PH975C6

PH975C6 FUJI | Alldatasheet

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Device Name ： Type Name ： Spec. No. ： D A T E APPROVED N A M E DRAWN CHECKED DWG.NO. H04-004-07b MS5D2078 1/12 Fuji Electric Device Technology Co.,Ltd. CHECKED This material and the information herein is the property of Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fu ji Electric Device Technolo gy Co.,Ltd. APR.-07-‘04 APR.-07-‘04 APR.-07-‘04 SILICON DIODE PH975C6 MS5D2078

DWG.NO. H04-004-06b Revised Records DWG.NO. MS5D2078 2/12 Fuji Electric Device Technology Co.,Ltd. This material and the information herein is the property of Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fu ji Electric Device Technolo gy Co.,Ltd. Date Classi- fication Ind. Content Applied date Drawn Checked Approved APR.-07 date

DWG.NO. DWG.NO. MS5D2078 3/12 H04-004-03a Fuji Electric Device Technology Co.,Ltd. This material and the information herein is the property of Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fu ji Electric Device Technolo gy Co.,Ltd. 1. SCOPE This specification provides the ratings and the test requirement for FUJI SILICON DIODE PH975C6 2.APPLICATION PFC circuit(current discontinuous mode) This diode is a product which optimizes the diode character istic for the PFC circuit.This product is a product by which th V F characteristic was valued more than trr though there is a relation of the trade-off up to V F and trr. 3. OUT VIEW, MARKING, MOLDING RESIN, CHARACTERISTICS ( 1 ) O u t v i e w i s s h o w n M S 5 D 2 0 7 8 9/12 ( 2 ) M a r k i n g i s s h o w n M S 5 D 2 0 7 8 9/12 It is marked to type name or abbreviated type name, polarity and Lot No. (3)Molding resin Epoxy resin UL : V-0 (4)Characteristics is shown MS5D2078 10/12～12/12 4.LEAD AND LABEL (1)Outer lead material:Cu+Pb-Sn Solder(Dipping) Outer lead material: Cu+Sn-Cu Solder(Dipping) (2)LABEL P b - S n S o l d e r i n g m a r k S n - C u P b Free mark 5. RATINGS 5.1 MAXIMUM RATINGS (at Tc=25℃ unless otherwise specified.) ITEM SYMBOL CONDITIONS RATINGS UNITS Repetitive peak reverse voltage V RRM 600 V Average output current Io 50Hz Square wave duty 1/2 Tc=97℃ 2 0 * A Non-repetitive surge current ** I FSM Sine wave, 10ms 1shot 100 A Operating junction temperature Tj 150 ℃ Storage temperature Tstg -40～+150 ℃ * Out put current of center tap full wave connection. Rating per element 5.2 ELECTRICAL CHARACTERISTICS (at Tc=25℃ unless otherwise specified.) ITEM SYMBOL CONDITIONS MAXIMUM UNITS Forward voltage * V F I F= 10A 1.55 V Reverse current * I R V R=VRRM 1 0 . 0 μ A Reverse recovery time * trr I F=0.1A,IR=0.2A,Irec=0.05A 50.0 ns Thermal resistance Rth(j-c) Junction to case 1.5 ℃/W ***Rating per element

5.3 MECHANICAL CHARACTERISTICS

Mounting torque Recommended torque 0.4～0.6 N・m Approximate mass 4.9 g PCS DATE CODE EIAJ C-3 MADE IN JAPAN 01 A PCS DATE CODE EIAJ C-3 MADE IN JAPAN 01 A Pb

DWG.NO. DWG.NO. MS5D2078 4/12 H04-004-03a Fuji Electric Device Technology Co.,Ltd. This material and the information herein is the property of Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fu ji Electric Device Technolo gy Co.,Ltd. 6. TEST AND INSPECTION

6.1 STANDARD TEST CONDITION

Standard test condition is Ta=25℃、RH=65%. If judgment is no doubt, the test condition is possible to test in normal condition Ta=5～35℃、RH=48～85%

6.2 STRUCTURE INSPECTION

It inspect with eye and measure,Item3 shall be satisfied.

