PM2A-1LXX ELITE | Alldatasheet

Document overview

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Technical content

Features

  • High flux per LED
  • Various colors
  • Good color uniformity
  • RoHS compliant
  • More energy efficient than incandescent and most halogen lamps
  • Low Voltage DC operated
  • Instant light (less than 100ns)
  • No UV
  • Superior ESD protection Typical Applications
  • Reading lights (car, bus, aircraft)
  • Portable (flashlight, bicycle)
  • Uplighters/Downlighters
  • Decorative/Entertainment
  • Bollards/Security/Garden
  • Cove/Undershelf/Task
  • Indoor/Outdoor Commercial and Residential Architectural
  • Automotive Ext (Stop-Tail-Turn, CHMSL, Mirror Side Repeat)
  • LCD backlights 1 2009/08 Technology Corporation

Emitter Mechanical Dimensions Notes: 1. The Anode side of the device is denoted by a hole in the lead frame. 2. Electrical insulation between the case and the board is required --- slug of device is not electrically neutral. Do not electrically connect either the anode or cathode to the slug. 3. Drawing not to scale. 4. All dimensions are in millimeters. 5. All dimendions without tolerances are for reference only. 6. Please do not bend the leads of the LED, otherwise it will damage the LED. 7. Please do not use a force of over 3kgf impact or pressure on the lens of the LED, otherwise it will cause a catastrophic failure. *The appearance and specifications of the product may be modified for improvement without notice. TOP VIEW BOTTOM VIEW

Star Mechanical Dimensions Notes: 1. Slots in aluminum-core PCB for M3 or #4 mounting screw. 2. Electrical interconnection pads labeled on the aluminum-core PCB with "+" and "-" to denote positive and negative, respectively. All positive pads are interconnected, as are all negative pads, allowing for flexibility in array interconnection. 3. Drawing not to scale. 4. All dimensions are in millimeters. 5. All dimendions without tolerances are for reference only. 6. Please do not use a force of over 3kgf impact or pressure on the lens of the LED, otherwise it will cause a catastrophic failure. *The appearance and specifications of the product may be modified for improvement without notice.

Flux Characteristics at 350mA, TJ = 25°C Radiation Pattern Emitter Star Minimum Typical White PM2A-1LWE PM2A-1LWS 76.6 90 Warm White PM2A-1LVE PM2A-1LVS 67.2 81 Green PM2A-1LGE PM2A-1LGS 58.9 70 Blue PM2A-1LBE PM2A-1LBS 10.7 14 Amber PM2A-1LAE PM2A-1LAS 30.6 42 Red PM2A-1LRE PM2A-1LRS 30.6 40

  • ProLight maintains a tolerance of ± 10% on flux and power measurements.
  • Please do not drive at rated current more than 1 second without proper heat sink. Electrical Characteristics at 350mA, TJ = 25°C Temperature Thermal Coefficient of Resistance Dynamic VF (mV/ °C) Junction to Color Resistance (Ω) ΔVF/ ΔTJ Slug (°C/ W) Amber 2.4 -2.0 10 Red 2.4 -2.0 10 Optical Characteristics at 350mA, TJ = 25°C
  • ProLight maintains a tolerance of ± 1nm for dominant wavelength measurements.
  • ProLight maintains a tolerance of ± 5% for CCT measurements. Min. Typ. Max. Lambertian Lumious Flux ΦV (lm) 1.75 2.2 3.0 1.75 2.2 3.0 Forward Voltage VF (V) Color Part Number Temperature Coefficient of Total Spectral Dominant included Viewing Half-width Wavelength Angle Angle Radiation (nm) (nm/ °C) (degrees) (degrees) Pattern Min. Typ. Max. Δλ1/2 ΔλD/ ΔTJ θ0.90V 2 θ1/2 White 4100 K 5500 K 10000 K --- --- 180 130 Warm White 2700 K 3300 K 4100 K --- --- 180 130 Green 515 nm 525 nm 535 nm 35 0.04 180 130 Blue 455 nm 465 nm 475 nm 25 0.04 180 130 Amber 587 nm 592 nm 597 nm 20 0.05 180 130 Red 613.5 nm 623 nm 631 nm 20 0.05 180 130 Dominant Wavelength λD, or Color Temperature CCT Lambertian Color

