PL-2303HX_V01 PROLIFIC | Alldatasheet
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PL-2303HX Edition (Chip Rev D) USB to Serial Bridge Controller Product Datasheet Document Revision: 1.4.4 Document Release: March 20, 2013 Prolific Technology Inc. 7F, No. 48, Sec. 3, Nan Kang Rd. Nan Kang, Taipei 115, Taiwan, R.O.C. Telephone: +886-2-2654-6363 Fax: +886-2-2654-6161 E-mail: sales@prolific.com.tw Website: http://www.prolific.com.tw
Revised Date: March 20, 2013 ds_pl2303HXD_v1.4.4 PL-2303HX (Rev D) Product Datasheet - 2 - Document Version 1.4.4 Disclaimer All the information in this document is subject to change without prior notice. Prolific Technology Inc. does not make any representations or any warranties (implied or otherwise) regarding the accuracy and completeness of this document and shall in no event be liable for any loss of profit or any other commercial damage, including but not limited to special, incidental, consequential, or other damages. Trademarks The Prolific logo is a registered trademark of Prolific Technology Inc. All brand names and product names used in this document are trademarks or registered trademarks of their respective holders. Copyrights Copyright © 2005-2013 Prolific Technology Inc., All rights reserved. No part of this document may be reproduced or transmitted in any form by any means without the express written permission of Prolific Technology Inc.
Revised Date: March 20, 2012 ds_pl2303HXD_v1.4.4 PL-2303HX (Rev D) Product Datasheet - 3 - Document Version 1.4.4
Revision History
1.4.4 Added Android USB Host API Support March 20, 2013 1.4.3 Modify Features and OS Driver Support List Added QFN32 Reel Tape Information September 11, 2012 1.4.2 Modify Section 12.0 Ordering Information Part Number June 25, 2012 1.4.1 Modify Reel Tape Packing (MOQ) Information May 25, 2012 1.4 Added Windows 8 Driver Support Added OTPROM Configuration Section Modified BaudRate Support Table Added Reference Schematic Diagram Added Chip Marking Information Added Tube Packing Information Added Worldwide Distributors Information March 16, 2012 1.3 Added Windows 7 Logo Driver Information Modified Operating Temperature Characteristics Modified Baud Rate Settings Table September 9, 2010 1.2 Sec. 9.0: Modified DC & Temperature Characteristics June 27, 2008 1.1 Added Windows Vista and XP Logo Driver information Added USB-IF Logo TID information April 16, 2007 1.0B Sec. 4.2: Modified QFN diagram to add IC bottom PAD information June 30, 2006 1.0A PL-2303HX (Chip Rev D) Datasheet – Formal Release November 23, 2005
Revised Date: March 20, 2013 ds_pl2303HXD_v1.4.4 PL-2303HX (Rev D) Product Datasheet - 4 - Document Version 1.4.4 Table of Contents
Revised Date: March 20, 2012 ds_pl2303HXD_v1.4.4 PL-2303HX (Rev D) Product Datasheet - 5 - Document Version 1.4.4
Revised Date: March 20, 2012 ds_pl2303HXD_v1.4.4 PL-2303HX (Rev D) Product Datasheet - 7 - Document Version 1.4.4
1.0 Features
Single-chip USB to Serial (RS232/RS422/RS485) asynchronous serial data transfer interface Fully Compliant with USB Specification v2.0 (Full-Speed) USB-IF Logo Compliant with TID 40000100 UHCI/OHCI (USB1.1), EHCI (USB 2.0), xHCI (USB 3.0) Host Controller Compatible Integrated USB 1.1 Transceiver and 5V to 3.3V Regulator Integrated 96MHz clock generator (No external crystal required) Integrated OTPROM (One-Time Programming ROM) – no external EEPROM required. o For writing and storing customer USB VID/PID, Serial Number, Product String, and other device startup configurations. (uses default settings if OTPROM is empty) Supports USB to RS232 Serial UART Interface o Full-duplex transmitter and