PD3122F

PD3122F SHARP | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 11

Technical content

RE MSREC. No. ED-01042 EP) apacy 26, 2001 OPTO-ELECTRONIC DEVICES DIVISION ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION DEVICE SPECIFICATION FOR PHOTODIODE MODEL No. PD3122F Specified for Enclosed please find copies of the Specifications which consists of 11 pages including cover. After confirmation of the contents, please be sure to send back [] copies of the Specifications with approving signature on each. CUSTOMER'S APPROVAL PRESENTED DATE DATE BY BY O. Ichikawa, Department General Manager of Engineering Dept., II Opto-Electronic Devices Div. ELECOM Group SHARP CORPORATION

PEC. No. ED-01042 R EF bruary 26, 2001 Product name: _ PHOTODIODE i C E Model No. :_ PD3122F 1. These specification sheets include materials protected under copyright of Sharp Corporation ("Sharp"). Please do not reproduce or cause anyone to reproduce them without Sharp's consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This product is designed for use in the following application areas ; + OA equipment + Audio visual equipment + Home appliances + Telecommunication equipment (Terminal) + Measuring equipment * Tooling machines + Computers If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3), please be sure to observe the precautions given in those respective paragraphs. (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; + Transportation control and safety equipment (aircraft, train, automobile etc.) + Traffic signals + Gas leakage sensor breakers ~- Rescue and security equipment * Other safety equipment (3) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; + Space equipment + Telecommunication equipment (for trunk lines) + Nuclear power control equipment + Medical equipment (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative for any questions about this product.

SHARP CORPORATION f_ED-01042 February 26, 2001 {OB PAGE Vg 2 2/10 ifieaoesS iE fe | 1. Application fi oC F This specification applies to the outline and characteristics of position sensitive detector photodiode Model No. PD3122F. 2. Outline Outline drawing No. : CY7444G02 Mark specification drawing No. : CY7445G06 3. Ratings and characteristics Refer to the attached sheet, page 6, 7. 4. Reliability Refer to the attached sheet, page 8. 5, Outgoing inspection Refer to the attached sheet, page 9. 6. Supplement 6-1 Packaging specifications | Refer to the attached drawing No. CY10247G09. 6-2 Appearance : Such appearance changes as discoloring, rust, smear or blur shall be accepted, which doesn't affect electro-optical characteristics. ) 6-2 This product is not designed against electromagnetic and ionized-particle irradiation. 6-3 This product shall not contain the following materials. Also, the following materials shall not be used in the production process for this product. Materials for ODS : CFCs, Halon, Carbon tetrachloride 1.1.1-Trichloroethane (Methylchloroform) 6-4 Product mass (Piece) : Approximately 60mg

SHARP CORPORATION {__ED-01042 February 26, 2001 QDELN PAGE EEE 8/10 7. Notes (7-1) Cleaning conditions : Solvent cleaning: Solvent temperature 45° or less Immersion for 3 min or less Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output, cleaning time, PCB size or device mounting condition etc. Please test it in actual using condition and confirm that doesn't occur any defect before starting the ultrasonic cleaning. The cleaning shall be carried out with solvent below. Solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol (7-2) Soldering The lead pins should be soldered according to the absolute maximum ratings. While or after soldering, the lead pins shall be free from physical stress. This device shall not be soldered with preheat or reflow.

SHARP CORPORATION BW) erel042 —sd|:«éFebruary 26, 2001 PIMADER Ne PAGE e ~ fi! § & hd 2. 67 3? Bi 3 hy ‘ NS. [Tp eee a : Xo 10. 8 “0 i 2| eroy | i oer OUT T © 5 | l i T 7° 1 2-0. amax : Bin pital | , o ; nn {7d | Hi Tol he Lec bee pi Le ao "| y ht 1 g io, J wo) Boldin! | ' b | “ -| j Bs Sint | | L g| si | : mr 4 - | Sa! oc bi 4 | y ' 1A! Z 9} BIS) 2! o h a . ° 1S} Pe 0 y panei B Sle) le|“1 _asurface/} + #5 Cees) gs | Fd | Web.) | A Se) y+ i} | J 3 i icipe coon maa © | —t é ee (it if tli dy tt | | LL 3 y Ce aa YY; | | oea! LM \\ iS : foe + i; l i Lk. 905 |i. GOS SK center in! a i Hog 1520.08 ol «5.9 oy i [ Chip drawing (20/1) } “| i - — ode 2 | Anode B ns ee ay - Sy | 4. 9 20.2 ' a! i 1) Unspecified tolerance shall be +0.1. “ a! 2) Dimensions in parenthesis al are shown for reference. LI 3) Chip position tolerance : +0.06 chip rotary tolerance : +3” Anode A / (Pin arrangement) 4) Zarea: Burr 5) Resin burr shall not be included in outline dimensions. @® Anode A 6) Refractive index of the resin. n=1.52 (A=5893A NaD) @ Cathode 7) Asurface is transparent and flat finish, the other portion @ Cathode is sand brushing finish. @ Anode B 8) Dimensions of * mark are excluded the parting surface. ® Cathode 9) Package taper : 10° ® Cathode 10) Horizontal tolerance : MAX. 0.15 Vertical tolerance : MAX. +0.2 Fis 10/1 PD3122F Lead: 42 Alloy Lead: solder plating Outline Dimensions 1=1/I1mm Drawing No. CY7444G02

