PLPVQ940A AMSCO | Alldatasheet
Document overview
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- PDF pages: 17
Technical content
1 Version 1.2 | 2019-04-04 Produktdatenblatt | Version 1.1 www.osram-os.com
Applications
BIDOS® VCSEL pulsed laser in small footprint QFN —Access Control (IRIS/Vein Scan, Face Recog - nition) —Gesture Recognition Features: —Multimode VCSEL —Laser aperture 10 µm (diameter) x 40 µm (pitch) —Cost effective package for high volume applications
Ordering Information
Type Peak output power Ordering Code typ. IF = 1 A; tp = 200 µs; f = 500 Hz; TA = 25 °C Popt PLPVQ 940A 0.58 W Q65112A6002
2 Version 1.2 | 2019-04-04 Maximum Ratings TA = 25 °C Parameter Symbol Values Operating temperature Top min. max. 0 °C 60 °C Storage temperature Tstg min. max. -40 °C 85 °C Junction temperature 1) Tj max. 110 °C Output power (continuous wave) Pcw max. 0.48 W Forward current IF max. 0.75 A Surge current D = 0.1 IFSM max. 1.2 A Reverse voltage 2) VR max. 5 V
3 Version 1.2 | 2019-04-04 Characteristics IF = 1 A; tp = 200 µs; f = 500 Hz; TA = 25 °C Parameter Symbol Values Peak wavelength λpeak min. typ. max. 932.0 nm 940.0 nm 948.0 nm Spectral bandwidth at 50% Irel,max (FWHM) ∆λ typ. 1.5 nm Peak output power Popt min. typ. max. 0.5 W 0.58 W 0.75 W Field of view (HFOV) Θ typ. 65 ° Field of view (VFOV) Θ ⊥ typ. 78 ° Wall plug efficiency (after diffusor) WPE typ. 27 % Threshold current Ith typ. 0.06 A Forward voltage VF min. typ. max. 1.5 V 2.3 V 2.7 V Rise time tr typ. 1 ns Fall time tf typ. 1 ns Aperture size (diameter) typ. 10 µm Temperature coefficient of wavelength TCλ typ. max. 0.07 nm / K 0.1 nm / K Thermal resistance junction solder point real 3) RthJS typ. max.
27 K / W
33 K / W
4 Version 1.2 | 2019-04-04 Relative Spectral Emission 4), 5) Popt = f (λ); Popt = 0.58 W; tp = 200 µs; TA = 25 °C 930 935 940 945 950 λ [ 0.0 0.2 0.4 0.6 0.8 1.0 Far-Field Illumination Pattern 4), 5) Popt = 0.58 W; d = 20 mm (distance to flat screen); rectangle shows HFOV and VFOV
5 Version 1.2 | 2019-04-04 Optical Output Power 4), 5) Popt = f(IF), tp = 200 µs, f = 500 Hz, TA = 25 °C 0.0 0.2 0.4 0.6 Forward Voltage 4) VF = f (IF); tp = 200 µs; f = 500 Hz; TA = 25 °C 1.6 1.8 2.0 2.2 2.4
6 Version 1.2 | 2019-04-04 Dimensional Drawing 6) Further Information Approximate Weight: 5.0 mg
7 Version 1.2 | 2019-04-04 Recommended Solder Pad 6)
8 Version 1.2 | 2019-04-04 Reflow Soldering Profile Product complies to MSL Level 3 acc. to JEDEC J-STD-020E 00 s OHA04525 100 150 200 250 300 50 100 150 200 250 300 t T St t Pt Tp240 ˚C 217 ˚C 245 ˚C 25 ˚C L Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C 2 3 K/s Time tS TSmin to TSmax tS 60 100 120 s Ramp-up rate to peak*) TSmax to TP 2 3 K/s Liquidus temperature TL 217 °C Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 10 20 30 s Ramp-down rate* TP to 100 °C 3 6 K/s Time 25 °C to TP 480 s All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
9 Version 1.2 | 2019-04-04 Taping 6)
10 Version 1.2 | 2019-04-04 Tape and Reel 7) W FE Direction of unreeling N A OHAY0324 Label Leader: Trailer: 13.0 Direction of unreeling ±0.25 min. 160 mm * min. 400 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D Reel Dimensions A W Nmin W1 W2 max Pieces per PU 180 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 2500
11 Version 1.2 | 2019-04-04 Barcode-Product-Label (BPL) Dry Packing Process and Materials 6) OHA00539 OSRAM Moisture-sensitive label or print Barcode label Desiccant Humidity indicator Barcode label OSRAM Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. WET Do not eat. Comparator check dot parts still adequately dry. examine units, if necessary examine units, if necessary 15% 10%bake units bake units If wet, change desiccant If wet, Humidity Indicator MIL-I-8835 If wet, M oisture Level 3 Floor tim e 168 Hours M oisture Level 6 Floor tim e 6 Hours a) Hum idity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package 2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 m onths at < 40 ˚C and < 