PM2B-4LVE-SD

PM2B-4LXE-SD ELITE | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 16

Technical content

Features

• High flux per LED
• Good color uniformity
• Low-temp. & lead free reflow soldering
• RoHS compliant
• More energy efficient than incandescent and most halogen lamps
• Low Voltage DC operated
• Instant light (less than 100ns)
• No UV
• Superior ESD protection Typical Applications
• Reading lights (car, bus, aircraft)
• Portable (flashlight, bicycle)
• Uplighters/Downlighters
• Decorative/Entertainment
• Bollards/Security/Garden
• Cove/Undershelf/Task
• Indoor/Outdoor Commercial and Residential Architectural
• Automotive Ext (Stop-Tail-Turn, CHMSL, Mirror Side Repeat)
• LCD backlights 1 2010/04

Emitter Mechanical Dimensions Notes: 1. The Anode side of the device is denoted by a hole in the lead frame. 2. Electrical insulation between the case and the board is required --- slug of device is not electrically neutral. Do not electrically connect either the anode or cathode to the slug. 3. Drawing not to scale. 4. All dimensions are in millimeters. 5. All dimendions without tolerances are for reference only. 6. Please do not bend the leads of the LED, otherwise it will damage the LED. 7. Please do not use a force of over 3kgf impact or pressure on the lens of the LED, otherwise it will cause a catastrophic failure. *The appearance and specifications of the product may be modified for improvement without notice. TOP VIEW BOTTOM VIEW

Flux Characteristics at 1000mA, TJ = 25°C Test Refer Refer @1000mA @700mA @350mA White PM2B-4LWE-SD 210 158 90 Warm White PM2B-4LVE-SD 190 143 82

• ProLight maintains a tolerance of ± 10% on flux and power measurements.
• Please do not drive at rated current more than 1 second without proper heat sink. Electrical Characteristics at 1000mA, TJ = 25°C Color Min. Typ. Max. White 3.35 3.8 4.6 Warm White 3.35 3.8 4.6 Optical Characteristics at 1000mA, TJ = 25°C Total included Viewing Angle Angle (degrees) (degrees) Min. Typ. Max. θ0.90V 2 θ1/2 White 4100 K 5500 K 10000 K 180 130 Warm White 2700 K 3300 K 4100 K 180 130
• ProLight maintains a tolerance of ± 1nm for dominant wavelength measurements.
• ProLight maintains a tolerance of ± 5% for CCT measurements. or Color Temperature CCT Color Forward Voltage VF (V) Thermal Resistance Junction to Slug (°C/ W) Lambertian Lumious Flux ΦV (lm) Color Part Number Emitter Radiation Pattern Dominant Wavelength λD,

DC Forward Current (mA) Peak Pulsed Forward Current (mA) Average Forward Current (mA) ESD Sensitivity (HBM per MIL-STD-883E Method 3015.7) LED Junction Temperature (°C) Aluminum-core PCB Temperature (°C) Storage & Operating Temperature (°C) Soldering Temperature(°C) Photometric Luminous Flux Bin Structure

• ProLight maintains a tolerance of ± 10% on flux and power measurements.
• The flux bin of the product may be modified for improvement without notice. 【1】The rest of color bins are not 100% ready for order currently. Please ask for quote and order possibility. Forward Voltage Bin Structure Color Bin Code D E F G H D E F G H
• ProLight maintains a tolerance of ± 0.1 for Voltage measurements. Note: Although several bins are outlined, product availability in a particular bin varies by production run and by product performance. Not all bins are available in all colors. Warm White White White/Warm White 1000 1250 1000 ±4000V (Class III) 168.4 192 105 Color 192 【1】 Available Color Bins 249.6 -40 to +105 All Sx, Rx, Qx, Px【1】 135 168.4 218.9 Bin Code Minimum Photometric Flux (lm) Maximum Photometric Flux (lm) 235°C 4.35 192 218.9 192 218.9 Minimum Voltage (V) Maximum Voltage (V) 4.60 All All 4.35 White 3.35 3.60 3.60 3.85 3.85 4.10 4.10 4.35 4.60 Warm White 3.35 3.60 3.60 3.85 3.85 4.10 4.10 4.35

White and Warm White Binning Structure Graphical Representation 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 y x 10000 K 7000 K 6300 K 5650 K 5000 K 4500 K 4100 K 3800 K 3500 K 3250 K 3050 K

2850 K 2700 K

(BBL) Warm White White

Bin Code x y Typ. CCT (K) Bin Code x y Typ. CCT (K) 0.378 0.382 0.329 0.345 0.374 0.366 0.316 0.333 0.360 0.357 0.315 0.344 0.362 0.372 0.329 0.357 0.382 0.397 0.329 0.331 0.378 0.382 0.329 0.320 0.362 0.372 0.318 0.310 0.365 0.386 0.317 0.320 0.362 0.372 0.308 0.311 0.360 0.357 0.305 0.322 0.344 0.344 0.316 0.333 0.346 0.359 0.317 0.320 0.365 0.386 0.305 0.322 0.362 0.372 0.303 0.333 0.346 0.359 0.315 0.344 0.347 0.372 0.316 0.333 0.329 0.331 0.308 0.311 0.329 0.345 0.317 0.320 0.346 0.359 0.319 0.300 0.344 0.344 0.311 0.293 0.329 0.345 0.308 0.311 0.329 0.357 0.283 0.284 0.347 0.372 0.274 0.301 0.346 0.359 0.303 0.333 0.329 0.345 0.308 0.311 0.329 0.331 0.311 0.293 0.317 0.320 0.290 0.270 0.316 0.333 0.283 0.284