receiver (TXD and RXD) o Six MODEM control pins (RTS, CTS, DTR, DSR, DCD, and RI) o 5, 6, 7 or 8 data bits o Odd, Even, Mark, Space, or None parity mode o One, one and a half, or two stop bits o Parity error, frame error, and serial break detection o Programmable baud rate from 75 bps to 12M bps o External RS232 driver power down control o Independent power source for serial interface Supports RS-422/RS-485 like serial interface (TXD, DTR_N, and RTS_N pins should be externally pulled-up to 5V) Extensive Flow Control Mechanism o Adjustable high/low watermark level o Automatic hardware flow control with CTS/RTS or DSR/DTR o Automatic software flow control with XON/XOFF o Inbound data buffer overflow detection Configurable 512-byte bi-directional data buffer o 256-byte outbound buffer and 256-byte inbound buffer; or o 128-byte outbound buffer and 384-byte inbound buffer Supports Remote Wake-up from RS232 input pin signals (RI, RXD, DSR, DCD, CTS) Four (4) General Purpose I/O (GP0, GP1, GP2, & GP3) pins and Four (4) Auxiliary General Purpose I/O (RI_N, DSR_N, DCD_N, & CTS_N) pins. Supports Windows Selective Suspend by OTPROM configuration (Enable Remote Wakeup) o Suspends power of chip when idle (COM port is closed) Provides royalty-free USB to Virtual COM Port drivers for Windows, Mac, Linux, Android -40 o C to 85 o C Operating Temperature Small footprint 28-pin SSOP or 32-pin QFN IC packages (RoHS compliant and Pb-free Green Compound
Revised Date: March 20, 2013 ds_pl2303HXD_v1.4.4 PL-2303HX (Rev D) Product Datasheet - 8 - Document Version 1.4.4
1.1 Royalty-Free Driver Support
Windows 8, 7, Vista, XP , 2000 (Microsoft Certified WHQL Drivers) o Windows Update Driver installation available in Windows Vista, 7, and 8 (32/64-bit) o Download: http://www.prolific.com.tw/US/ShowProduct.aspx?p_id=225&pcid=41 Windows Server 2003, 2008, 2008 R2, 2012 Windows XP Embedded (XPe), Point-of-Service (WEPOS), and POSReady Windows CE 4.2, 5.0, 6.0, and Windows Embedded Compact 7 o Requires customer SDK image file for customizing WinCE 6.0 and 7.0 drivers. Mac OS 8/9, OS X (supports latest Mac OS X 10.8 Mountain Lion) o Download: http://www.prolific.com.tw/US/ShowProduct.aspx?p_id=229&pcid=41 Linux/Android kernel 2.4.31 and above includes built-in drivers (pl2303.c) o Android requires root permission for accessing virtual serial port (ttyusb) Android Java Driver Library (requires Android 3.2 and above with USB Host or OTG) o No root permission needed o Download: http://www.prolific.com.tw/US/ShowProduct.aspx?p_id=230&pcid=41 o Android device must support USB Host API: http://developer.android.com/guide/topics/connectivity/usb/host.html Provides Driver Customization for Customer USB VID/PID and special baud rates
1.2 Product Applications
Single-chip upgrade solution for Legacy RS232 devices to USB interface USB to RS232/RS422/RS485 converters/cables/dongles/adapters Healthcare/Medical USB Interface Data Transfer Cable Personal Infotainment/Media Player Docking USB Interface Cellular/PDA USB Interface Data Transfer Cable Serial-over-IP Wireless Solution USB Barcode/Smart Card Readers GPS/Navigation USB Interface Point-of-Sale (POS) Terminals/Printers PC Docking Station/Port Replicators Industrial/Instrumentation/Automation Control USB Interface USB Modem/Wireless/Zigbee USB Interface Set-Top Box (STB) / Home Gateway USB Interface MCU-based devices to USB interface
Revised Date: March 20, 2012 ds_pl2303HXD_v1.4.4 PL-2303HX (Rev D) Product Datasheet - 9 - Document Version 1.4.4
2.0 Functional Block Diagram
