PG1C-1LAE

PG1C-1LXX ELITE | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 22

Technical content

Features

• High flux per LED
• Various colors
• Good color uniformity
• Industry best moisture senstivity level - JEDEC 2a 4 week floor life without reconditioning
• Low-temp. & lead free reflow soldering
• RoHS compliant
• More energy efficient than incandescent and most halogen lamps
• Low Voltage DC operated
• Instant light (less than 100ns)
• No UV
• Superior ESD protection Typical Applications
• Reading lights (car, bus, aircraft)
• Portable (flashlight, bicycle)
• Uplighters/Downlighters
• Decorative/Entertainment
• Bollards/Security/Garden
• Cove/Undershelf/Task
• Indoor/Outdoor Commercial and Residential Architectural
• Automotive Ext (Stop-Tail-Turn, CHMSL, Mirror Side Repeat)
• LCD backlights 1 2010/04

Emitter Mechanical Dimensions Notes: 1. The Anode side of the device is denoted by a hole in the lead frame. 2. Electrical insulation between the case and the board is required --- slug of device is not electrically neutral. Do not electrically connect either the anode or cathode to the slug. 3. Drawing not to scale. 4. All dimensions are in millimeters. 5. All dimendions without tolerances are for reference only. 6. Please do not bend the leads of the LED, otherwise it will damage the LED. 7. Please do not use a force of over 3kgf impact or pressure on the lens of the LED, otherwise it will cause a catastrophic failure. *The appearance and specifications of the product may be modified for improvement without notice. TOP VIEW BOTTOM VIEW

Star Mechanical Dimensions Notes: 1. Slots in aluminum-core PCB for M3 or #4 mounting screw. 2. Electrical interconnection pads labeled on the aluminum-core PCB with "+" and "-" to denote positive and negative, respectively. All positive pads are interconnected, as are all negative pads, allowing for flexibility in array interconnection. 3. Drawing not to scale. 4. All dimensions are in millimeters. 5. All dimendions without tolerances are for reference only. 6. Please do not use a force of over 3kgf impact or pressure on the lens of the LED, otherwise it will cause a catastrophic failure. *The appearance and specifications of the product may be modified for improvement without notice.

Flux Characteristics at 350mA, TJ = 25°C Radiation Pattern Emitter Star Minimum Typical White PG1C-1LWE PG1C-1LWS 76.6 lm 87 lm Warm White PG1C-1LVE PG1C-1LVS 67.2 lm 81 lm Crimson PG1C-1LME PG1C-1LMS 10.7 lm 16 lm Red PG1C-1LRE PG1C-1LRS 30.6 lm 45 lm Amber PG1C-1LAE PG1C-1LAS 30.6 lm 47 lm Green PG1C-1LGE PG1C-1LGS 58.9 lm 66 lm Cyan PG1C-1LCE PG1C-1LCS 39.8 lm 53 lm Blue PG1C-1LBE PG1C-1LBS 10.7 lm 18 lm Royal Blue PG1C-1LDE PG1C-1LDS 225 mW 300 mW UV PG1C-1LLE PG1C-1LLS 225 mW 270 mW Cherry Red PG1C-1LEE PG1C-1LES 115 mW 150 mW

• ProLight maintains a tolerance of ± 10% on flux and power measurements.
• Please do not drive at rated current more than 1 second without proper heat sink. Electrical Characteristics at 350mA, TJ = 25°C Color Min. Typ. Max. White 2.85 3.5 4.1 Warm White 2.85 3.5 4.1 Crimson 1.75 2.2 3.0 Red 1.75 2.2 3.0 Amber 1.75 2.2 3.0 Green 2.85 3.5 4.1 Cyan 2.85 3.5 4.1 Blue 2.85 3.5 4.1 Royal Blue 2.85 3.5 4.1 UV 2.85 3.5 4.1 Cherry Red 1.75 2.2 3.0 10 Color Part Number LumiousFlux or Power Lambertian Forward Voltage VF (V) Thermal Resistance Junction to Slug (°C/ W)