DC Forward Current (mA) Peak Pulsed Forward Current (mA) Average Forward Current (mA) ESD Sensitivity (HBM per MIL-STD-883E Method 3015.7) LED Junction Temperature (°C) Aluminum-core PCB Temperature (°C) Storage & Operating Temperature (°C) Soldering Temperature(°C) Photometric Luminous Flux Bin Structure Color Bin Code *When CCT is less than 3050K, U1 bin is not available. L M N Q R Q R

  • ProLight maintains a tolerance of ± 10% on flux and power measurements.
  • The flux bin of the product may be modified for improvement without notice. White 67.2 76.6 Warm White 76.6 87.4 99.6 87.4 18.1 23.5 Green 58.9 76.6 67.2 87.4 67.2 76.6 51.7 30.6 39.8 39.8 51.7 39.8 Red 51.7 58.9 White/Warm White/ Maximum Photometric Flux (lm)Minimum Photometric Flux (lm) 350 120 105 -40 to +105 235°C Green/Blue/Amber/Red 350 500 87.4 99.6 76.6 87.4 ±4000V (Class III) Blue 51.7 58.9 Amber 30.6 39.8 10.7 13.9 13.9 18.1

White and Warm White Binning Structure Graphical Representation 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 x y 10000 K 7000 K 6300 K 5650 K 5000 K 4500 K 4100 K 3800 K 3500 K 3250 K 3050 K

2850 K 2700 K

(BBL) Warm White White

Bin Code x y Typ. CCT (K) Bin Code x y Typ. CCT (K) 0.378 0.382 0.329 0.345 0.374 0.366 0.329 0.331 0.360 0.357 0.317 0.320 0.362 0.372 0.316 0.333 0.382 0.397 0.329 0.345 0.378 0.382 0.316 0.333 0.362 0.372 0.315 0.344 0.365 0.386 0.329 0.357 0.374 0.366 0.329 0.331 0.370 0.351 0.329 0.320 0.357 0.342 0.318 0.310 0.360 0.357 0.317 0.320 0.386 0.413 0.329 0.320 0.382 0.397 0.329 0.310 0.365 0.386 0.319 0.300 0.367 0.400 0.318 0.310 0.362 0.372 0.329 0.369 0.360 0.357 0.329 0.357 0.344 0.344 0.315 0.344 0.346 0.359 0.314 0.355 0.365 0.386 0.308 0.311 0.362 0.372 0.305 0.322 0.346 0.359 0.316 0.333 0.347 0.372 0.317 0.320 0.360 0.357 0.305 0.322 0.357 0.342 0.303 0.333 0.343 0.331 0.315 0.344 0.344 0.344 0.316 0.333 0.365 0.386 0.308 0.311 0.367 0.400 0.317 0.320 0.348 0.385 0.319 0.300 0.347 0.372 0.311 0.293 0.329 0.331 0.301 0.342 0.329 0.345 0.314 0.355 0.346 0.359 0.315 0.344 0.344 0.344 0.303 0.333 0.329 0.345 0.308 0.311 0.329 0.357 0.283 0.284 0.347 0.372 0.274 0.301 0.346 0.359 0.303 0.333 0.329 0.331 0.308 0.311 0.344 0.344 0.311 0.293 0.343 0.331 0.290 0.270 0.329 0.320 0.283 0.284 0.329 0.357 0.329 0.369 0.348 0.385 0.347 0.372

  • Tolerance on each color bin (x , y) is ± 0.01 Note: Although several bins are outlined, product availability in a particular bin varies by production run and by product performance. Not all bins are available in all colors. VM 5320

