PDC3010C

PDC3010C SUPERWORLD | Alldatasheet

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SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 18.04.2008 SMD Power Inductors (Lead Free) PDC3010C SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. P D C 3 0 1 0 C - 1 R 0 Y F (a) (b) (e)(f) 1. PART NO. EXPRESSION : (c) Type code (b) Dimension code (e) Tolerance code : M = ±20%, Y = ±30% (a) Series code (d) Inductance code : 1R0 = 1.0uH (b) Wire : Enamelled Copper Wire (c) Adhesive : Epoxy (d) Adhesive : Epoxy 0.60±0.1 1.0 Max. BC 4. MATERIALS : 1.0 Typ. 3. SCHEMATIC : 3.40±0.1 3.00±0.2 WX ' 3.00±0.2 G H AB A (a) Core : Ferrite Core XY ' 0.80 Max. YZ ' 1.10 Max. 0.40 Typ. 0.75±0.1 0.10 Typ. Z 0.30 Typ. Y PCB Pattern CDEF GH X W FD E Z 2. CONFIGURATION & DIMENSIONS : 3.3 b de c a (e) Clip : Tin Clip (f) F : Lead Free (c) (d)

SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 18.04.2008 SMD Power Inductors (Lead Free) PDC3010C SERIES 5. GENERAL SPECIFICATION : c) Idc(A) : Will cause L to drop by 30% and coil temp. rise ǻT<45°C b) Ambient Temp. : 25°C a) Test Frequency : 100KHz/0.3Vdc 6. ELECTRICAL CHARACTERISTICS : PDC3010C-1R0YF 1.0 ±30% Part No. ( µH ) Inductance 0.060.3V/100K Frequency Test ( Hz ) ±20% ( ȍ ) DCR 1.40 ( A ) Max. IDC d) Operating temp. : -40°C to +105°C ( include self-temp. rise ) PDC3010C-1R5YF 1.5 ±30% 0.3V/100K 0.08 1.30 PDC3010C-2R2YF 2.2 ±30% 0.3V/100K 0.11 1.00 PDC3010C-3R3YF 3.3 ±30% 0.3V/100K 0.21 0.80 PDC3010C-4R7YF 4.7 ±30% 0.3V/100K 0.25 0.70 PDC3010C-6R8YF 6.8 ±30% 0.3V/100K 0.30 0.60 PDC3010C-100MF 10 ±20% 0.3V/100K 0.48 0.52 PDC3010C-150MF PDC3010C-220MF 15 ±20% 22 ±20% 0.3V/100K 0.3V/100K 0.70 1.10 0.37 0.32 e) Storage temp. : -40°C to +85°C 6. ELECTRICAL CHARACTERISTICS : DC C URRENT(A) 0.5 1.5 INDUCTANCE(uH) TEMP. RISE(oC) TPC3010N-1R0 PDC3010C-1R0YF DC CURRENT(A) 0.6 1.2 1.8 2.4 INDUCTANCE(uH) TEMP. RISE( oC) TPC3010N-1R5 PDC3010C-1R5YF DC CURRENT(A) 0.8 1.6 2.4 3.2 INDU CTANCE(uH) TEMP. RISE( oC) TPC3010N-2R2 PDC3010C-2R2YF DC CURRENT(A) INDUCTANCE(uH) TEMP. RISE(oC) TPC3010N-3R3 PDC3010C-3R3YF NOTE : Specifications subject to change without notice. Please check our website for latest information.