Optical Characteristics at 350mA, TJ = 25°C Total included Viewing Angle Angle (degrees) (degrees) Min. Typ. Max. θ0.90V 2 θ1/2 White 4100 K 5500 K 10000 K 160 140 Warm White 2700 K 3300 K 4100 K 160 140 Crimson 635 nm 640 nm 645 nm 160 140 Red 613.5 nm 623 nm 631 nm 160 140 Amber 587 nm 592 nm 597 nm 160 140 Green 515 nm 525 nm 535 nm 160 140 Cyan 495 nm 505 nm 515 nm 160 140 Blue 455 nm 465 nm 475 nm 160 140 Royal Blue 450 nm 455 nm 460nm 160 140 UV [1] 390 nm 400 nm 410 nm 160 140 Cherry Red [1] 720 nm 730 nm 740 nm 160 140

• ProLight maintains a tolerance of ± 1nm for dominant wavelength measurements.
• ProLight maintains a tolerance of ± 5% for CCT measurements. [1] UV, Cherry Red, product is binned by radiometric power and peak wavelength rather than photometric lumens and dominant wavelength. ProLight Lumileds maintains a tolerance of ±2nm for peak wavelength measurements. Absolute Maximum Ratings Parameter DC Forward Current (mA) Peak Pulsed Forward Current (mA) Average Forward Current (mA) ESD Sensitivity (HBM per MIL-STD-883E Method 3015.7) LED Junction Temperature (°C) Aluminum-core PCB Temperature (°C) Storage & Operating Temperature (°C) Soldering Temperature(°C) 350 Dominant Wavelength λD, or Color Temperature CCT ±4000V (Class III) 350 500 105 -40 to +105 235°C Peak Wavelength [1]λP, Color 120 White/Warm White/Crimson/Red/Amber/ Green/Cya/Blue/Royal Blue/UV/Cherry Red

Radiometric Power Bin Structure M N P M N P J K

• ProLight maintains a tolerance of ± 10% on flux and power measurements.
• The flux bin of the product may be modified for improvement without notice. 【1】The rest of color bins are not 100% ready for order currently. Please ask for quote and order possibility. Photometric Luminous Flux Bin Structure L M N Q R Q R R L M N
• ProLight maintains a tolerance of ± 10% on flux and power measurements.
• The flux bin of the product may be modified for improvement without notice. 【1】The rest of color bins are not 100% ready for order currently. Please ask for quote and order possibility. 6.3 8.2 8.2 10.7Cherry Red UV 225 275 Cyan 39.8 1, 2【1】 275 355 All 355 435 【1】 51.7 Royal Blue 225 275 All 275 355 All 355 435 All Color Bin Code Minimum Maximum Available Radiometric Power (mW) Radiometric Power (mW) Color Bins 51.7 58.9 All 【1】 All All 【1】 58.9 Red 30.6 39.8 39.8 51.7 51.7 58.9 All All 【1】 Amber 30.6 39.8 39.8 51.7 51.7 A, 1【1】 A, 1, 2【1】 2【1】 All All 【1】 Blue 10.7 13.9 13.9 18.1 18.1 23.5 White Green 58.9 67.2 67.2 76.6 76.6 87.4 76.6 Photometric Flux (lm) Photometric Flux (lm) 99.6 Minimum Maximum Color Bins Warm White 67.2 76.6 87.4 99.6 76.6 87.4 87.4 87.4 Crimson 10.7 13.9 13.9 Color Bin Code 18.1 18.1 23.5 All Yx, Xx, Wx, Vx, Ux【1】 All All Sx, Rx【1】 All All 【1】 All 【1】 Available

White and Warm White Binning Structure Graphical Representation 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 y x 10000 K 7000 K 6300 K 5650 K 5000 K 4500 K 4100 K 3800 K 3500 K 3250 K 3050 K