5320 Y0 8000

4300 WP 5970TP

4750 WM 5970

Bin Code x y Typ. CCT (K) Bin Code x y Typ. CCT (K) 0.453 0.416 0.409 0.400 0.444 0.399 0.402 0.382 0.459 0.403 0.416 0.389 0.467 0.419 0.424 0.407 0.460 0.430 0.414 0.414 0.453 0.416 0.409 0.400 0.467 0.419 0.424 0.407 0.473 0.432 0.430 0.421 0.459 0.403 0.416 0.389 0.444 0.399 0.402 0.382 0.436 0.384 0.396 0.367 0.451 0.389 0.410 0.374 0.471 0.451 0.421 0.433 0.460 0.430 0.414 0.414 0.473 0.432 0.430 0.421 0.486 0.455 0.438 0.440 0.438 0.412 0.392 0.391 0.429 0.394 0.387 0.374 0.444 0.399 0.402 0.382 0.453 0.416 0.409 0.400 0.444 0.426 0.414 0.414 0.438 0.412 0.409 0.400 0.453 0.416 0.392 0.391 0.460 0.430 0.397 0.406 0.444 0.399 0.387 0.374 0.429 0.394 0.383 0.360 0.422 0.379 0.396 0.367 0.436 0.384 0.402 0.382 0.454 0.446 0.421 0.433 0.444 0.426 0.414 0.414 0.460 0.430 0.397 0.406 0.471 0.451 0.402 0.423 0.424 0.407 0.392 0.391 0.416 0.389 0.387 0.374 0.429 0.394 0.374 0.366 0.438 0.412 0.378 0.382 0.430 0.421 0.397 0.406 0.424 0.407 0.392 0.391 0.438 0.412 0.378 0.382 0.444 0.426 0.382 0.397 0.429 0.394 0.387 0.374 0.416 0.389 0.383 0.360 0.410 0.374 0.370 0.351 0.422 0.379 0.374 0.366 0.438 0.440 0.402 0.423 0.430 0.421 0.397 0.406 0.444 0.426 0.382 0.397 0.454 0.446 0.386 0.413

  • Tolerance on each color bin (x , y) is ± 0.01 Note: Although several bins are outlined, product availability in a particular bin varies by production run and by product performance. Not all bins are available in all colors. PM 3950 S1 3950 SA 3950 P1 3150 PA 3150

2950 R1 3650

3150 SM 3950

Dominant Wavelength Bin Structure A A

  • ProLight maintains a tolerance of ± 1nm for dominant wavelength measurements. Note: Although several bins are outlined, product availability in a particular bin varies by production run and by product performance. Not all bins are available in all colors. Bin CodeColor 592.0 620.5 631.0 613.5 620.5 Minimum Dominant Maximum Dominant 460 465 470 594.5 589.5 592.0 594.5 597.0 587.0 589.5 525 530 535 525 530 475470 455 460 465 Wavelength (nm) Wavelength (nm) Amber Red Blue Green 515 520 520

Forward Voltage Bin Structure Color Bin Code A B D E F A B D E F A B D E F A B D E F A B D E F A B D E F

  • ProLight maintains a tolerance of ± 0.1 for Voltage measurements. Note: Although several bins are outlined, product availability in a particular bin varies by production run and by product performance. Not all bins are available in all colors. 3.60 3.10 3.35 3.35 3.60 2.75 3.00 3.35 3.60 3.853.60 3.10 3.00 Red 1.75 2.00 2.00 2.25 2.25 2.50 2.50 2.75 Amber 1.75 2.00 2.00 2.25 2.25 2.50 2.50 2.75 2.75 Blue 2.85 3.10 3.60 3.85 3.85 4.10 Green 2.85 3.10 3.10 3.35 3.60 3.85 3.85 4.10 3.35 Warm White 2.85 3.10 3.60 3.85 3.85 4.10 3.35 3.35 3.60 Minimum Voltage (V) Maximum Voltage (V) White 2.85 3.10 3.10 3.35 3.85 4.10

