PL6N-1LFX ELITE | Alldatasheet

Document overview

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  • PDF pages: 12

Technical content

Features

  • R, G, B three color in one Package
  • High flux per LED
  • Good color uniformity
  • More energy efficient than incandescent and most halogen lamps
  • Low Voltage DC operated
  • Instant light (less than 100ns)
  • No UV Typical Applications
  • Reading lights (car, bus, aircraft)
  • Portable (flashlight, bicycle)
  • Uplighters/Downlighters
  • Decorative/Entertainment
  • Bollards/Security/Garden
  • Cove/Undershelf/Task
  • Indoor/Outdoor Commercial and Residential Architectural
  • Automotive Ext (Stop-Tail-Turn, CHMSL, Mirror Side Repeat)
  • LCD backlights 1 2010/04

Emitter Mechanical Dimensions Notes: 1. The Anode side of the device is denoted by a hole in the lead frame. 2. Electrical insulation between the case and the board is required --- slug of device is not electrically neutral. Do not electrically connect either the anode or cathode to the slug. 3. Drawing not to scale. 4. All dimensions are in millimeters. 5. All dimendions without tolerances are for reference only. 6. Please do not bend the leads of the LED, otherwise it will damage the LED. 7. Please do not use a force of over 3kgf impact or pressure on the lens of the LED, otherwise it will cause a catastrophic failure. *The appearance and specifications of the product may be modified for improvement without notice. TOP VIEW BOTTOM VIEW

Star Mechanical Dimensions Notes: 1. Slots in aluminum-core PCB for M3 or #4 mounting screw. 2. Electrical interconnection pads labeled on the aluminum-core PCB with "+" and "-" to denote positive and negative, respectively. All positive pads are interconnected, as are all negative pads, allowing for flexibility in array interconnection. 3. Drawing not to scale. 4. All dimensions are in millimeters. 5. All dimendions without tolerances are for reference only. 6. Please do not use a force of over 3kgf impact or pressure on the lens of the LED, otherwise it will cause a catastrophic failure. *The appearance and specifications of the product may be modified for improvement without notice.

Flux Characteristics at 150mA, TJ = 25°C Radiation Pattern Emitter Star Minimum Typical Red 8.2 14.5 Green 10.7 17.5 Blue 2.9 5.0

  • ProLight maintains a tolerance of ± 10% on flux and power measurements.
  • Please do not drive at rated current more than 1 second without proper heat sink. Optical Characteristics at 150mA, TJ = 25°C Total included Viewing Angle Angle (degrees) (degrees) Min. Typ. Max. θ0.90V 2 θ1/2 Red 613.5 nm 623 nm 631 nm 160 140 Green 515 nm 525 nm 535 nm 160 140 Blue 455 nm 465 nm 475 nm 160 140
  • ProLight maintains a tolerance of ± 1nm for dominant wavelength measurements.
  • ProLight maintains a tolerance of ± 5% for CCT measurements. Electrical Characteristics at 150mA, TJ = 25°C Color Min. Typ. Max. Red 1.75 2.2 3.1 Green 2.85 3.5 4.1 Blue 2.85 3.5 4.1 PL6N-1LFE PL6N-1LFS Dominant Wavelength λD, or Color Temperature CCT Color Color Part Number Lumious Flux ΦV (lm) Lambertian Forward Voltage VF (V)

DC Forward Current (mA) Peak Pulsed Forward Current (mA) Average Forward Current (mA) ESD Sensitivity (HBM per MIL-STD-883E Method 3015.7) LED Junction Temperature (°C) Aluminum-core PCB Temperature (°C) Storage & Operating Temperature (°C) Soldering Temperature(°C) Dominant Wavelength Bin Structure A A

  • ProLight maintains a tolerance of ± 1nm for dominant wavelength measurements. Note: Although several bins are outlined, product availability in a particular bin varies by production run and by product performance. Not all bins are available in all colors. Blue 455 460 460 465 465 470 470 475 Green 515 520 520 525 525 530 530 535 Minimum Dominant Maximum Dominant Wavelength (nm) Wavelength (nm) Red 613.5 620.5 620.5 631.0 > ±500V 120 105 -40 to +105 235°C Color Bin Code Red/Green/Blue 150 250 150

