PP6N-1LAE

PP6N-1LXX ELITE | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 23

Technical content

Features

• High flux per LED
• Various colors
• Good color uniformity
• Industry best moisture senstivity level - JEDEC 2a 4 week floor life without reconditioning
• Low-temp. & lead free reflow soldering
• RoHS compliant
• More energy efficient than incandescent and most halogen lamps
• Low Voltage DC operated
• Instant light (less than 100ns)
• No UV Typical Applications
• Reading lights (car, bus, aircraft)
• Portable (flashlight, bicycle)
• Uplighters/Downlighters
• Decorative/Entertainment
• Bollards/Security/Garden
• Cove/Undershelf/Task
• Indoor/Outdoor Commercial and Residential Architectural
• Automotive Ext (Stop-Tail-Turn, CHMSL, Mirror Side Repeat)
• LCD backlights 1 2009/08

Emitter Mechanical Dimensions Notes: 1. The cathode side of the device is denoted by the chamfer on the part body. 2. Electrical insulation between the case and the board is required --- slug of device is not electrically neutral. Do not electrically connect either the anode or cathode to the slug. 3. Drawing not to scale. 4. All dimensions are in millimeters. 5. All dimendions without tolerances are for reference only. 6. Please do not solder the emitter by manual hand soldering, otherwise it will damage the emitter. 7. Please do not use a force of over 3kgf impact or pressure on the lens of the LED, otherwise it will cause a catastrophic failure. *The appearance and specifications of the product may be modified for improvement without notice.

Star Mechanical Dimensions Notes: 1. Slots in aluminum-core PCB for M3 or #4 mounting screw. 2. Electrical interconnection pads labeled on the aluminum-core PCB with "+" and "-" to denote positive and negative, respectively. All positive pads are interconnected, as are all negative pads, allowing for flexibility in array interconnection. 3. Drawing not to scale. 4. All dimensions are in millimeters. 5. All dimendions without tolerances are for reference only. 6. Please do not use a force of over 3kgf impact or pressure on the lens of the LED, otherwise it will cause a catastrophic failure. *The appearance and specifications of the product may be modified for improvement without notice.

Flux Characteristics at 350mA, TJ = 25°C Radiation Pattern Emitter Star Minimum Typical White PP6N-1LWE PP6N-1LWS 67.2 86 Warm White PP6N-1LVE PP6N-1LVS 67.2 77 Green PP6N-1LGE PP6N-1LGS 58.9 66 Blue PP6N-1LBE PP6N-1LBS 10.7 14 Amber PP6N-1LAE PP6N-1LAS 30.6 42 Red PP6N-1LRE PP6N-1LRS 30.6 40

• ProLight maintains a tolerance of ± 10% on flux and power measurements.
• Please do not drive at rated current more than 1 second without proper heat sink. Electrical Characteristics at 350mA, TJ = 25°C Temperature Thermal Coefficient of Resistance Dynamic VF (mV/ °C) Junction to Color Resistance ( Ω) ΔVF/ ΔTJ Slug (°C/ W) White 1.0 -2.0 10 Warm White 1.0 -2.0 10 Green 1.0 -2.0 10 Blue 1.0 -2.0 10 Amber 2.4 -2.0 10 Red 2.4 -2.0 10 Optical Characteristics at 350mA, TJ = 25°C
• ProLight maintains a tolerance of ± 1nm for dominant wavelength measurements.
• ProLight maintains a tolerance of ± 5% for CCT measurements. 1.9 2.2 3.1 Lambertian 2.8 3.5 4.3 Lumious Flux ΦV (lm) 1.9 2.2 3.1 Forward Voltage VF (V) Color 2.8 3.5 4.3 Part Number Min. Typ. Max. 2.8 3.5 4.3 2.8 3.5 4.3 Temperature Coefficient of Total Spectral Dominant included Viewing Half-width Wavelen gth An gle Angle Radiation (nm) (nm/ °C) (degrees) (degrees) Pattern Min. T yp. Max. Δλ1/2 ΔλD/ ΔTJ θ0.90V 2 θ1/2 White 4100 K 5500 K 10000 K --- --- 160 140 Warm White 2700 K 3300 K 4100 K --- --- 160 140 Green 515 nm 525 nm 535 nm 35 0.04 160 140 Blue 455 nm 465 nm 475 nm 25 0.04 160 140 Amber 587 nm 592 nm 597 nm 20 0.05 160 140 Red 613.5 nm 623 nm 631 nm 20 0.05 160 140 Dominant Wavelength λD, or Color Temperature CCT Lambertian Color