6.3 FORWARD AND REVERSE CHARACTERISTICS

It inspect on the standard condition,Item5.2 shall be satisfied.

6.4 TEST

No. Test Items Testing methods and Conditions Reference Standard EIAJ ED4701 Sampling number Acceptance number

1 Terminal

(Tensile) Pull force : 25N Force maintaining duration :10±1s A-111A method 1 5

2 Terminal

(Bending) Load force : 10N Number of times : 2times(90deg./time) A-111A method 3 5

3 Mounting

Screwing torque value:(M3) : 50±10N・cm A-112 method 2 5

4 Vibration Frequency : 100Hz to 2kHz

Acceleration : 100m/s2 Sweeping time : 4min./1 cycle 4times for each X, Y&Z directions. A-121 5

5 Shock Peak amplitude : 15km/s 2

Duration time : 0.5ms 3times for each X, Y&Z directions. A-122 test code D 5 Solder ability 1 Solder : Sn-37Pb Solder temp. : 235±5℃ Immersion time : 5±0.5s Apply to flux Solder ability 2 Solder : Sn-3Ag-0.5Cu Solder temp. : 245±5℃ Immersion time : 5±0.5s Apply to flux A-131A test code A Mechanical test

7 Resistance to

Solder temp. : 260±5°C Immersion time : 10±1s Number of times : 1times A-132 5 (0 : 1)

DWG.NO. DWG.NO. MS5D2078 5/12 H04-004-03a Fuji Electric Device Technology Co.,Ltd. This material and the information herein is the property of Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fu ji Electric Device Technolo gy Co.,Ltd. Test No. Test Items Testing methods and Conditions Reference Standard EIAJ ED4701 Sampling number Acceptance number 1 High Temp. Storage Temperature :Ｔstg max Test duration : 1000h B-111A 22 2 Low Temp. Storage Temperature :Ｔstg min Test duration : 1000h B-112A 22

3 Temperature

Temperature : 85±2°C Relative humidity : 85±5% Test duration : 1000h B-121A test code C 22

4 Temperature

Temperature : 85±2°C Relative humidity : 85±5% Bias Voltage : VRRM× 0.8 Test duration : 1000h B-122A test code C 22

5 Unsaturated

Temperature : 130±2°C Relative humidity : 85±5% Vapor pressure : 230kPa Test duration : 48h B-123A test code B 22

6 Temperature

High temp. side : Tstg max Room temp. : 5～35℃ Low temp. side : Tstg min Duration time : HT 30min,RT 5min LT 30min Number of cycles : 100 cycles B-131A 22

7 Thermal

Fluid : pure water(running water) High temp. side : 100+0/-5°C Low temp. side : 0+5/-0°C Duration time : HT 5min,LT 5min Number of cycles : 100 cycles B-141A test code A 22

8 Steady state

Ta=25±5°C Rated load Test duration : 1000h D-402 22

9 Intermittent

Tj=Tjmax ～50℃ 3min ON, 3min OFF Test duration : 10000cy D-403 22 Endurance test 10 High Temp. Reverse Bias Temperature : Ta=100 °C Bias Voltage : VR=VRRM duty=1/2 Test duration : 1000h D-404 22 (0 : 1) IR ≦USL x 5 USL : Upper specification Limit Failure Criteria VF≦USL x 1.1

