PG1X-1LFE

PG1X-1LFE ELITE | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 14

Technical content

Features

• R, G, B three color in one Package
• High flux per LED
• Very long operating life(up to 100k hours)
• Good color uniformity
• Industry best moisture senstivity level - JEDEC 2a 4 week floor life without reconditioning
• Low-temp. & lead free reflow soldering
• RoHS compliant
• More energy efficient than incandescent and most halogen lamps
• Low Voltage DC operated
• Instant light (less than 100ns)
• No UV Typical Applications
• Reading lights (car, bus, aircraft)
• Portable (flashlight, bicycle)
• Uplighters/Downlighters
• Decorative/Entertainment
• Bollards/Security/Garden
• Cove/Undershelf/Task
• Indoor/Outdoor Commercial and Residential Architectural
• Automotive Ext (Stop-Tail-Turn, CHMSL, Mirror Side Repeat)
• LCD backlights 1 2010/04 Technology Corporation

Notes: 1. The cathode side of the device is denoted by a hole in the lead frame. 2. Electrical insulation between the case and the board is required --- slug of device is not electrically neutral. Do not electrically connect either the anode or cathode to the slug. 3. Drawing not to scale. 4. All dimensions are in millimeters. 5. All dimendions without tolerances are for reference only. 6. Please do not bend the leads of the LED, otherwise it will damage the LED. 7. Please do not use a force of over 3kgf impact or pressure on the lens of the LED, otherwise it will cause a catastrophic failure. *The appearance and specifications of the product may be modified for improvement without notice. Lambertian - Standard Emitter Lambertian - Low Profile Emitter TOP VIEW BOTTOM VIEW TOP VIEW BOTTOM VIEW

Flux Characteristics at 150mA, TJ = 25°C Radiation Pattern Standard Emitter Low Profile Emitter Minimum Typical Green 10.7 17 Blue 2.9 5 Red 8.2 14.5

• ProLight maintains a tolerance of ± 10% on flux and power measurements.
• Please do not drive at rated current more than 1 second without proper heat sink. Electrical Characteristics at 150mA, TJ = 25°C Temperature Thermal Coefficient of Resistance Dynamic VF (mV/ °C) Junction to Color Resistance ( Ω) ΔVF/ ΔTJ Slug (°C/ W) Green 1.0 -2.0 10 Blue 1.0 -2.0 10 Red 2.4 -2.0 10 Optical Characteristics at 150mA, TJ = 25°C
• ProLight maintains a tolerance of ± 1nm for dominant wavelength measurements. Lumious Flux ΦV (lm) 1.9 2.2 3.1 Forward Voltage VF (V) Color Part Number PG1N-1LFE Min. Typ. Max. PG1A-1LFE Lambertian 2.8 3.5 4.3 2.8 3.5 4.3 Temperature Coefficient of Total Spectral Dominant included Viewing Half-width Wavelength An gle Angle Radiation (nm) (nm/ °C) (degrees) (degrees) Pattern Min. T yp. Max. Δλ1/2 ΔλD/ ΔTJ θ0.90V 2 θ1/2 Green 515 nm 525 nm 535 nm 35 0.04 160 140 Blue 455 nm 465 nm 475 nm 25 0.04 160 140 Red 613.5 nm 623 nm 631 nm 20 0.05 160 140 Lambertian Dominant Wavelength λD, or Color Temperature CCT Color

DC Forward Current (mA) Peak Pulsed Forward Current (mA) Average Forward Current (mA) ESD Sensitivity (HBM per MIL-STD-883E Method 3015.7) LED Junction Temperature (°C) Aluminum-core PCB Temperature (°C) Storage & Operating Temperature (°C) Soldering Temperature(°C) > ±500V 235°C 120 105 -40 to +105 Green/Blue/Red 150 250 150

Color Spectrum, TJ = 25°C Light Output Characteristics Relative Light Output vs. Junction Temperature at 150mA 0.0 0.2 0.4 0.6 0.8 1.0 400 450 500 550 600 650 700 Wavelength(nm) Relative Spectral Power Distribution Blue Green Red 100 120 140 160 12345678 Junction Temperature, T J (℃) Relative Light Output (%) -20 0 20 40 60 80 100 120 Green Blue Red