96MHz Clock Generator USB 1.1 Transceiver 5 to 3.3V Regulator Power Management USB Digital Lock Loop USB to Serial Interface Engine Control Endpoint Interrupt Endpoint Bulk-in Endpoint Bulk-Out Endpoint 256/384Byte Inbound Data Buffer 256/128Byte Outbound Data Buffer RS232 / RS-422 / RS-485 Like Serial Interface Engine 256-Bytes OTP ROM Hardware ROM Default Descriptor PL-2303HXD RS-232/RS-422/RS-485 Like Interface USB Host Figure 2-1 Block Diagram of PL-2303HX (Rev D)
Revised Date: March 20, 2013 ds_pl2303HXD_v1.4.4 PL-2303HX (Rev D) Product Datasheet - 10 - Document Version 1.4.4
3.0 Introduction
PL-2303HX (Chip Rev D) or PL-2303HXD provides a convenient solution for connecting an RS232-like full-duplex asynchronous serial device to any Universal Serial Bus (USB) capable host. PL-2303HXD highly compatible drivers could simulate the traditional COM port on most operating systems allowing the existing applications based on COM port to easily migrate and be made USB ready. By taking advantage of USB bulk transfer mode, large data buffers, and automatic flow control, PL-2303HXD is capable of achieving higher throughput compared to traditional UART (Universal Asynchronous Receiver Transmitter) ports. When real RS232 signaling is not required, baud rate higher than 115200 bps could be used for even higher performance. The flexible baud rate generator of PL-2303HXD could be programmed to generate any rate between 75 bps to 12M bps. PL-2303HXD is exclusively designed for mobile and embedded solutions in mind, providing a small footprint that could easily fit in to any connectors and handheld devices. With very small power consumption in either operating or suspend mode, PL-2303HXD is perfect for bus powered operation with plenty of power left for the attached devices. Flexible signal level requirement on the RS232-like serial port side also allows PL-2303HXD to connect directly to any 3.3V~1.8V range devices.
Revised Date: March 20, 2012 ds_pl2303HXD_v1.4.4 PL-2303HX (Rev D) Product Datasheet - 11 - Document Version 1.4.4
4.0 Pin Assignment Outline
4.1 SSOP28 Package
PL-2303HX (Rev D)
1 TXD
2 DTR_N
3 RTS_N
4 VDD_325
5 RXD
6 RI_N
7 GND
9 DSR_N
10 DCD_N
11 CTS_N
12 SHTD_N
13 GP3
14 GP2
20VDD_5 19RESET_N 18GND 17VO_33 16DM 15DP Figure 4-1 Pin Assignment Outline of PL-2303HX (Rev D) SSOP28
Revised Date: March 20, 2013 ds_pl2303HXD_v1.4.4 PL-2303HX (Rev D) Product Datasheet - 12 - Document Version 1.4.4
4.2 QFN32 Package
R T S_N NC GN D GN D T EST R ESER VED NC NC T XD D T R _N V D D _ 3 2 5 R XD R I_N GN D V D D _ 3 3 D SR _N D C D _N C T S_N SH T D _N G P 3 G P 2 NC NC DP DM NC G P 1 G P 0 NC V D D _ 5 R ESET _N V O _ 3 3 PL-2303HXD Exposed Die Pad connects to VO_33 Figure 4-2 Pin Assignment Outline of PL-2303HX (Rev D) QFN32 Warning: The exposed center die pad of the PL-2303HX QFN package is connected (bonded) to the pin VO_33 so it is very important to design the PCB layout wherein this exposed die pad won’t get grounded on the PCB when mounted.
Revised Date: March 20, 2012 ds_pl2303HXD_v1.4.4 PL-2303HX (Rev D) Product Datasheet - 13 - Document Version 1.4.4
5.0 Pin Assignment & Description
Pin Type Abbreviation: I: Input O: Output B: Bidirectional I/O P: Power/Ground
5.1 SSOP28 Package
Table 5-1 Pin Assignment & Description (SSOP28) Pin # Name Type Description
1 TXD O (1) Serial Port (Transmitted Data)
2 DTR_N O (1) Serial Port (Data Terminal Ready)
3 RTS_N O (1) Serial Port (Request To Send)
4 VDD_325 P
RS232 VDD. The power pin for the serial port signals. When the serial port is 3.3V, this should be 3.3V. When the serial port
5 RXD I (2) Serial Port (Received Data)
6 RI_N B (2) Serial Port (Ring Indicator); or Auxiliary General Purpose I/O
Port when enabled(7).