Color Spectrum, TJ = 25°C 1. White 2. Warm White 3. Blue、Green、Ambe r、Red 0.0 0.2 0.4 0.6 0.8 1.0 350 400 450 500 550 600 650 700 750 800 850 Wavelength(nm) Relative Spectral Power Distribution Standard Eye Response Cruve White 0.0 0.2 0.4 0.6 0.8 1.0 350 400 450 500 550 600 650 700 750 800 850 Wavelength(nm) Relative Spectral Power Distribution Standard Eye Response Cruve Warm White 0.0 0.2 0.4 0.6 0.8 1.0 400 450 500 550 600 650 700 Wavelength(nm) Relative Spectral Power Distribution Blue Green Amber Red

Light Output Characteristics Relative Light Output vs. Junction Temperature at 350mA 100 120 140 160 12345678 Junction Temperature, T J (℃) Relative Light Output (%) -20 0 20 40 60 80 100 120 White, Warm White Green Blue 100 120 140 160 12345678 Junction Temperature, T J (℃) Relative Light Output (%) -20 0 20 40 60 80 100 120 Red Amber

Forward Current Characteristics, TJ = 25°C 1. Forward Voltage vs. Forward Current 2. Forward Current vs. Normalized Relative Luminous Flux 100 150 200 250 300 350 400 0 0.5 1 1.5 2 2.5 3 Forward Voltage (V) Average Forward Current (mA) Red, Amber 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 100 200 300 400 Forward Current (mA) Relative Luminous Flux White, Warm White, Green, Blue 100 150 200 250 300 350 400 0 0.5 1 1.5 2 2.5 3 3.5 4 Forward Voltage (V) Average Forward Current (mA) White, Warm White, Green, Blue 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 100 200 300 400 Forward Current (mA) Relative Luminous Flux Red, Amber

Ambient Temperature vs. Maximum Forward Current 1. White, Warm White, Green, Blue (TJMAX = 120°C) 2. Red, Amber (TJMAX = 120°C) 100 150 200 250 300 350 400 0 25 50 75 100 125 150 Ambient Temperature (℃) Forward Current (mA) RθJ-A = 60°C/W RθJ-A = 50°C/W RθJ-A = 30°C/W RθJ-A = 40°C/W 100 150 200 250 300 350 400 0 25 50 75 100 125 150 Ambient Temperature (℃) Forward Current (mA) RθJ-A = 60°C/W RθJ-A = 50°C/W RθJ-A = 30°C/W RθJ-A = 40°C/W

Typical Representative Spatial Radiation Pattern Lambertian Radiation Pattern 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Angular Displacement (Degrees) Relative Intensity

Qualification Reliability Testing Stress Test Stress Duration Failure Criteria Room Temperature Operating Life (RTOL) Wet High Temperature Operating Life (WHTOL) Wet High Temperature Storage Life (WHTSL) High Temperature Storage Life (HTSL) Low Temperature Storage Life (LTSL) Non-operating Temperature Cycle (TMCL) Non-operating Thermal Shock (TMSK) Variable Vibration Frequency Solder coverage on lead Notes: 1. Depending on the maximum derating curve. 2. Criteria for judging failure Min. I F = max DC - VR = 5V - * The test is performed after the LED is cooled down to the room temperature. 3. A failure is an LED that is open or shorted. at 260°C for 5 sec. IF = max DC Criteria for Judgement Forward Voltage (VF) Luminous Flux or Radiometric Power (ΦV) Test Condition Solderability 50 μA -Initial Level x 0.7 Item Reverse Current (IR) Max. Initial Level x 1.1 10-2000-10 Hz, log or linear sweep rate, 20 G about 1 min., 1.5 mm, 3X/axis Steam age for 16 hrs., then solder dip Stress Conditions 25°C, IF = max DC (Note 1) 85°C/60%RH, IF = max DC (Note 1) 110°C, non-operating 85°C/85%RH, non-operating -40°C, non-operating -40°C to 120°C, 30 min. dwell, <5 min. transfer -40°C to 120°C, 20 min. dwell, Natural Drop <20 sec. transfer 1500 G, 0.5 msec. pulse, 5 shocks each 6 axis On concrete from 1.2 m, 3X Mechanical Shock 1000 hours 1000 hours Note 2 Note 2 Note 3 Note 2 Note 2 1000 hours Note 2 Note 3 Note 3 Note 2 Note 2 1000 hours 1000 hours 200 cycles 200 cycles