Forward Current Characteristics, TJ = 25°C 1. Forward Voltage vs. Forward Current 2. Forward Current vs. Normalized Relative Luminous Flux 100 120 140 160 0 0.5 1 1.5 2 2.5 3 Forward Voltage (V) Average Forward Current (mA) Red 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 50 100 150 200 Forward Current (mA) Relative Luminous Flux 100 120 140 160 0 0.5 1 1.5 2 2.5 3 3.5 4 Forward Voltage (V) Average Forward Current (mA) Green, Blue 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 50 100 150 200 Forward Current (mA) Relative Luminous Flux RedGreen, Blue

Typical Representative Spatial Radiation Pattern Lambertian Radiation Pattern 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Angular Displacement (Degrees) Relative Intensity

Moisture Sensitivity Level - JEDEC 2a Level Time Conditions Time (hours) Conditions Time (hours) Conditions 60% RH 60% RH 60% RH

• The standard soak time includes a default value of 24 hours for semiconductor manufature's exposure time (MET) between bake and bag and includes the maximum time allowed out of the bag at the distributor's facility.
• Table below presents the moisture sensitivity level definitions per IPC/JEDEC's J-STD-020C. Level Time Conditions Time (hours) Conditions Time (hours) Conditions ≤30°C / 85 °C / 85% RH 85% RH ≤30°C / 85 °C / 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH Time on Label ≤30°C / Time on Label 30°C / (TOL) 60% RH (TOL) 60% RH Floor Life Standard Accelerated Environment Soak Requirements 2a 4 weeks 696 +5/-0 120 +1/-0 Soak Requirements Floor Life Standard Accelerated Environment

1 Unlimited 168 +5/-0 NA

2a 4 weeks 696 +5/-0 120 +1/-0 3 168 hours 192 +5/-0 40 +1/-0 4 72 hours 96 +2/-0 20 +0.5/-0 5 48 hours 72 +2/-0 15 +0.5/-0 NA NA NA 6 NA 5a 24 hours 48 +2/-0 10 +0.5/-0

Qualification Reliability Testing Stress Test Stress Duration Failure Criteria Room Temperature Operating Life (RTOL) Wet High Temperature Operating Life (WHTOL) Wet High Temperature Storage Life (WHTSL) High Temperature Storage Life (HTSL) Low Temperature Storage Life (LTSL) Non-operating Temperature Cycle (TMCL) Non-operating Thermal Shock (TMSK) Variable Vibration Frequency Solder Heat Resistance (SHR) Solder coverage on lead Notes: 1. Depending on the maximum derating curve. 2. Criteria for judging failure Min. I F = max DC - VR = 5V - * The test is performed after the LED is cooled down to the room temperature. 3. A failure is an LED that is open or shorted. at 260°C for 5 sec. IF = max DC Criteria for Judgement Forward Voltage (VF) Luminous Flux or Radiometric Power (ΦV) Test Condition Solderability 50 μA -Initial Level x 0.7 Item Reverse Current (IR) Max. Initial Level x 1.1 10-2000-10 Hz, log or linear sweep rate, 20 G about 1 min., 1.5 mm, 3X/axis 260°C ± 5°C, 10 sec. Steam age for 16 hrs., then solder dip Stress Conditions 25°C, IF = max DC (Note 1) 85°C/60%RH, IF = max DC (Note 1) 110°C, non-operating 85°C/85%RH, non-operating -40°C, non-operating -40°C to 120°C, 30 min. dwell, <5 min. transfer -40°C to 120°C, 20 min. dwell, Natural Drop <20 sec. transfer 1500 G, 0.5 msec. pulse, 5 shocks each 6 axis On concrete from 1.2 m, 3X Mechanical Shock 1000 hours 1000 hours Note 2 Note 2 Note 3 Note 3 Note 2 Note 2 1000 hours Note 2 Note 3 Note 3 Note 2 Note 2 1000 hours 1000 hours 200 cycles 200 cycles

Recommended Solder Pad Design

• All dimensions are in millimeters.
• Electrical isolation is required between Slug and Solder Pad. Standard Emitter Low Profile Emitter