DC Forward Current (mA) Peak Pulsed Forward Current (mA) Average Forward Current (mA) ESD Sensitivity (HBM per MIL-STD-883E Method 3015.7) LED Junction Temperature (°C) Aluminum-core PCB Temperature (°C) Storage & Operating Temperature (°C) Soldering Temperature(°C) Photometric Luminous Flux Bin Structure Color Bin Code *When CCT is less than 3050K, T2 bin is not available. L M Q R Q R

• ProLight maintains a tolerance of ± 10% on flux and power measurements.
• The flux bin of the product may be modified for improvement without notice. Blue 13.9 18.1 Amber 39.8 51.7 10.7 13.9 Green 58.9 67.2 67.2 76.6 White/Warm White/ Green/Blue/Amber/Red 350 500 350 120 105 -40 to +105 > ±500V White Minimum Photometric Flux (lm) Maximum Photometric Flux (lm) 67.2 76.6 30.6 39.8 76.6 87.4 67.2 76.6 Red 39.8 51.7 235°C Warm White 30.6 39.8 76.6 87.4

White and Warm White Binning Structure Graphical Representation 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 y x 10000 K 7000 K 6300 K 5650 K 5000 K 4500 K 4100 K 3800 K 3500 K 3250 K 3050 K

2850 K 2700 K

(BBL) Warm White White

Bin Code x y Typ. CCT (K) Bin Code x y Typ. CCT (K) 0.378 0.382 0.329 0.345 0.374 0.366 0.316 0.333 0.360 0.357 0.315 0.344 0.362 0.372 0.329 0.357 0.382 0.397 0.329 0.331 0.378 0.382 0.329 0.320 0.362 0.372 0.318 0.310 0.365 0.386 0.317 0.320 0.362 0.372 0.308 0.311 0.360 0.357 0.305 0.322 0.344 0.344 0.316 0.333 0.346 0.359 0.317 0.320 0.365 0.386 0.305 0.322 0.362 0.372 0.303 0.333 0.346 0.359 0.315 0.344 0.347 0.372 0.316 0.333 0.329 0.331 0.308 0.311 0.329 0.345 0.317 0.320 0.346 0.359 0.319 0.300 0.344 0.344 0.311 0.293 0.329 0.345 0.308 0.311 0.329 0.357 0.283 0.284 0.347 0.372 0.274 0.301 0.346 0.359 0.303 0.333 0.329 0.345 0.308 0.311 0.329 0.331 0.311 0.293 0.317 0.320 0.290 0.270 0.316 0.333 0.283 0.284

• Tolerance on each color bin (x , y) is ± 0.01 Note: Although several bins are outlined, product availability in a particular bin varies by production run and by product performance. Not all bins are available in all colors. W0 5970 WP 5970 XP 6650 VN 5320 Y0 8000 V0 5320

4750 X0 6650U0

CCT 4500KCCT 5000KCCT 5500KCCT 6000KCCT 7000KCCT 8000K

Bin Code x y Typ. CCT (K) Bin Code x y Typ. CCT (K) 0.453 0.416 0.409 0.400 0.444 0.399 0.402 0.382 0.459 0.403 0.416 0.389 0.467 0.419 0.424 0.407 0.460 0.430 0.414 0.414 0.453 0.416 0.409 0.400 0.467 0.419 0.424 0.407 0.473 0.432 0.430 0.421 0.438 0.412 0.392 0.391 0.429 0.394 0.387 0.374 0.444 0.399 0.402 0.382 0.453 0.416 0.409 0.400 0.444 0.426 0.414 0.414 0.438 0.412 0.409 0.400 0.453 0.416 0.392 0.391 0.460 0.430 0.397 0.406 0.424 0.407 0.392 0.391 0.416 0.389 0.387 0.374 0.429 0.394 0.374 0.366 0.438 0.412 0.378 0.382 0.430 0.421 0.397 0.406 0.424 0.407 0.392 0.391 0.438 0.412 0.378 0.382 0.444 0.426 0.382 0.397