• Tolerance on each color bin (x , y) is ± 0.01 Note: Although several bins are outlined, product availability in a particular bin varies by production run and by product performance. Not all bins are available in all colors. W0 5970 YA 8000 V0 5320 XP 6650 VN 5320 Y0 8000 U0 4750 X0 6650 UN 4750 XN 6650 T0 4300 WN 5970 TN 4300 WP 5970 Y0 V1V0YA WAX1X0 W0 CCT 4500KCCT 5000KCCT 5500KCCT 6000KCCT 7000KCCT 8000K

Bin Code x y Typ. CCT (K) Bin Code x y Typ. CCT (K) 0.453 0.416 0.409 0.400 0.444 0.399 0.402 0.382 0.459 0.403 0.416 0.389 0.467 0.419 0.424 0.407 0.460 0.430 0.414 0.414 0.453 0.416 0.409 0.400 0.467 0.419 0.424 0.407 0.473 0.432 0.430 0.421 0.438 0.412 0.392 0.391 0.429 0.394 0.387 0.374 0.444 0.399 0.402 0.382 0.453 0.416 0.409 0.400 0.444 0.426 0.414 0.414 0.438 0.412 0.409 0.400 0.453 0.416 0.392 0.391 0.460 0.430 0.397 0.406 0.424 0.407 0.392 0.391 0.416 0.389 0.387 0.374 0.429 0.394 0.374 0.366 0.438 0.412 0.378 0.382 0.430 0.421 0.397 0.406 0.424 0.407 0.392 0.391 0.438 0.412 0.378 0.382 0.444 0.426 0.382 0.397

• Tolerance on each color bin (x , y) is ± 0.01 Note: Although several bins are outlined, product availability in a particular bin varies by production run and by product performance. Not all bins are available in all colors. P0 3150 S0 3950 P1 3150 S1 3950 N0 2950 R0 3650 N1 2950 R1 3650 M0 2770 Q0 3370 M1 2770 Q1 3370 Y0 V1V0YA WAX1X0 W0 CCT 4500KCCT 5000KCCT 5500KCCT 6000KCCT 7000KCCT 8000K

Color Spectrum, TJ = 25°C 1. White 2. Warm White 0.0 0.2 0.4 0.6 0.8 1.0 350 400 450 500 550 600 650 700 750 800 850 Relative Spectral Power Distribution Wavelength(nm) Standard Eye Response Cruve White 0.0 0.2 0.4 0.6 0.8 1.0 350 400 450 500 550 600 650 700 750 800 850 Relative Spectral Power Distribution Wavelength(nm) Standard Eye Response Cruve Warm White

Light Output Characteristics Relative Light Output vs. Junction Temperature at 1000mA Forward Current Characteristics, TJ = 25°C 100 120 140 160 1 2 3 4 5 6 7 8 Relative Light Output (%) Junction Temperature, TJ (℃) -20 0 20 40 60 80 100 120 White, Warm White 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 200 400 600 800 1000 Relative Luminous Flux Average Forward Current (mA) 200 400 600 800 1000 0 1 2 3 4 5 Average Forward Current (mA) Forward Voltage (V) Fig 1. Forward Current vs. Forward Voltage for White, Warm White. Fig 2. Relative Luminous Flux vs. Forward Current for White, Warm White at Tj=25℃ maintained.

Ambient Temperature vs. Maximum Forward Current 1. White, Warm White (TJMAX = 135°C) Typical Representative Spatial Radiation Pattern Lambertian Radiation Pattern 200 400 600 800 1000 1200 0 25 50 75 100 125 150 175 Forward Current (mA) Ambient Temperature (℃) RθJ-A = 25°C/W RθJ-A = 20°C/W RθJ-A = 15°C/W 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Relative Intensity Angular Displacement (Degrees)