7 GND P Ground
8 NC - No Connection
9 DSR_N B (2) Serial Port (Data Set Ready); or Auxiliary General Purpose I/O
Port when enabled(7).
10 DCD_N B (2) Serial Port (Data Carrier Detect); or Auxiliary General Purpose
I/O Port when enabled(7).
11 CTS_N B (2) Serial Port (Clear to Send); or Auxiliary General Purpose I/O
Port when enabled(7).
12 SHTD_N O (3) RS232 Transceiver Shut Down Control
13 GP3 I/O Auxiliary GPIO Pin 3 (Default output high mode) (6)
14 GP2 I/O Auxiliary GPIO Pin 2 (Default output high mode) (6)
15 DP B USB Port D+ signal
16 DM B USB Port D- signal
17 VO_33 P Regulator Power Output, 3.3V
18 GND P Ground
19 RESET_N I (4) External System Reset (Active Low)
20 VDD_5 P USB Port VBUS, 5V Power. (6.5V for OTPROM writing voltage).
21 NC - No Connection
22 GP0 B (5) General Purpose I/O Pin 0
23 GP1 B (5) General Purpose I/O Pin 1
24 NC - No Connection
25 GND - Ground
26 TEST I Test mode control
27 NC - No Connection
28 Reserved - Reserved pin (Must be floating)
Notes: (1) – Tri-State, Output Pad. Level and Driving Capability decided by VDD_325. (2) – Tri-State, CMOS Input/Output Pad with level shifter. Level and Driving Capability decided by VDD_325. (3) – CMOS Output Pad. (4) – CMOS Input Pad, 5V tolerant. (5) – Tri-State, CMOS Input/Output Pad. (Default mode: Input) (6) – Default output high mode; do not connect to ground. (7) – Enabling Auxiliary GPIO requires special customized driver.
Revised Date: March 20, 2013 ds_pl2303HXD_v1.4.4 PL-2303HX (Rev D) Product Datasheet - 14 - Document Version 1.4.4
5.2 QFN32 Package
Table 5-2 Pin Assignment & Description (QFN32) Pin # Name Type Description
1 VDD_325 P
RS232 VDD. The power pin for the serial port signals. When the serial port is 3.3V, this should be 3.3V. When the serial port is 2.5V, this should be 2.5V. The range can be from 1.8V~3.3V.
2 RXD I (2) Serial Port (Received Data)
3 RI_N B (2) Serial Port (Ring Indicator); or Auxiliary General Purpose
I/O Port when enabled(6).
4 GND P Ground
5 VDD_33 P Primary Power (3.3V)
6 DSR_N B (2) Serial Port (Data Set Ready); or Auxiliary General Purpose
I/O Port when enabled(6).
7 DCD_N B (2) Serial Port (Data Carrier Detect); or Auxiliary General
Purpose I/O Port when enabled(6).
8 CTS_N B (2) Serial Port (Clear to Send); or Auxiliary General Purpose
I/O Port when enabled(6).
9 SHTD_N O (3) RS232 Transceiver Shut Down Control
10 GP3 I/O Auxiliary GPIO Pin 3 (Default output high mode) (5)
11 GP2 I/O Auxiliary GPIO Pin 2 (Default output high mode) (5)
12 NC - No Connection
13 NC - No Connection
14 DP B USB Port D+ signal
15 DM B USB Port D- signal
16 NC - No Connection
17 VO_33 P Regulator Power Output, 3.3V
19 RESET_N I External System Reset (Active Low)
20 VDD_5 P USB Port VBUS, 5V Power.
22 GP0 B (4) General Purpose I/O Pin 0
23 GP1 B (4) General Purpose I/O Pin 1
25 GND P Ground
27 Reserved - Reserved pin (Must be floating)
28 NC - No Connection
29 NC - No Connection
30 TXD O (1) Serial Port (Transmitted Data)
31 DTR_N O (1) Serial Port (Data Terminal Ready)
32 RTS_N O (1) Serial Port (Request To Send)
IC Bottom PAD P Connects to VO_33 (Regulator Power Output, 3.3V) Notes: (1) – Tri-State, Output Pad. Level and Driving Capability decided by VDD_325. (2) – Tri-State, CMOS Input/Output Pad with level shifter. Level and Driving Capability decided by VDD_325. (3) – CMOS Output Pad. (4) – Tri-State, CMOS Input/Output Pad. (Default mode: Input) (5) – Default output high mode; do not connect to ground. (6) – Enabling Auxiliary GPIO requires special customized driver.