• Tolerance on each color bin (x , y) is ± 0.01 Note: Although several bins are outlined, product availability in a particular bin varies by production run and by product performance. Not all bins are available in all colors. 36502950N0 P0 3150 S0 3950 M0 2770 Q0 3370 M1 2770 Q1 3370

3150 S1 3950

CCT 4500KCCT 5000KCCT 5500KCCT 6000KCCT 7000KCCT 8000K

Dominant Wavelength Bin Structure A A

• ProLight maintains a tolerance of ± 1nm for dominant wavelength measurements. Note: Although several bins are outlined, product availability in a particular bin varies by production run and by product performance. Not all bins are available in all colors. Wavelength (nm) Wavelength (nm) Amber Red Blue Green 515 520 520 525 530 535 525 530 475470 455 460 465 460 465 470 594.5 589.5 592.0 594.5 597.0 587.0 589.5 592.0 620.5 631.0 613.5 620.5 Minimum Dominant Maximum DominantBin CodeColor

Color Spectrum, TJ = 25°C 1. White 2. Warm White 3. Blue、Green、Ambe r、Red 0.0 0.2 0.4 0.6 0.8 1.0 350 400 450 500 550 600 650 700 750 800 850 Wavelength(nm) Relative Spectral Power Distribution Standard Eye Response Cruve White 0.0 0.2 0.4 0.6 0.8 1.0 350 400 450 500 550 600 650 700 750 800 850 Wavelength(nm) Relative Spectral Power Distribution Standard Eye Response Cruve Warm White 0.0 0.2 0.4 0.6 0.8 1.0 400 450 500 550 600 650 700 Wavelength(nm) Relative Spectral Power Distribution Blue Green Amber Red

Light Output Characteristics Relative Light Output vs. Junction Temperature at 350mA 100 120 140 160 12345678 Junction Temperature, TJ (℃) Relative Light Output (%) -20 0 20 40 60 80 100 120 White, Warm White Green Blue 100 120 140 160 12345678 Junction Temperature, TJ (℃) Relative Light Output (%) -20 0 20 40 60 80 100 120 Red Amber

Forward Current Characteristics, TJ = 25°C 1. Forward Voltage vs. Forward Current 2. Forward Current vs. Normalized Relative Luminous Flux 100 150 200 250 300 350 400 0 0.5 1 1.5 2 2.5 3 Forward Voltage (V) Average Forward Current (mA) Red, Amber 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 100 200 300 400 Forward Current (mA) Relative Luminous Flux White, Warm White, Green, Blue 100 150 200 250 300 350 400 0 0.5 1 1.5 2 2.5 3 3.5 4 Forward Voltage (V) Average Forward Current (mA) White, Warm White, Green, Blue 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 100 200 300 400 Forward Current (mA) Relative Luminous Flux Red, Amber

Ambient Temperature vs. Maximum Forward Current 1. White, Warm White, Green, Blue (TJMAX = 120°C) 2. Red, Amber (TJMAX = 120°C) 100 150 200 250 300 350 400 0 25 50 75 100 125 150 Ambient Temperature (℃) Forward Current (mA) RθJ-A = 60°C/W RθJ-A = 50°C/W RθJ-A = 30°C/W RθJ-A = 40°C/W 100 150 200 250 300 350 400 0 25 50 75 100 125 150 Ambient Temperature (℃) Forward Current (mA) RθJ-A = 60°C/W RθJ-A = 50°C/W RθJ-A = 30°C/W RθJ-A = 40°C/W