90% relative hum idity (RH). M oisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) M ounted within b) Stored at body tem 3. Devices require baking, before m ounting, if: Bag seal date M oisture Level 1 M oisture Level 2 M oisture Level 2a4. If baking is required, b) 2a or 2b is not m et. Date and tim e opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor tim e see below If blank, see bar code label Floor tim e > 1 Year Floor tim e 1 Year Floor tim e 4 W eeks10% RH. M oisture Level 4 M oisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag contains CAUTION Floor tim e 72 Hours Floor tim e 48 Hours Floor tim e 24 Hours 30 ˚C/60% RH. LEVEL If blank, see bar code label Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
12 Version 1.2 | 2019-04-04 Schematic Transportation Box 6) OHA02044 PACKVAR:R077Additional TEXT P-1+Q-1 Multi TOPLED Muster OSRAM Opto Semiconductors (6P) BATCH NO (X) PROD NO (9D) D/ 11(1T) LO T NO 210021998 123GH1234 0 24 5 (Q)QTY : 2000 014 (G) GROUP
260 C RT240 C
R 220 C R ML Bin3 :Bin2: Q-1-2 Bin1: P-1-20 LSY T676 2 2a Temp ST R18 DEMY PACKVAR: R077Additional TEXT P-1+Q-1 Multi TOPLED Muster OSRAM Opto Semiconductors (6P) BATCH NO: (X) PROD NO: (9D) D/C: 11(1T) LOT NO: 210021998 123GH1234 0 24 5 (Q)QTY: 2000 0144 (G) GROUP:
260 C RT
240 C R
220 C R
MLBin3:Bin2: Q-1-20 Bin1: P-1-20 LSY T676 2 2a Temp ST R18 DEMY OSRAM Packing Sealing label Barcode label M oisture Leve l 3 Floo r tim e 1
68 Hours
a) Hum idity Indicator Card is > 10% when re ad at 23 ˚C ± 5 ˚C , or reflow, vapor ha se ref low, or equiva lent proce ssing (peak packa ge 2. After this bag is opened, device s that will be su bjecte d to infrared 1. Sh elf life in sea led bag: 24 m on th s at 40 ˚C and < 90% relative hu m idity (R M oisture Le vel 5a at factory co nditions of (if blank, seal date is ide ntica l with da te co de) M ounte d within b) St ored at body tem Devic es re quire baking, bef ore m ounting, if: Bag seal date M oisture Level 1 M oisture Leve l 2 M oisture Level 2a4. If baking is require b) 2a or 2b is not m et. Dat e and tim e op ened: reference IPC/JEDEC J-S TD-033 for bake procedur Floo r tim e se e below If blan k, see ba r code label Floo r tim e >
1 Year
eeks10% RH. M oisture Le ve l 4 M oisture Level 5 ˚C). OPT O SE MICONDUCTOR S MO ISTURE SE NSITIVE This bag contains CA UTIO N Floor tim e 72 Hours Floor tim e 48 Hours Floor time
24 Hours
/60% RH LE VE L If blank, see bar code label Barcode label Dimensions of Transportation Box Width Length Height 200 ± 5 mm 195 ± 5 mm 30 ± 5 mm
13 Version 1.2 | 2019-04-04 Notes Depending on the mode of operation, these devices emit highly concentrated visible and non visible light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There- fore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. For further application related information please visit www.osram-os.com/appnotes
14 Version 1.2 | 2019-04-04 Disclaimer Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS webside. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi- nate the customer-specific request between OSRAM OS and Buyer and/or Customer.
15 Version 1.2 | 2019-04-04 Glossary 1) Junction temperature: Limited due to plastic package, not due to laser chip. 2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera- tion is not allowed. 3) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g. metal block) 4) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic- es, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could dif- fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 5) Testing temperature: TA = 25°C 6) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 7) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.
16 Version 1.2 | 2019-04-04
Revision History
1.0 2019-02-14 Initial Version 1.1 2019-03-25 Recommended Solder Pad 1.2 2019-04-03 Ordering Information Characteristics Electro - Optical Characteristics (Diagrams)
17 Version 1.2 | 2019-04-04 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.