Revised Date: March 20, 2012 ds_pl2303HXD_v1.4.4 PL-2303HX (Rev D) Product Datasheet - 15 - Document Version 1.4.4
6.0 OTPROM Configuration
The default configuration descriptors are stored in the chip internally which will be loaded during power-on reset or USB bus reset whenever OTPROM (One-Time Programmable ROM) is empty. Several of the USB descriptors could be modified and stored to the PL2303HXD OTPROM during device startup like Vendor ID (VID), Product ID (PID), Serial Number, Product String, and other configuration descriptors. The OTPROM can be programmed twice using the Prolific PL2303 EEPROM Writer utility software which can be requested from Prolific or authorized distributors. Figure 6-1 PL2303 EEPROM Writer Program Table 6-1 EEPROM Writer Configuration Descriptors Default Value Description Vendor ID (VID) 067B (hex) USB unique Vendor ID of Company or Manufacturer. This ID is applied and registered from USB-IF. Refer to this website for applying VID: http://www.usb.org/developers/vendor/ Product ID (PID) 2303 (hex) USB Product ID assigned by Company or Manufacturer. Rel. No. (BCD) 0400 This field reports the release number of USB the device. This item is fixed and cannot be modified.
Revised Date: March 20, 2013 ds_pl2303HXD_v1.4.4 PL-2303HX (Rev D) Product Datasheet - 16 - Document Version 1.4.4 Serial No. (8 hex characters) Disabled This field sets the product USB serial number. Entering a unique serial number allows the device to be assigned the same COM Port number even when plug to other USB ports of the same PC. Product String Descriptor None This field when entered will be the string displayed by Windows and other OS when device is first detected and before driver is loaded or driver not installed. Enable for RS422/RS485 Disabled Enable this for RS422 or RS485 support. Remains 2 PL2303HXD has an integrated OTPROM which allows to write EEPROM settings without the use of an external one. However, the OTPROM can only be written twice and cannot be erased. PL2303HXD does not support external EEPROM. Functions Default Value Description Serial Port Output Disable This option allows setting the serial port output pin signals (TXD, RTS, DTR) to HIGH during suspend mode. USB Load Mode Light Load (100mA) This option sets the USB device maximum power if 100mA (low-power) or 500mA (high power). Flow Control Setting No Flow Control This option allows to set the flow control initial setting to none, H/W, or S/W control. Note: H/W and S/W flow control can also be set and configured on customer/user serial communication software. Wakeup Trigger Pin Wakeup trigger on RI This option allows setting the trigger pin for remote wakeup function. When in suspend mode, changes on the enabled serial port input signals could trigger a wakeup event. NOTE: To support Selective Suspend function, you need to write and enable this option in OTPROM. Shutdown Pin Mode Output LOW during suspend This option allows setting the Shutdown pin mode to Output HIGH or LOW on normal mode or Suspend mode.
Revised Date: March 20, 2012 ds_pl2303HXD_v1.4.4 PL-2303HX (Rev D) Product Datasheet - 17 - Document Version 1.4.4
7.0 Data Formats & Programmable Baud Rate Generator
The PL-2303HXD controller supports versatile data formats and has a programmable baud rate generator. The supported data formats are shown on Table 7-1. The programmable baud rate generator supports baud rates up to 12M bps and standard driver already supports several baud rate settings as shown in Table 7-2. Table 7-1 Supported Data Formats
Description
1.5 Parity type None Odd Even Mark Space Data bits 5, 6, 7, 8 Table 7-2 Baud Rate Settings (Supported by Driver) Baud Rates (bps) Baud Rates (bps) Baud Rates (bps) Baud Rates (bps) Baud Rates (bps) 12000000 6000000 460800 134400 19200 1800 3000000 403200 128000 14400 1200 2457600 268800 115200 9600 600 1228800 256000 57600 7200 300 921600 230400 56000 4800 150 806400 201600 38400 3600 110 614400 161280 28800 2400 75 Note: For special baud rate requirements, please contact Prolific FAE for driver customization support.