2850 K 2700 K

(BBL) Warm White White

Bin Code x y Typ. CCT (K) Bin Code x y Typ. CCT (K) 0.378 0.382 0.329 0.345 0.374 0.366 0.316 0.333 0.360 0.357 0.315 0.344 0.362 0.372 0.329 0.357 0.382 0.397 0.329 0.331 0.378 0.382 0.329 0.320 0.362 0.372 0.318 0.310 0.365 0.386 0.317 0.320 0.362 0.372 0.308 0.311 0.360 0.357 0.305 0.322 0.344 0.344 0.316 0.333 0.346 0.359 0.317 0.320 0.365 0.386 0.305 0.322 0.362 0.372 0.303 0.333 0.346 0.359 0.315 0.344 0.347 0.372 0.316 0.333 0.329 0.331 0.308 0.311 0.329 0.345 0.317 0.320 0.346 0.359 0.319 0.300 0.344 0.344 0.311 0.293 0.329 0.345 0.308 0.311 0.329 0.357 0.283 0.284 0.347 0.372 0.274 0.301 0.346 0.359 0.303 0.333 0.329 0.345 0.308 0.311 0.329 0.331 0.311 0.293 0.317 0.320 0.290 0.270 0.316 0.333 0.283 0.284

• Tolerance on each color bin (x , y) is ± 0.01 Note: Although several bins are outlined, product availability in a particular bin varies by production run and by product performance. Not all bins are available in all colors. W0 5970 YA 8000 V0 5320 XP 6650 VN 5320 Y0 8000 U0 4750 X0 6650 UN 4750 XN 6650 T0 4300 WN 5970 TN 4300 WP 5970 Y0 V1V0YA WAX1X0 W0 CCT 4500KCCT 5000KCCT 5500KCCT 6000KCCT 7000KCCT 8000K

Bin Code x y Typ. CCT (K) Bin Code x y Typ. CCT (K) 0.453 0.416 0.409 0.400 0.444 0.399 0.402 0.382 0.459 0.403 0.416 0.389 0.467 0.419 0.424 0.407 0.460 0.430 0.414 0.414 0.453 0.416 0.409 0.400 0.467 0.419 0.424 0.407 0.473 0.432 0.430 0.421 0.438 0.412 0.392 0.391 0.429 0.394 0.387 0.374 0.444 0.399 0.402 0.382 0.453 0.416 0.409 0.400 0.444 0.426 0.414 0.414 0.438 0.412 0.409 0.400 0.453 0.416 0.392 0.391 0.460 0.430 0.397 0.406 0.424 0.407 0.392 0.391 0.416 0.389 0.387 0.374 0.429 0.394 0.374 0.366 0.438 0.412 0.378 0.382 0.430 0.421 0.397 0.406 0.424 0.407 0.392 0.391 0.438 0.412 0.378 0.382 0.444 0.426 0.382 0.397

• Tolerance on each color bin (x , y) is ± 0.01 Note: Although several bins are outlined, product availability in a particular bin varies by production run and by product performance. Not all bins are available in all colors. P0 3150 S0 3950 P1 3150 S1 3950 N0 2950 R0 3650 N1 2950 R1 3650 M0 2770 Q0 3370 M1 2770 Q1 3370 Y0 V1V0YA WAX1X0 W0 CCT 4500KCCT 5000KCCT 5500KCCT 6000KCCT 7000KCCT 8000K