Typical Representative Spatial Radiation Pattern Lambertian Radiation Pattern 100 -100 -80 -60 -40 -20 0 20 40 60 80 100 Angular Displacement (Degrees) Relative Intensity (%)

Moisture Sensitivity Level - JEDEC 2a Level Time Conditions Time (hours) Conditions Time (hours) Conditions 60% RH 60% RH 60% RH

• The standard soak time includes a default value of 24 hours for semiconductor manufature's exposure time (MET) between bake and bag and includes the maximum time allowed out of the bag at the distributor's facility.
• Table below presents the moisture sensitivity level definitions per IPC/JEDEC's J-STD-020C. Level Time Conditions Time (hours) Conditions Time (hours) Conditions ≤30°C / 85 °C / 85% RH 85% RH ≤30°C / 85 °C / 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH Time on Label ≤30°C / Time on Label 30°C / (TOL) 60% RH (TOL) 60% RH NA NA NA 6 NA 5a 24 hours 48 +2/-0 10 +0.5/-0 5 48 hours 72 +2/-0 15 +0.5/-0 4 72 hours 96 +2/-0 20 +0.5/-0 3 168 hours 192 +5/-0 40 +1/-0 2a 4 weeks 696 +5/-0 120 +1/-0 2 1 year 168 +5/-0 NA

1 Unlimited 168 +5/-0 NA

Floor Life Standard Accelerated Environment 2a 4 weeks 696 +5/-0 120 +1/-0 Floor Life Standard Accelerated Environment Soak Requirements

Qualification Reliability Testing Stress Test Stress Duration Failure Criteria Room Temperature Operating Life (RTOL) Wet High Temperature Operating Life (WHTOL) Wet High Temperature Storage Life (WHTSL) High Temperature Storage Life (HTSL) Low Temperature Storage Life (LTSL) Non-operating Temperature Cycle (TMCL) Non-operating Thermal Shock (TMSK) Variable Vibration Frequency Solder Heat Resistance (SHR) Solder coverage on lead Notes: 1. Depending on the maximum derating curve. 2. Criteria for judging failure Min. I F = max DC - VR = 5V - * The test is performed after the LED is cooled down to the room temperature. 3. A failure is an LED that is open or shorted. 1000 hours Note 2 Note 3 Note 3 Note 2 Note 2 1000 hours 1000 hours 200 cycles 200 cycles Note 3 Note 3 Note 2 Note 2 1000 hours 1000 hours Note 2 Note 2 Natural Drop <20 sec. transfer 1500 G, 0.5 msec. pulse, 5 shocks each 6 axis On concrete from 1.2 m, 3X Mechanical Shock -40°C, non-operating -40°C to 120°C, 30 min. dwell, <5 min. transfer -40°C to 120°C, 20 min. dwell, Stress Conditions 25°C, I F = max DC (Note 1) 85°C/60%RH, IF = max DC (Note 1) 110°C, non-operating 85°C/85%RH, non-operating 10-2000-10 Hz, log or linear sweep rate, 20 G about 1 min., 1.5 mm, 3X/axis 260°C ± 5°C, 10 sec. Steam age for 16 hrs., then solder dip Test Condition Solderability 50 μA -Initial Level x 0.7 Item Reverse Current (IR) Max. Initial Level x 1.1 at 260°C for 5 sec. IF = max DC Criteria for Judgement Forward Voltage (VF) Luminous Flux or Radiometric Power (ΦV)

Recommended Solder Pad Design

• All dimensions are in millimeters.
• Electrical isolation is required between Slug and Solder Pad.