Revised Date: March 20, 2013 ds_pl2303HXD_v1.4.4 PL-2303HX (Rev D) Product Datasheet - 18 - Document Version 1.4.4
8.0 PL2303HXD Reference Schematic Diagram
Below is an example of using the PL-2303HX (Chip Rev D) as a USB to RS232 converter (with RS485 option) where a RS232 transceiver (Sipex SP213EHCA) is used to convert the TTL levels serial interface of the PL2303TA to RS232 levels as well as converting the +5V nominal VCC to the ±9V required by RS232. The SP213EHCA transceiver provides up to 500Kbps data rate transmission which is ideal for many designs requiring high speed performance. Contact Prolific FAE for more PCB design support. Figure 8-1 PL2303HX (Chip Rev D) Reference Schematic Diagram
Revised Date: March 20, 2012 ds_pl2303HXD_v1.4.4 PL-2303HX (Rev D) Product Datasheet - 19 - Document Version 1.4.4
9.0 DC & Temperature Characteristics
9.1 Absolute Maximum Ratings
Table 9-1 Absolute Maximum Ratings Items Ratings Power Supply Voltage - VDD_5 -0.3 to 6.5 V Input Voltage of 3.3V I/O -0.3 to VO_33+0.3 V Input Voltage of 3.3V I/O with 5V Tolerance I/O -0.3 to VDD_5+0.3V Output Voltage of 3.3V I/O -0.3 to VDD_5 +0.3 V Storage Temperature -40 to 150 o C
9.2 DC Characteristics
9.2.1 Operating Voltage and Suspend Current
Table 9-2a Operating Voltage and Suspend Current Parameter Symbol Min Typ Max Unit Operating Voltage Range VDD_5 4.5 5 6.5 V Output Voltage of Regulator VO_33 2.97 3.3 3.63 V Operating Current(1) (Power Consumption) IDD - 20 25 mA Suspend Current ISUS - 260 450 A Note: (1) – No device connected. 9.2.2 3.3V I/O Pins Table 9-2b 3.3V I/O Pins Parameter Symbol Min Typ Max Unit Output Driving Capability IDD 4 mA Power Supply for 3.3V I/O Pins VO_33 2.97 3.3 3.63 V Input Voltage (CMOS) Low High VIL VIH 0.7* VO_33 0.3* VO_33 V V Input Voltage (LVTTL) Low High VIL VIH 2.0 0.8 V V Output Voltage, 3.3V Low High VOL VOH 2.4 0.4 V V
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9.2.3 Serial I/O Pins
Table 9-2c VDD_325@3.3V Serial I/O Pins Parameter Symbol Min Typ Max Unit Output Driving Capability IDD 8 mA Power Supply for Serial I/O Pins VDD_325 2.97 3.3 3.63 V Input Voltage Low High VIL VIH 0.7* VDD_325 0.25* VDD_325 V V Output Voltage Low High VOL VOH 2.4 0.4 V V Table 9-2d VDD_325@2.5V Serial I/O Pins Parameter Symbol Min Typ Max Unit Output Driving Capability IDD 5.2 mA Power Supply for Serial I/O Pins VDD_325 2.25 2.5 2.75 V Input Voltage Low High VIL VIH 0.7* VDD_325 0.25* VDD_325 V V Output Voltage Low High VOL VOH 1.85 0.4 V V Table 9-2e VDD_325@1.8V Serial I/O Pins Parameter Symbol Min Typ Max Unit Output Driving Capability IDD 4.4 mA Power Supply for Serial I/O Pins VDD_325 1.65 1.8 1.95 V Input Voltage Low High VIL VIH 0.7* VDD_325 0.25* VDD_325 V V Output Voltage Low High VOL VOH 1.25 0.4 V V
9.3 Clock Characteristics
Table 9-3 Clock Characteristics Parameter Min Typ Max Units Frequency of Operation 11.97 12.0 12.03 MHz Clock Period 83.1 83.3 83.5 ns Duty Cycle 45 50 55 %
Revised Date: March 20, 2012 ds_pl2303HXD_v1.4.4 PL-2303HX (Rev D) Product Datasheet - 21 - Document Version 1.4.4
9.4 Temperature Characteristics
Table 9-4 Temperature Characteristics Parameter Symbol Min Typ Max Unit Operating Temperature -- -40 -- 85 o C Junction Operation Temperature TJ -40 25 105 o C
9.5 Leakage Current and Capacitance
Table 9-5 Leakage Current and Capacitance Parameter Symbol Min Typ Max Unit Input Leakage Current*1 IL -10 1 10 A Tri-state Leakage Current Ioz -10 1 10 A Input Capacitance CIN -- 2.8 -- pF Output Capacitance COUT 2.7 -- 4.9 pF Bi-directional Buffer Capacitance CBID 2.7 -- 4.9 pF *1. No pull-up or pull-down resistor.