Recommended Solder Pad Design

  • All dimensions are in millimeters.
  • Electrical isolation is required between Slug and Solder Pad.

Heat Plate Soldering Condition

  • Heat plate temperature: 230°C max for Lead Solder and 230°C max for Lead-Free Solder.
  • We recommend using the 58Bi-42Sn eutectic alloy for low-temp. and lead free soldering (melting point = 138 °C).
  • When soldering, do not put stress on the LEDs during heating.
  • After soldering, do not warp the circuit board. Manual Hand Soldering
  • Solder tip temperature: 230°C max for Lead Solder and 260°C max for Lead-Free Solder.
  • Avoiding damage to the emitter or to the MCPCB dielectric layer. Damage to the epoxy layer can cause
  • Do not let the solder contact from solder pad to back-side of MCPCB. This one will cause a short circuit and damage emitter. a short circuit in the array.
  • For prototype builds or small series production runs it possible to place and solder the emitters by hand. Place Emitter on MCPCB. Put MCPCB on Heat Plate. Place Solder Wire to the solder pad of MCPCB. MCPCB MCPCB Solder Paste (1) Soldering Process for Solder Paste (2) Soldering Process for Solder Wire Heat Plate Heat Plate Solder Wire Put Emitter on MCPCB. Take the MCPCB out from Heat Plate within 10 seconds. Thermal Conductive Glue MCPCB Place Emitter on the MCPCB. Use Soldering Iron to solder the leads of Emtter within 5 seconds. Use Solder Mask to print Solder Paste on MCPCB. Put MCPCB on Heat Plate until Solder Paste melt. The Solder Paste sould be melted within 10 seconds. Take out MCPCB out from Heat Plate within 15 seconds. Place Thermal Comductive Glue on the MCPCB. Emitter Heat Plate Emitter Heat Plate Emitter Soldering Iron Solder Wire

Notes: 1. Emitter 50 pieces per tube and Star 20 pieces per tube. 2. Drawing not to scale. 3. All dimensions are in millimeters. 4. All dimendions without tolerances are for reference only. **Please do not open the moisture barrier bag (MBB) more than one week. This may cause the leads of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening the MBB. The recommended storage conditions are temperature 5 to 30°C and humidity less than 40% RH.

  • Storage Please do not open the moisture barrier bag (MBB) more than one week. This may cause the leads of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening the MBB. The recommended storage conditions are temperature 5 to 30°C and humidity less than 40% RH. It is also recommended to return the LEDs to the MBB and to reseal the MBB.
  • The slug is is not electrically neutral. Therefore, we recommend to isolate the heat sink.
  • The slug is to be soldered. If not, please use the heat conductive adhesive.
  • Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering.
  • Please avoid rapid cooling after soldering.
  • Components should not be mounted on warped direction of PCB.
  • Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a heat plate should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
  • This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When cleaning is required, isopropyl alcohol should be used.
  • When the LEDs are illuminating, operating current should be decide after considering the package maximum temperature.
  • The appearance, specifications and flux bin of the product may be modified for improvement without notice. Please refer to the below website for the latest datasheets. h ttp://www.prolightopto.com/