Peak Wavelength Bin Structure Cherry Red 1

• ProLight maintains a tolerance of ± 1nm for peak wavelength measurements. Dominant Wavelength Bin Structure Crimson 1 A A A
• ProLight maintains a tolerance of ± 1nm for dominant wavelength measurements. Note: Although several bins are outlined, product availability in a particular bin varies by production run and by product performance. Not all bins are available in all colors. 460 Green 515 520 455 720 740 635 645 450 455 530 535 525 530 465 470 460 510 Amber Red Blue 475470 455 460 465 594.5 597.0 587.0 589.5 Wavelength (nm) Wavelength (nm)Bin CodeColor 592.0 620.5 631.0 613.5 620.5 Minimum Dominant 589.5 592.0 Maximum Dominant 500 500 505 505 510 495 520 525 594.5 515 Royal Blue Color Bin Code Minimum Peak Maximum Peak Wavelength (nm) Wavelength (nm) UV Cyan 405 410 390 395 395 400 400 405

Color Spectrum, TJ = 25°C 1. White 2. Warm White 3. UV、Royal Blue、Blue、Cyan、Green、Amber、Red、Crimson、Cherry Red 0.0 0.2 0.4 0.6 0.8 1.0 350 400 450 500 550 600 650 700 750 800 850 Relative Spectral Power Distribution Wavelength(nm) Standard Eye Response Cruve White 0.0 0.2 0.4 0.6 0.8 1.0 350 400 450 500 550 600 650 700 750 800 850 Relative Spectral Power Distribution Wavelength(nm) Standard Eye Response Cruve Warm White 0.0 0.2 0.4 0.6 0.8 1.0 350 400 450 500 550 600 650 700 750 800 Relative Spectral Power Distribution Wavelength(nm) Blue Green Amber Red CyanRoyal Blue UV Crimson Cherry Red

Light Output Characteristics Relative Light Output vs. Junction Temperature at 350mA 100 120 140 160 1 2 3 4 5 6 7 8 Relative Light Output (%) Junction Temperature, TJ (℃) -20 0 20 40 60 80 100 120 White, Warm White Green, Cyan, Royal Blue, UV Blue 100 120 140 160 Relative Light Output (%) Junction Temperature, TJ (℃) -20 0 20 40 60 80 100 120 Crimson, Red Cherry Red Amber

Forward Current Characteristics, TJ = 25°C 1. Forward Voltage vs. Forward Current 2. Forward Current vs. Normalized Relative Luminous Flux 100 150 200 250 300 350 400 0 0.5 1 1.5 2 2.5 3 Average Forward Current (mA) Forward Voltage (V) Crimson, Red, Amber, Cherry Red, 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 100 200 300 400 Relative Luminous Flux Forward Current (mA) White, Warm White, Green, Cyan, Blue, Royal Blue, UV 100 150 200 250 300 350 400 0 0.5 1 1.5 2 2.5 3 3.5 4 Average Forward Current (mA) Forward Voltage (V) White, Warm White, Green, Cyan, Blue, Royal Blue, UV 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 100 200 300 400 Relative Luminous Flux Forward Current (mA) Crimson, Red, Amber, Cherry Red,

Ambient Temperature vs. Maximum Forward Current 1. White, Warm White, Green, Cyan, Blue, Royal Blue, UV (TJMAX = 120°C) 2. Crimson, Red, Amber, Cherry Red (TJMAX = 120°C) 100 150 200 250 300 350 400 0 25 50 75 100 125 150 Forward Current (mA) Ambient Temperature (℃) RθJ-A = 60°C/W RθJ-A = 50°C/W RθJ-A = 30°C/W RθJ-A = 40°C/W 100 150 200 250 300 350 400 0 25 50 75 100 125 150 Forward Current (mA) Ambient Temperature (℃) RθJ-A = 60°C/W RθJ-A = 50°C/W RθJ-A = 30°C/W RθJ-A = 40°C/W

Typical Representative Spatial Radiation Pattern Lambertian Radiation Pattern 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Relative Intensity Angular Displacement (Degrees)

Moisture Sensitivity Level - JEDEC 2a Level Time Conditions Time (hours) Conditions Time (hours) Conditions 60% RH 60% RH 60% RH

