LEDs during heating.
• After soldering, do not warp the circuit board. Sn-Pb Eutectic Assembly 3 °C/second max. 4 minutes max. (58Bi-42Sn Eutectic Alloy) Low-Temp. & Pb-Free Assembly 90 °C 120 °C 60-120 seconds 2 °C / second max. Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP) 20 secondsTime (tP) within 5°C of the specified 138°C 20-50 seconds 185°C Profile Feature Average Ramp-Up Rate (Tsmax to TP) Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) Average ramp-down rate (TP to Tsmax) Time 25°C to Peak Temperature classification temperature (TC) 6 °C/second max. 6 minutes max. 100 °C 150 °C 60-120 seconds 3 °C / second max. 183°C 60-150 seconds 235°C 20 seconds

Heat Plate Soldering Condition

• Heat plate temperature: 230°C max for Lead Solder and 230°C max for Lead-Free Solder.
• We recommend using the 58Bi-42Sn eutectic alloy for low-temp. and lead free soldering (melting point = 138 °C).
• When soldering, do not put stress on the LEDs during heating.
• After soldering, do not warp the circuit board. Manual Hand Soldering
• Solder tip temperature: 230°C max for Lead Solder and 260°C max for Lead-Free Solder.
• Avoiding damage to the emitter or to the MCPCB dielectric layer. Damage to the epoxy layer can cause
• Do not let the solder contact from solder pad to back-side of MCPCB. This one will cause a short circuit and damage emitter. a short circuit in the array.
• For prototype builds or small series production runs it possible to place and solder the emitters by hand. Figure 8a. Lead Solder Temperature ProfileFigure 8b. Lead-free Solder Temperature Profile MCPCB Place Emitter on MCPCB. Put MCPCB on Heat Plate. Place Solder Wire to the solder pad of MCPCB. MCPCB Solder Paste Heat Plate (1) Soldering Process for Solder Paste (2) Soldering Process for Solder Wire Heat Plate Heat Plate Heat Plate Solder Wire Put Emitter on MCPCB. Take the MCPCB out from Heat Plate within 10 seconds. Thermal Conductive Glue MCPCB Place Emitter on the MCPCB. Use Soldering Iron to solder the leads of Emtter within 5 seconds. Emitter Emitter Emitter Use Solder Mask to print Solder Paste on MCPCB. Put MCPCB on Heat Plate until Solder Paste melt. The Solder Paste sould be melted within 10 seconds. Take out MCPCB out from Heat Plate within 15 seconds. Place Thermal Comductive Glue on the MCPCB. Soldering Iron Solder Wire

Notes: 1. 50pieces per tube. 2. Drawing not to scale. 3. All dimensions are in millimeters. 4. All dimendions without tolerances are for reference only. **Please do not open the moisture barrier bag (MBB) more than one week. This may cause the leads of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening the MBB. The recommended storage conditions are temperature 5 to 30°C and humidity less than 40% RH.

Handling of Silicone Lens LEDs

• Storage Please do not open the moisture barrier bag (MBB) more than one week. This may cause the leads of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening the MBB. The recommended storage conditions are temperature 5 to 30°C and humidity less than 40% RH. It is also recommended to return the LEDs to the MBB and to reseal the MBB.
• The slug is is not electrically neutral. Therefore, we recommend to isolate the heat sink.
• The slug is to be soldered. If not, please use the heat conductive adhesive.
• Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering.
• Please avoid rapid cooling after soldering.
• Components should not be mounted on warped direction of PCB.
• Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a heat plate should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
• This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When cleaning is required, isopropyl alcohol should be used.
• When the LEDs are illuminating, operating current should be decide after considering the package maximum temperature.
• The appearance, specifications and flux bin of the product may be modified for improvement without notice. Please refer to the below website for the latest datasheets. http://www.prolightopto.com/ Notes for handling of silicone lens LEDs
• Please do not use a force of over 3kgf impact or pressure on the silicone lens, otherwise it will cause a catastrophic failure.
• The LEDs should only be picked up by making contact with the sides of the LED body.
• Avoid touching the silicone lens especially by sharp tools such as Tweezers.
• Avoid leaving fingerprints on the silicone lens.
• Please store the LEDs away from dusty areas or seal the product against dust.
• When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the silicone lens must be prevented.
• Please do not mold over the silicone lens with another resin. (epoxy, urethane, etc) ╳ ○