DWG.NO. DWG.NO. MS5D2078 6/12 H04-004-03a Fuji Electric Device Technology Co.,Ltd. This material and the information herein is the property of Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fu ji Electric Device Technolo gy Co.,Ltd. 7.Cautions ・Although Fuji Electric is continually improving product qualit y and reliability, a small percentage of semiconductor products may become faulty. When using Fuji Elect ric semiconductor products in your equipment, you are requested to take adequate safety measures to prevent the equipment from causing physical injury, fire, or other problem in case any of the prod ucts fail. It is recommended to make your design fail-safe, flame retardant, and free of malfunction. ・The products described in this specification are intended for use in the following electronic and electrical equipment which has normal reliability requirements. ・Computers ・OA equipment ・Communi cations equipment (Terminal devices) ・Measurement equipment ・Machine tools ・AV equipment ・Electrical home appliances ・Personal equipment ・Industrial r obots etc. ・The products described in this Specification are not designed or manufactured to be used in equipment or systems used under life-threatening situations. If you are c onsidering using these products in the equipment listed below, first check the system construction and required reliability, and take adequate safety measures such as a backup system to prevent the equipment from malfunctioning. ・Transportation equipment (automobiles, trains, ships, etc.) ・Backbone network equipment ・Traffic-signal control equip ment ・Gas alarms, leakage gas auto breakers ・Submarine repeater equipment ・Burglar alarms, fire alarms, emergency equipment ・Medical equi pment ・Nuclear control equipment etc. ・Do not use the products in this Specification for equipment re quiring strict reliability such as (but not limited to): ・Aerospace equipment ・Aeronautical equipment 8.Warnings ・The Diodes should be used in products within their absolute ma ximum rating (voltage, current, temperature, etc. ). The diodes may be destroyed if used beyond the rating. ・The equipment containing Diodes should have adequate fuses or circuit breakers to prevent the equipment from causing secondary destruction (ex. fire, explosion etc…). ・Use the Diodes within their reliability and lifetime under certain environments or conditions. The Diodes may fail before the target lifetime of your products if used under certain reliability conditions. ・You must design the Diodes to be operated within the specified m a x i m u m r a t i n g s ( v o l t a g e , c u r r e n t , temperature, etc. ) to prevent possible failure or destruction of devices. ・Consider the possible temperature rise not only for the junction and case, but also for the outer leads. ・Do not directly touch the leads or package of the Diodes while power is supplied or during operation, to avoid electric shock and burns. ・The Diodes are made of incombustible material. However, if a D iode fails, it may emit smoke of flame. Also, operating the Diodes near any flammable place or material may cause the Diodes to emit smoke or flame in case the Diodes become even hotter during operation. Design the arrangement to prevent the spread of fire. ・The Diodes should not used in an environment in the presence o f acid, organic matter, or corrosive gas. (hydrogen sulfide, sulfurous acid gas.) ・The Diodes should not used in an irradiated field since they are not radiation proof.

DWG.NO. DWG.NO. MS5D2078 7/12 H04-004-03a Fuji Electric Device Technology Co.,Ltd. This material and the information herein is the property of Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fu ji Electric Device Technolo gy Co.,Ltd. Installation ・Soldering involves temperatures which exceed the device storage temperature rating. To avoid device damage and to ensure reliability, observe the following guidelines from the quality assurance standard. Table 1: Solder temperature and duration Method Solder temperature Duration Flow 260±5℃ 10 ±1second Soldering iron 350±10℃ 3.0 ±0.5second ・The immersion depth of the lead should basically be up to the lead stopper and the distance should be a maximum of 1.5mm from the device. ・When flow-soldering, be careful to avoid immersing the package in the solder bath. ・Refer to the following torque reference When mounting the devi ce on a heat sink. Excess torque applied to the mounting screw causes damage to the device and w eak torque will increase the thermal resistance, both of which conditions may destroy the device. Table 2:Recommended tightening torque Package style Screw Recommended tightening torque TO-247 M3 0.4～0.6N・m ・The heat sink should have a flatness within ±30μ m and roughnes s within 10 μm. Also, keep the tightening torque within the limits of this specification. ・Improper handling may cause isolation breakdown leading to a critical accident. ・We recommend the use of thermal compound to optimize the effic iency of heat radiation. It is important to evenly apply the compound and to eliminate any air voids. Storage ・The Diodes must be stored at a standard temperature of 5 to 35 ℃ and relative humidity of 45 to 75%.If the storage area is very dry, a humidifier may be requir ed. In such a case, use only deionized water or boiled water, since the chlorine in tap water may corrode the leads. ・The Diodes should not be subjected to rapid changes in tempera ture to avoid condensation on the surface of the Diodes. Therefore, store the Diodes in a place where the temperature is steady. ・The Diodes should not be stored on top of each other, since th is may cause excessive external force on the case. ・The Diodes should not be stored with the lead terminals remain ing unprocessed. Rust may cause presoldered connections to go fail during later processing. ・The Diodes should be stored in antistatic containers or shipping bags.