9.6 Power-On Reset
Figure 9-1 Power-On Reset Diagram Table 9-6 Power-On Reset Parameter Symbol FF@70oC VO_33=3.63V TT@25oC VO_33=3.3V SS@0oC VO_33=2.97V Unit Output Delay Time Td 1.18 2.68 182.5 sec Note: The delay time is simulated with VIN ramp of 1V/sec.
Revised Date: March 20, 2013 ds_pl2303HXD_v1.4.4 PL-2303HX (Rev D) Product Datasheet - 22 - Document Version 1.4.4
10.0 Outline Diagram
10.1 SSOP28 Package
Table 10-1 Package Dimension Symbol Millimeter Inch Min Nom Max Min Nom Max b 0.22 0.38 0.009 0.015 R1 0.09 0.004 A 2.0 0.079 e 0.65 0.0256 L1 1.25 0.050 A1 0.05 0.020 Figure 10-1 Outline Diagram of PL-2303HX (Rev D) SSOP28
Revised Date: March 20, 2012 ds_pl2303HXD_v1.4.4 PL-2303HX (Rev D) Product Datasheet - 23 - Document Version 1.4.4
10.2 QFN32 Package
Figure 10-2 Outline Diagram of PL-2303HX (Rev D) QFN32
Revised Date: March 20, 2013 ds_pl2303HXD_v1.4.4 PL-2303HX (Rev D) Product Datasheet - 24 - Document Version 1.4.4
11.0 Packing Information
11.1 Carrier Tape (SSOP-28)
Figure 11-1 SSOP28 Carrier Tape Notes: 10 sprocket hole pitch cumulative tolerance 0.2 Camber not to exceed 1mm in 100mm. Material: Black Polystyrene. Ao and Bo measured on a plane 0.3mm above the bottom of the pocket. Ko measured from a plane on the inside bottom of the pocket to the top surface of the carrier. Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole. IC quantity per one reel: 2,000 pieces (MOQ) Figure 11-2 IC Reel Placements
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11.2 Carrier Tape (QFN32)
Figure 11-3 QFN32 Carrier Tape Notes: 10 sprocket hole pitch cumulative tolerance 0.2 Camber in compliance with EIA 481. Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole. IC quantity per one reel: 2,000 pieces (MOQ)
Revised Date: March 20, 2013 ds_pl2303HXD_v1.4.4 PL-2303HX (Rev D) Product Datasheet - 26 - Document Version 1.4.4
11.3 Reel Dimension
Figure 11-4 Reel Dimension Table 11-1 Reel Part Number Information Package Part Number Normal Hub Width W1 +0.3mm -0.2mm W2 Max QFN32 RD33008SW-T + RD33004SW-T 12mm 12.8mm 18.2mm SSOP28 RD33008SW-T + RD33008SW-T 16mm 16.8mm 22.2mm
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11.4 Tube Packing
Figure 11-5 Tube Packing Dimension
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12.0 Ordering and Chip Marking Information
Table 12-1 Ordering Information Part Number Package Type PL-2303HXD LF 28-pin SSOP (Lead Free or Pb-Free) PL-2303HXD QFN32 LF 32-pin QFN (Lead Free or Pb-Free) Figure 12-1 Chip Part Number Information (SSOP) Table 12-2 Chip Marking Information Line Marking Description First Line PL-2303HX Chip Product Name Second Line (LFYYWWXX) LF Lead-Free (Pb-free) packing material YY Last two digits of the manufacturing year WW Week number of the manufacturing year XX HX Chip Version (Rev D) Third Line TXXXXXXXX Manufacturing LOT code Example: “LF08451D” – means Lead-Free packing + Year 2008 + Week no. 45 + 1D chip version.