18.04.2008 PG. 3 SUPERWORLD ELECTRONICS (S) PTE LTD PDC3010C SERIESSMD Power Inductors (Lead Free) 7. CHARACTERISTICS CURVES : DC CURRENT(A) INDUCTANCE(uH) TEMP. RISE(oC) TPC3010N-4R7 PDC3010C-4R7YF 0 0.2 0.4 0.6 0.8 DC CURRENT(A) INDUCTANCE(uH) TEMP. RISE( oC) TPC3010N-6R8 PDC3010C-6R8YF DC CURRENT(A) 16INDUCTANCE(uH) 100 TEMP. RISE(oC) TPC3010N-100 PDC3010C-100MF DC CURRENT(A) 20INDUCTANCE(uH) TEMP. RISE(oC) TPC3010N-150 PDC3010C-150MF 00 . 1 0 . 2 0 . 3 0 . 4 DC CURRENT(A) INDUCTANCE(uH) TEMP. RISE( oC) TPC3010N-220 PDC3010C-220MF NOTE : Specifications subject to change without notice. Please check our website for latest information.

3±1 seconds SUPERWORLD ELECTRONICS (S) PTE LTD 18.04.2008 PG. 4 Preheating seconds Times (min.) 30±3 30±3 Time : 500 hours 1. Appearance : No damage 2. Inductance change : Within ±15% of initial value High Temperature Resistance Test Applied Current : Rated Current Temperature : 85±2°C Time : 500 hrs 2. Inductance change : Within ±10% of initial value Measured : 50 times 1. Appearance : No damage 2. Inductance change : Within ±10% of initial value 1. Appearance : No damage 1. Appearance : No significant abnormality 2. Inductance change : Within ±10% Thermal Shock Humidity Resistance Solder Heat Resistance Reliability Test Conditions of 1 cycle. Applied Current : Rated Current Humidity : 90% to 95% Temperature : 40±2°C Total : 50 cycles Temperature (°C) -40±2 +105±2 Room temp. Room temp. Step 265°C 150°C Preheat : 150°C, 60sec. Dip Time : 10±1sec. Solder Temperature : 265±5°C Solder : DD930C cooling 10±1 seconds NaturalDipping TEST CONDITION Preheating PDC3010C SERIES PERFORMANCE should be covered with solder. More than 90% of the terminal electrode SMD Power Inductors (Lead Free) 8. ELECTRICAL CHARACTERISTICS : Mechanical Performance Test Solderability Test ITEM Solder Temperature : 245±5°C Flux for lead free : rosin Dip Time : 3±1sec. 245°C 150°C Preheat : 150°C, 60sec. Solder : DD930C cooling NaturalDipping 90~120sec 5sec max. 260°C max. 230°C 150~180°C 30sec max. REFLOW SOLDERING CONDITION Reflow times : 2 times max. NOTE : Specifications subject to change without notice. Please check our website for latest information.

SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 18.04.2008 9. PACKAGING INFORMATION : 9-1. Reel Dimension SMD Power Inductors (Lead Free) PDC3010C SERIES More than 400mm Leader edge 12±0.3 More than 100mm Chip / Reel Inner Box Carton 9-3. Packaging Quantity Size 3000 48000 12000 PDC3010C ComponentsTrailer edge PDC3010C 3.5±0.1 Empty pockets Direction Feed 0.4±0.15.5±0.3 G N A 1.5 W(mm) 13" x 12mm 4±0.32±0.3 0.8±0.10.8±0.1 Series Ao(mm) P Bo(mm) Ko(mm) Ao P(mm) 9-2 Tape Dimension / 12mm -0 t 1.75±0.3 Ko t(mm)F(mm) W F Bo 13.0±0.5 +0.1 330 12.5±0.5 100±1.0 C G(mm)A(mm)Type C(mm) N(mm) NOTE : Specifications subject to change without notice. Please check our website for latest information.

SUPERWORLD ELECTRONICS (S) PTE LTD 18.04.2008 PDC3010C SERIES 9-4. Tearing Off Force The force for tearing off cover tape is 10 to 125 grams in the arrow direction under the following conditions. a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than 40°C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. 2. Transportation : Application Notice Top cover tape F Base tape 165° to 180° Room Temp. (°C) 5~35 Room Humidity (%) 45~85 Tearing Speed (mm/min) 300 Room atm (hPa) 860~1060 SMD Power Inductors (Lead Free) PG. 6 NOTE : Specifications subject to change without notice. Please check our website for latest information.