• The standard soak time includes a default value of 24 hours for semiconductor manufature's exposure time (MET) between bake and bag and includes the maximum time allowed out of the bag at the distributor's facility.
• Table below presents the moisture sensitivity level definitions per IPC/JEDEC's J-STD-020C. Level Time Conditions Time (hours) Conditions Time (hours) Conditions ≤30°C / 85°C / 85% RH 85% RH ≤30°C / 85°C / 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH 60% RH Time on Label ≤30°C / Time on Label 30°C / (TOL) 60% RH (TOL) 60% RH Soak Requirements Floor Life Standard Accelerated Environment 2a 4 weeks 696 +5/-0 120 +1/-0 Soak Requirements Floor Life Standard Accelerated Environment

1 Unlimited 168 +5/-0 NA NA

2a 4 weeks 696 +5/-0 120 +1/-0 3 168 hours 192 +5/-0 40 +1/-0 4 72 hours 96 +2/-0 20 +0.5/-0

6 NA NA

5 48 hours 72 +2/-0 15 +0.5/-0 5a 24 hours

Qualification Reliability Testing Stress Test Stress Duration Failure Criteria Room Temperature Operating Life (RTOL) Wet High Temperature Operating Life (WHTOL) Wet High Temperature Storage Life (WHTSL) High Temperature Storage Life (HTSL) Low Temperature Storage Life (LTSL) Non-operating Temperature Cycle (TMCL) Non-operating Thermal Shock (TMSK) Variable Vibration Frequency Solder Heat Resistance (SHR) Solder coverage on lead Notes: 1. Depending on the maximum derating curve. 2. Criteria for judging failure Min. IF = max DC -- VR = 5V -- * The test is performed after the LED is cooled down to the room temperature. 3. A failure is an LED that is open or shorted. Stress Conditions 25°C, IF = max DC (Note 1) 1000 hours Note 2 85°C/60%RH, IF = max DC (Note 1) 1000 hours Note 2 85°C/85%RH, non-operating 1000 hours Note 2 110°C, non-operating 1000 hours Note 2 -40°C, non-operating 1000 hours Note 2 -40°C to 120°C, 30 min. dwell, 200 cycles Note 2<5 min. transfer -40°C to 120°C, 20 min. dwell, 200 cycles Note 2<20 sec. transfer Mechanical Shock 1500 G, 0.5 msec. pulse, Note 35 shocks each 6 axis Natural Drop On concrete from 1.2 m, 3X Note 3 10-2000-10 Hz, log or linear sweep rate, Note 320 G about 1 min., 1.5 mm, 3X/axis 260°C ± 5°C, 10 sec. Note 3 Solderability Steam age for 16 hrs., then solder dip at 260°C for 5 sec. Item Test Condition Criteria for Judgement Max. Reverse Current (IR) 50 μA Forward Voltage (VF) Initial Level x 1.1 Luminous Flux or IF = max DC Initial Level x 0.7 --Radiometric Power (ΦV)

Recommended Solder Pad Design

• All dimensions are in millimeters.
• Electrical isolation is required between Slug and Solder Pad.

Reflow Soldering Condition

• All temperatures refer to topside of the package, measured on the package body surface.
• Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a heat plate should be used. It should be confirmed beforehand whether the characteristics of LEDs will or will not be damaged by repairing.
• Reflow soldering should not be done more than two times.
• When soldering, do not put stress on the LEDs during heating.
• After soldering, do not warp the circuit board. Sn-Pb Eutectic Assembly 3 °C/second max. 4 minutes max. (58Bi-42Sn Eutectic Alloy) Low-Temp. & Pb-Free Assembly 90 °C 120 °C 60-120 seconds 2 °C / second max. Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP) 20 secondsTime (tP) within 5°C of the specified 138°C 20-50 seconds 185°C Profile Feature Average Ramp-Up Rate (Tsmax to TP) Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) Average ramp-down rate (TP to Tsmax) Time 25°C to Peak Temperature classification temperature (TC) 6 °C/second max. 6 minutes max. 100 °C 150 °C 60-120 seconds 3 °C / second max. 183°C 60-150 seconds 235°C 20 seconds