Qualification Reliability Testing Stress Test Stress Duration Failure Criteria Room Temperature Operating Life (RTOL) Wet High Temperature Operating Life (WHTOL) Wet High Temperature Storage Life (WHTSL) High Temperature Storage Life (HTSL) Low Temperature Storage Life (LTSL) Non-operating Temperature Cycle (TMCL) Non-operating Thermal Shock (TMSK) Variable Vibration Frequency Solder coverage on lead Notes: 1. Depending on the maximum derating curve. 2. Criteria for judging failure Min. IF = max DC -- VR = 5V -- * The test is performed after the LED is cooled down to the room temperature. 3. A failure is an LED that is open or shorted. Note 3 Note 2 Note 2 1000 hours Note 2 Note 3 Note 3 Note 2 Note 2 1000 hours Note 2 Note 2 <5 min. transfer -40°C to 120°C, 20 min. dwell, 1000 hours 200 cycles 200 cycles 1000 hours 1000 hours Natural Drop <20 sec. transfer 1500 G, 0.5 msec. pulse, 5 shocks each 6 axis On concrete from 1.2 m, 3X Mechanical Shock 10-2000-10 Hz, log or linear sweep rate, 20 G about 1 min., 1.5 mm, 3X/axis Steam age for 16 hrs., then solder dip Stress Conditions 25°C, IF = max DC (Note 1) 85°C/60%RH, IF = max DC (Note 1) 110°C, non-operating 85°C/85%RH, non-operating -40°C, non-operating -40°C to 120°C, 30 min. dwell, Test Condition Solderability 50 μA --Initial Level x 0.7 Item Reverse Current (IR) Max. Initial Level x 1.1 at 260°C for 5 sec. IF = max DC Criteria for Judgement Forward Voltage (VF) Luminous Flux or Radiometric Power (ΦV)

Recommended Solder Pad Design

• All dimensions are in millimeters.
• Electrical isolation is required between Slug and Solder Pad.

Reflow Soldering Condition

• All temperatures refer to topside of the package, measured on the package body surface.
• Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a heat plate should be used. It should be confirmed beforehand whether the characteristics of LEDs will or will not be damaged by repairing.
• Reflow soldering should not be done more than two times.
• When soldering, do not put stress on the LEDs during heating.
• After soldering, do not warp the circuit board. Sn-Pb Eutectic Assembly 3 °C/second max. 4 minutes max. (58Bi-42Sn Eutectic Alloy) Low-Temp. & Pb-Free Assembly 90 °C 120 °C 60-120 seconds 2 °C / second max. Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP) 20 secondsTime (tP) within 5°C of the specified 138°C 20-50 seconds 185°C Profile Feature Average Ramp-Up Rate (Tsmax to TP) Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) Average ramp-down rate (TP to Tsmax) Time 25°C to Peak Temperature classification temperature (TC) 6 °C/second max. 6 minutes max. 100 °C 150 °C 60-120 seconds 3 °C / second max. 183°C 60-150 seconds 235°C 20 seconds

Heat Plate Soldering Condition

• Heat plate temperature: 230°C max for Lead Solder and 230°C max for Lead-Free Solder.
• We recommend using the 58Bi-42Sn eutectic alloy for low-temp. and lead free soldering (melting point = 138 °C).
• When soldering, do not put stress on the LEDs during heating.
• After soldering, do not warp the circuit board. Manual Hand Soldering
• Solder tip temperature: 230°C max for Lead Solder and 260°C max for Lead-Free Solder.
• Avoiding damage to the emitter or to the MCPCB dielectric layer. Damage to the epoxy layer can cause
• Do not let the solder contact from solder pad to back-side of MCPCB. This one will cause a short circuit and damage emitter. a short circuit in the array.
• For prototype builds or small series production runs it possible to place and solder the emitters by hand. Figure 8a. Lead Solder Temperature ProfileFigure 8b. Lead-free Solder Temperature Profile Place Emitter on MCPCB. Put MCPCB on Heat Plate. Place Solder Wire to the solder pad of MCPCB. MCPCB MCPCB Solder Paste (1) Soldering Process for Solder Paste (2) Soldering Process for Solder Wire Heat Plate Heat Plate Solder Wire Put Emitter on MCPCB. Take the MCPCB out from Heat Plate within 10 seconds. Thermal Conductive Glue MCPCB Place Emitter on the MCPCB. Use Soldering Iron to solder the leads of Emtter within 5 seconds. Use Solder Mask to print Solder Paste on MCPCB. Put MCPCB on Heat Plate until Solder Paste melt. The Solder Paste sould be melted within 10 seconds. Take out MCPCB out from Heat Plate within 15 seconds. Place Thermal Comductive Glue on the MCPCB. Emitter Heat Plate Emitter Heat Plate Emitter Soldering Iron Solder Wire

Notes: 1. 50 pieces per tube. 2. Drawing not to scale. 3. All dimensions are in millimeters. 4. All dimendions without tolerances are for reference only. **Please do not open the moisture barrier bag (MBB) more than one week. This may cause the leads of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening the MBB. The recommended storage conditions are temperature 5 to 30°C and humidity less than 40% RH.

• Storage Please do not open the moisture barrier bag (MBB) more than one week. This may cause the leads of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening the MBB. The recommended storage conditions are temperature 5 to 30°C and humidity less than 40% RH. It is also recommended to return the LEDs to the MBB and to reseal the MBB.
• The slug is is not electrically neutral. Therefore, we recommend to isolate the heat sink.
• The slug is to be soldered. If not, please use the heat conductive adhesive.
• Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering.
• Please avoid rapid cooling after soldering.
• Components should not be mounted on warped direction of PCB.
• Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a heat plate should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
• This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When cleaning is required, isopropyl alcohol should be used.
• When the LEDs are illuminating, operating current should be decide after considering the package maximum temperature.
• The appearance, specifications and flux bin of the product may be modified for improvement without notice. Please refer to the below website for the latest datasheets. http://www.prolightopto.com/