Reflow Soldering Condition

• All temperatures refer to topside of the package, measured on the package body surface.
• Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a heat plate should be used. It should be confirmed beforehand whether the characteristics of LEDs will or will not be damaged by repairing.
• Reflow soldering should not be done more than two times.
• When soldering, do not put stress on the LEDs during heating.
• After soldering, do not warp the circuit board. 100 °C 150 °C 60-120 seconds 3 °C / second max. 183°C 60-150 seconds 235°C 20 seconds Average ramp-down rate (TP to Tsmax) Time 25°C to Peak Temperature classification temperature (TC) 6 °C/second max. 6 minutes max. Profile Feature Average Ramp-Up Rate (Tsmax to TP) Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP) 20 secondsTime (tP) within 5°C of the specified 138°C 20-50 seconds 185°C Sn-Pb Eutectic Assembly 3 °C/second max. 4 minutes max. (58Bi-42Sn Eutectic Alloy) Low-Temp. & Pb-Free Assembly 90 °C 120 °C 60-120 seconds 2 °C / second max.

Heat Plate Soldering Condition

• Heat plate temperature: 230°C max for Lead Solder and 230°C max for Lead-Free Solder.
• We recommend using the 58Bi-42Sn eutectic alloy for low-temp. and lead free soldering (melting point = 138 °C).
• When soldering, do not put stress on the LEDs during heating.
• After soldering, do not warp the circuit board. MCPCB Place Emitter on MCPCB. Put MCPCB on Heat Plate. Place Solder Wire to the solder pad of MCPCB. MCPCB Solder Paste Heat Plate (1) Soldering Process for Solder Paste (2) Soldering Process for Solder Wire Heat Plate Heat Plate Heat Plate Solder Wire Put Emitter on MCPCB. Take the MCPCB out from Heat Plate within 10 seconds. Emitter Emitter Use Solder Mask to print Solder Paste on MCPCB. Put MCPCB on Heat Plate until Solder Paste melt. The Solder Paste sould be melted within 10 seconds. Take out MCPCB out from Heat Plate within 15 seconds.

Notes: 1. Drawing not to scale. 2. All dimensions are in millimeters. 3. General tolerance is ± 0.10 mm.

178 ± 1 3 ± 0.5 4 ± 0.5 5 ± 0.5 60 ± 0.5 13.2 ± 0.5 16.2 ± 0.5 Φ 13.1 ± 0.5 Φ 21 ± 0.5 Notes: 1. Empty component pockets sealed with top cover tape. 2. 250 or 500 pieces per reel. 3. Drawing not to scale. 4. All dimensions are in millimeters.

Notes: 1. 20 pieces per tube. 2. Drawing not to scale. 3. All dimensions are in millimeters. 4. All dimendions without tolerances are for reference only. **Please do not open the moisture barrier bag (MBB) more than one week. This may cause the leads of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening the MBB. The recommended storage conditions are temperature 5 to 30°C and humidity less than 40% RH.

Handling of Silicone Lens LEDs

• Storage Please do not open the moisture barrier bag (MBB) more than one week. This may cause the leads of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening the MBB. The recommended storage conditions are temperature 5 to 30°C and humidity less than 40% RH. It is also recommended to return the LEDs to the MBB and to reseal the MBB.
• The slug is is not electrically neutral. Therefore, we recommend to isolate the heat sink.
• The slug is to be soldered. If not, please use the heat conductive adhesive.
• Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering.
• Please avoid rapid cooling after soldering.
• Components should not be mounted on warped direction of PCB.
• Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a heat plate should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
• This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When cleaning is required, isopropyl alcohol should be used.
• When the LEDs are illuminating, operating current should be decide after considering the package maximum temperature.
• The appearance, specifications and flux bin of the product may be modified for improvement without notice. Please refer to the below website for the latest datasheets. h ttp://www.prolightopto.com/ Notes for handling of silicone lens LEDs
• Please do not use a force of over 3kgf impact or pressure on the silicone lens, otherwise it will cause a catastrophic failure.
• The LEDs should only be picked up by making contact with the sides of the LED body.
• Avoid touching the silicone lens especially by sharp tools such as Tweezers.
• Avoid leaving fingerprints on the silicone lens.
• Please store the LEDs away from dusty areas or seal the product against dust.
• When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the silicone lens must be prevented.
• Please do not mold over the silicone lens with another resin. (epoxy, urethane, etc) ╳ ○