Heat Plate Soldering Condition

• Heat plate temperature: 230°C max for Lead Solder and 230°C max for Lead-Free Solder.
• We recommend using the 58Bi-42Sn eutectic alloy for low-temp. and lead free soldering (melting point = 138 °C).
• When soldering, do not put stress on the LEDs during heating.
• After soldering, do not warp the circuit board. Manual Hand Soldering
• Solder tip temperature: 230°C max for Lead Solder and 260°C max for Lead-Free Solder.
• Avoiding damage to the emitter or to the MCPCB dielectric layer. Damage to the epoxy layer can cause
• Do not let the solder contact from solder pad to back-side of MCPCB. This one will cause a short circuit and damage emitter. a short circuit in the array.
• For prototype builds or small series production runs it possible to place and solder the emitters by hand. Figure 8a. Lead Solder Temperature ProfileFigure 8b. Lead-free Solder Temperature Profile MCPCB Place Emitter on MCPCB. Put MCPCB on Heat Plate. Place Solder Wire to the solder pad of MCPCB. MCPCB Solder Paste Heat Plate (1) Soldering Process for Solder Paste (2) Soldering Process for Solder Wire Heat Plate Heat Plate Heat Plate Solder Wire Put Emitter on MCPCB. Take the MCPCB out from Heat Plate within 10 seconds. Thermal Conductive Glue MCPCB Place Emitter on the MCPCB. Use Soldering Iron to solder the leads of Emtter within 5 seconds. Emitter Emitter Emitter Use Solder Mask to print Solder Paste on MCPCB. Put MCPCB on Heat Plate until Solder Paste melt. The Solder Paste sould be melted within 10 seconds. Take out MCPCB out from Heat Plate within 15 seconds. Place Thermal Comductive Glue on the MCPCB. Soldering Iron Solder Wire

Notes: 1. Emitter 50 pieces per tube and Star 20 pieces per tube. 2. Drawing not to scale. 3. All dimensions are in millimeters. 4. All dimendions without tolerances are for reference only. **Please do not open the moisture barrier bag (MBB) more than one week. This may cause the leads of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening the MBB. The recommended storage conditions are temperature 5 to 30°C and humidity less than 40% RH.

Handling of Silicone Lens LEDs

• Storage Please do not open the moisture barrier bag (MBB) more than one week. This may cause the leads of LED discoloration. We recommend storing ProLight’s LEDs in a dry box after opening the MBB. The recommended storage conditions are temperature 5 to 30°C and humidity less than 40% RH. It is also recommended to return the LEDs to the MBB and to reseal the MBB.
• The slug is is not electrically neutral. Therefore, we recommend to isolate the heat sink.
• The slug is to be soldered. If not, please use the heat conductive adhesive.
• Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering.
• Please avoid rapid cooling after soldering.
• Components should not be mounted on warped direction of PCB.
• Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a heat plate should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
• This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When cleaning is required, isopropyl alcohol should be used.
• When the LEDs are illuminating, operating current should be decide after considering the package maximum temperature.
• The appearance, specifications and flux bin of the product may be modified for improvement without notice. Please refer to the below website for the latest datasheets. http://www.prolightopto.com/ Notes for handling of silicone lens LEDs
• Please do not use a force of over 3kgf impact or pressure on the silicone lens, otherwise it will cause a catastrophic failure.
• The LEDs should only be picked up by making contact with the sides of the LED body.
• Avoid touching the silicone lens especially by sharp tools such as Tweezers.
• Avoid leaving fingerprints on the silicone lens.
• Please store the LEDs away from dusty areas or seal the product against dust.
• When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the silicone lens must be prevented.
• Please do not mold over the silicone lens with another resin. (epoxy, urethane, etc) ╳ ○