Color Spectrum, TJ = 25°C 1. Blue、Green、Red Light Output Characteristics Relative Light Output vs. Junction Temperature at 150mA 0.0 0.2 0.4 0.6 0.8 1.0 400 450 500 550 600 650 700 Relative Spectral Power Distribution Wavelength(nm) Blue Green Red 100 120 140 160 1 2 3 4 5 6 7 8 Relative Light Output (%) Junction Temperature, TJ (℃) -20 0 20 40 60 80 100 120 Red Green Blue

Forward Current Characteristics, TJ = 25°C 1. Forward Voltage vs. Forward Current 2. Forward Current vs. Normalized Relative Luminous Flux 100 120 140 160 0 0.5 1 1.5 2 2.5 3 Average Forward Current (mA) Forward Voltage (V) Red 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 50 100 150 200 Relative Luminous Flux Forward Current (mA) Green, Blue 100 120 140 160 0 0.5 1 1.5 2 2.5 3 3.5 4 Average Forward Current (mA) Forward Voltage (V) Green, Blue 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 50 100 150 200 Relative Luminous Flux Forward Current (mA) Red

Typical Representative Spatial Radiation Pattern Lambertian Radiation Pattern 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Relative Intensity Angular Displacement (Degrees)

Recommended Solder Pad Design

  • All dimensions are in millimeters.
  • Electrical isolation is required between Slug and Solder Pad.

Heat Plate Soldering Condition

  • Heat plate temperature: 230°C max for Lead Solder and 230°C max for Lead-Free Solder.
  • We recommend using the 58Bi-42Sn eutectic alloy for low-temp. and lead free soldering (melting point = 138 °C).
  • When soldering, do not put stress on the LEDs during heating.
  • After soldering, do not warp the circuit board. Manual Hand Soldering
  • Solder tip temperature: 230°C max for Lead Solder and 260°C max for Lead-Free Solder.
  • Avoiding damage to the emitter or to the MCPCB dielectric layer. Damage to the epoxy layer can cause
  • Do not let the solder contact from solder pad to back-side of MCPCB. This one will cause a short circuit and damage emitter. a short circuit in the array.
  • For prototype builds or small series production runs it possible to place and solder the emitters by hand. Figure 8a. Lead Solder Temperature ProfileFigure 8b. Lead-free Solder Temperature Profile MCPCB Place Emitter on MCPCB. Put MCPCB on Heat Plate. Place Solder Wire to the solder pad of MCPCB. MCPCB Solder Paste (1) Soldering Process for Solder Paste (2) Soldering Process for Solder Wire Heat Plate Heat Plate Solder Wire Put Emitter on MCPCB. Take the MCPCB out from Heat Plate within 10 seconds. Emitter Emitter Use Solder Mask to print Solder Paste on MCPCB. Put MCPCB on Heat Plate until Solder Paste melt. The Solder Paste sould be melted within 10 seconds. Take out MCPCB out from Heat Plate within 15 seconds. Thermal Conductive Glue MCPCB Place Emitter on the MCPCB. Use Soldering Iron to solder the leads of Emtter within 5 seconds. Soldering Iron Solder Wire Emitter Place Thermal Comductive Glue on the MCPCB. Heat Plate Heat Plate

Notes: 1. Emitter 50 pieces per tube and Star 20 pieces per tube. 2. Drawing not to scale. 3. All dimensions are in millimeters. 4. All dimendions without tolerances are for reference only. **Please do not open the moisture barrier bag (MBB) more than one week. This may cause the leads of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening the MBB. The recommended storage conditions are temperature 5 to 30°C and humidity less than 40% RH.

  • Storage Please do not open the moisture barrier bag (MBB) more than one week. This may cause the leads of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening the MBB. The recommended storage conditions are temperature 5 to 30°C and humidity less than 40% RH. It is also recommended to return the LEDs to the MBB and to reseal the MBB.
  • The slug is is not electrically neutral. Therefore, we recommend to isolate the heat sink.
  • The slug is to be soldered. If not, please use the heat conductive adhesive.
  • Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering.
  • Please avoid rapid cooling after soldering.
  • Components should not be mounted on warped direction of PCB.
  • Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a heat plate should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
  • This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When cleaning is required, isopropyl alcohol should be used.
  • When the LEDs are illuminating, operating current should be decide after considering the package maximum temperature.
  • The appearance, specifications and flux bin of the product may be modified for improvement without notice. Please refer to the below website for the latest datasheets. http://www.prolightopto.com/