Revised Date: March 20, 2012 ds_pl2303HXD_v1.4.4 PL-2303HX (Rev D) Product Datasheet - 29 - Document Version 1.4.4
13.0 Contact Information
7F, No.48, Sec. 3, Nan Kang Rd., Nan Kang, Taipei, Taiwan 115, R.O.C. Tel: +886-2-2654-6363 Fax: +886-2-2654-6161 Website: www.prolific.com.tw E-mail: sales@prolific.com.tw Shenzhen Office Room 1908, Building, No.A. jiahehuaqiang Building, Shennanzhong Rd. Futian District, Shenzhen, China Tel: +86-1350-285-4191 E-mail: alexyang@prolific.com.tw Distributors Contact: http://www.prolific.com.tw/eng/contact-distributors.asp Taiwan Distributors Maxtek Technology Co., Ltd. Tel: +886-2-2794-6060 Ext.662 Fax: +886-2-8792-8921 Website: http://www.maxtek-icrep.com.tw E-mail: sales@maxtek.icrep.com.tw Morrihan International Corp. 4F, No. 3-2, YuanCyu Street, NanKang District , Taipei 115, Taiwan, R.O.C. Tel: +886-2-2788-5511 Fax: +886-2-2788-9366 Website: http://www.morrihan.com U-CHEER Company Co., Ltd. Tel: +886-2-8797-6789 Fax: +886-2-8797-3388 E-mail: arthur.lu36@ucheer.com.tw USA and Canada ProlificUSA.com / Tectona Electronics Inc.
250 Wyecroft Road, Unit 6, Oakville, Ontario, Canada L6K 3T7
Tel: +905-827-2206 Fax: +905-847-9412 Corporate Website: http://www.tectona.com Product Website: http://www.prolificUSA.com Japan Hitachi High-Tech Trading Corporation 1-24-14, Nishi-Shimbashi, Minato-ku, Tokyo, 105-8418 Japan Dept.: Electronic Devices 4th Dept., Electonic Devices Sales Div Tel: +81-3-3504-3859 Fax: +81-3-3504-7903 Website: http://www.hitachi-hitec-trading.com
Revised Date: March 20, 2013 ds_pl2303HXD_v1.4.4 PL-2303HX (Rev D) Product Datasheet - 30 - Document Version 1.4.4 China Lacewood International Corp. Hong Kong Office Unit B1-B3, 21/F, Block B, Kong Nam Industrial Building, 603-609 Castle peak Road, Tsuen Wan N.T, Hong Kong Tel: +852-2690-9898 Fax: +852-2690-9300 Shenzhen Office Room401-3,East, CEC Information Building, No.1 Xin Wen Road, Shenzhen, P .R.C., 518034 Tel:+86-755-8296-7018 Fax: +86-775-8330-7119 Shanghai Office Rm 208,District B, Building 3,NO.7,Guiqin Rd, Xuhui Area, Shanghai Tel : +86-21-5426-2182 ~6 Fax: +86-21-5426-2180 China Freelink Asia Limited Room 307, 3F Block6, AnHua Industrial Zone, Tairan 8th Road, CheGongMiao, Futian District, Shenzhen, China Tel: +86-755-8302-0469 China Shenzhen Shiqixinji Science and Technology Co., Ltd. Room 1908, Building NO.A, Jiahehuaqiang Building, Shennanzhong Rd., Futian District, Shenzhen, China Tel: +86-755-8329-5310 Korea Nevora Technology Rm 502, Citylife, 441, Amsa-Dong, Kangdong-Gu, Seoul, 134-855, Korea Tel: +82-2-3426-0050 Fax: +82-2-3426-0070 Website: http://www.nevora.co.kr T&C Semitech Co.,LTD #703 J-dong, Gongku-sangga, 636-62, Kuro-dong, Kuro-ku, Seoul. Korea Tel: +82-2-2672-9531 Fax: +82-2-2672-9532 Website: http://www.tncsemi.co.kr