DWG.NO. DWG.NO. MS5D2078 8/12 H04-004-03a Fuji Electric Device Technology Co.,Ltd. This material and the information herein is the property of Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fu ji Electric Device Technolo gy Co.,Ltd. 9.Appendix ・This products does not contain PBBs (Polybrominated Biphenyl) or PBDEs (Polybrominated Diphenyl Ether ) , substances. ・This products does not contain Class-I ODS and Class-II ODS su bstances set force by ‘Clean Air Act of US’ law. ・If you have any questions about any part of this Specification , please contact Fuji Electric or its sales agent before using the product ・Neither Fuji nor its agents shall be held liable for any injur y caused by using the products not in accordance with the instructions. ・The application examples described in this specification are m erely typical uses of Fuji Electric products. This specification does not confer any industrial property righ ts or other rights, nor constitute a license for such rights.

DWG.NO. DWG.NO. MS5D2078 9/12 H04-004-03a Fuji Electric Device Technology Co.,Ltd. This material and the information herein is the property of Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fu ji Electric Device Technolo gy Co.,Ltd. Note:1.Country of origin mark. N o m a r k i s M a d e i n J A P A N . 「 P 」 i s M a d e i n P H I L I P P I N E S . See Note:1

DWG.NO. DWG.NO. MS5D2078 10/12 H04-004-03a Fuji Electric Device Technology Co.,Ltd. This material and the information herein is the property of Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fu ji Electric Device Technolo gy Co.,Ltd. 02468 1 0 Square wave λ=180° Sine wave λ=180° Square wave λ=120° Per 1element DC Square wave λ=60° Forward Power Dissipation (max.) WF Forward Power Dissipation (W) Io Average Output Current (A) 0 100 200 300 400 500 600 700 0.000 0.001 0.002 0.003 0.004 0.005 0.006 0.007 0.008 0.009 0.010 0.011 0.012 0.013 0.014 0.015 Reverse Power Dissipation (max.) α=180° DC PR Reverse Power Dissipation (W) VR Reverse Voltage (V) Tj=100°C Tj=25°C Tj=125°C Tj=150°C Forward Characteristic (typ.) IF Forward Current (A) VF Forward Voltage (V) 0 100 200 300 400 500 600 700 Reverse Characteristic (typ.) Tj=25°C Tj=100°C Tj=125°C Tj=150°C IR Reverse Current (µA) VR Reverse Voltage (V)

DWG.NO. DWG.NO. MS5D2078 11/12 H04-004-03a Fuji Electric Device Technology Co.,Ltd. This material and the information herein is the property of Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fu ji Electric Device Technolo gy Co.,Ltd. 0 2 4 6 8 1 01 21 41 61 82 02 22 42 62 8 100 110 120 130 140 150 160 Square wave λ=60° Square wave λ=120° λ:Conduction angle of forward current for each rectifier element Io:Output current of center-tap full wave connection Square wave λ=180° Sine wave λ=180° DC Current Derating (Io-Tc) (max.) Tc Case Temperature (°C) Io Average Output Current (A) 1 10 100 1000 100 1000 Junction Capacitance Characteristic (typ.) Cj Junction Capacitance (pF) VR Reverse Voltage (V) 1 10 100 1000 100 1000 Surge Current Ratings (max.) IFSM Peak Half - Wave Current (A) t Time (ms) Sine wave 1 10 100 100 1000 Surge Capability (max.) IFSM Peak Half - Wave Current (A) Number of Cycles at 50Hz

DWG.NO. DWG.NO. MS5D2078 12/12 H04-004-03a Fuji Electric Device Technology Co.,Ltd. This material and the information herein is the property of Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fu ji Electric Device Technolo gy Co.,Ltd. Rth j-c:1.5℃/W Transient Thermal Impedance (max.) Transient Thermal Impedance (°C/W) t Time (sec)