Reflow Soldering Condition

• All temperatures refer to topside of the package, measured on the package body surface.
• Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a heat plate should be used. It should be confirmed beforehand whether the characteristics of LEDs will or will not be damaged by repairing.
• Reflow soldering should not be done more than two times.
• When soldering, do not put stress on the LEDs during heating.
• After soldering, do not warp the circuit board. 100 °C 150 °C 60-120 seconds 3 °C / second max. 183°C 60-150 seconds 235°C 20 seconds Average ramp-down rate (TP to Tsmax) Time 25°C to Peak Temperature classification temperature (TC) 6 °C/second max. 6 minutes max. Profile Feature Average Ramp-Up Rate (Tsmax to TP) Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP) 20 secondsTime (tP) within 5°C of the specified 138°C 20-50 seconds 185°C Sn-Pb Eutectic Assembly 3 °C/second max. 4 minutes max. (58Bi-42Sn Eutectic Alloy) Low-Temp. & Pb-Free Assembly 90 °C 120 °C 60-120 seconds 2 °C / second max.

Heat Plate Soldering Condition

• Heat plate temperature: 230°C max for Lead Solder and 230°C max for Lead-Free Solder.
• We recommend using the 58Bi-42Sn eutectic alloy for low-temp. and lead free soldering (melting point = 138 °C).
• When soldering, do not put stress on the LEDs during heating.
• After soldering, do not warp the circuit board. Manual Hand Soldering
• Solder tip temperature: 230°C max for Lead Solder and 260°C max for Lead-Free Solder.
• Avoiding damage to the emitter or to the MCPCB dielectric layer. Damage to the epoxy layer can cause
• Do not let the solder contact from solder pad to back-side of MCPCB. This one will cause a short circuit and damage emitter. a short circuit in the array.
• For prototype builds or small series production runs it possible to place and solder the emitters by hand. MCPCB Place Emitter on MCPCB. Put MCPCB on Heat Plate. Place Solder Wire to the solder pad of MCPCB. MCPCB Solder Paste Heat Plate (1) Soldering Process for Solder Paste (2) Soldering Process for Solder Wire Heat Plate Heat Plate Solder Wire Put Emitter on MCPCB. Take the MCPCB out from Heat Plate within 10 seconds. Thermal Conductive Glue MCPCB Place Emitter on the MCPCB. Use Soldering Iron to solder the leads of Emtter within 5 seconds. Emitter Emitter Heat Plate Emitter Use Solder Mask to print Solder Paste on MCPCB. Put MCPCB on Heat Plate until Solder Paste melt. The Solder Paste sould be melted within 10 seconds. Take out MCPCB out from Heat Plate within 15 seconds. Place Thermal Comductive Glue on the MCPCB. Soldering Iron Solder Wire

Notes: 1. 50pieces per tube. 2. Drawing not to scale. 3. All dimensions are in millimeters. 4 .All dimendions without tolerances are for reference only. **Please do not open the moisture barrier bag (MBB) more than one week. This may cause the leads of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening the MBB. The recommended storage conditions are temperature 5 to 30°C and humidity less than 40% RH.

Handling of Silicone Lens LEDs

• Storage Please do not open the moisture barrier bag (MBB) more than one week. This may cause the leads of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening the MBB. The recommended storage conditions are temperature 5 to 30°C and humidity less than 40% RH. It is also recommended to return the LEDs to the MBB and to reseal the MBB.
• The slug is is not electrically neutral. Therefore, we recommend to isolate the heat sink.
• The slug is to be soldered. If not, please use the heat conductive adhesive.
• Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering.
• Please avoid rapid cooling after soldering.
• Components should not be mounted on warped direction of PCB.
• Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a heat plate should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
• This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When cleaning is required, isopropyl alcohol should be used.
• When the LEDs are illuminating, operating current should be decide after considering the package maximum temperature.
• The appearance, specifications and flux bin of the product may be modified for improvement without notice. Please refer to the below website for the latest datasheets. h ttp://www.prolightopto.com/ Notes for handling of silicone lens LEDs
• Please do not use a force of over 3kgf impact or pressure on the silicone lens, otherwise it will cause a catastrophic failure.
• The LEDs should only be picked up by making contact with the sides of the LED body.
• Avoid touching the silicone lens especially by sharp tools such as Tweezers.
• Avoid leaving fingerprints on the silicone lens.
• Please store the LEDs away from dusty areas or seal the product against dust.
• When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the silicone lens must be prevented.
• Please do not mold over the silicone lens with another resin. (epoxy, urethane, etc) ╳ ○