\\ 1 Wo Model No. / (Abbreviation) 7 TOU uf R 5 eral PD3122F Marking specification No.

SHARP CORPORATION [ = 8D-01042 |: February 26, 2001 | 3. Ratings and characteristics l i [} C FE

3.1 Absolute maximum ratings

Ta=25C Prewnewnsre | we | = |v * MAX. for 3 seconds at soldering area Solderable area

3.2 Electro-optical characteristics

Ta=25C ee de sd ee ee Peek | w [vew | - | - [20 = | Pouramen | a a] veiwenienors| oa | oa | a [on renin cea | oo [wee | [vo fo | o | Prevost [> [wer | [oof - [om [reeniee [eral vewmene || = |e | | eae [= pee ple electrode Ee a detection a [reverie | w [oi | pele |

maid. pe RE, However, I, and L, are output current of Anode A and Anode B Ev: Illuminance by CIE standard light source A (tungsten lamp) *2 Test circuit for response time is shown below. Input | Laser diode R=1kO fj ——- 90% Output / 4=830nm Vr Vr o% & if *3 75% area from detecting portion center to the edge of detecting portion Definition of error of position detection (A=830nm, ¢200 »m spot) Error of position detection of each incident light position defines the following formula if electrical center position is I, =]. Error of position detection (4m) = + x ke - incident light position (m)

2 I,+Iy

L: Length of light detector surface=1.2mm (3-3) Spectral sensitivity (TYP.) 100 — | tt tT TN [rena | oi | | | 77 T TMT TT Pt tt | yet PV TT gi | | | ye | Tt \\ Tt Reatve EL EP TAT tT TA ot tt tA tT Tt AT Tf 2) pier ye pe ee ao | ti yt tt tt yt ptt 7 yr Ar | a 600 700 800 900 1000 1100 1200 Wavelength (nm)

SHARP CORPORATION Y FeO R 10h —~] February 26, 2001 The reliability of products shall satisfy items listed below. Confidence level : 90% LTPD : 10%/20% Test Items Test Conditions Failure Judgement | Samples (n) Criteria Defective(C) leycle -407+—++85T Temperature cycling (30min) (30min) n=22, C=0 20 cycles test High temp. and high | +60°C,90%RH, 500h Rie2UX1.2 n=22, C=0 humidity storage RieSLX0.8 High temp. storage +85°C, 500h n=22, C=0 | VpSLX0.8 | Id2UX2.0 Operation life Ev=3000 ¢ x, Ta=25°C, 500h n=22, C=0 1,SLX0.8 High temp. +85, Vp=10V, R,=100k9 n=22, C=0 reverse bias 500h 1,2UX1.2 Mechanical shock 1000m/s’, 6ms, Sine wave n=11, C=0 3 times/+X, +Y, +2 direction Variable frequency 200m/s? vibration 100 to 2000 to 100Hz/4 min U: Upper n=11, C=0 48 min/X, Y, Z direction specification limit Terminal strength Weight: 2.5N n=11, C=O (Tension) 10 s/each terminal L: Lower specification Weight: 1.25N limit Terminal strength 0° +90° +0" +-90° -0° n=11, C=0 (Bending) The one test should be performed. Immerse in Isopropyl Solvent resistivity alcohol and Ethyl alcohol n=11, C=0 for 1 minute each | Soldering heat 260, 3s n=11, C=0 Soldering area : Refer to page 6 23045, 540.55 Solder shall be adhere at the Solderability Dipped area: Soldering area area of 95% or n=11, C=0 (Refer to page 6) more of dipped portion.

SHARP CORPORATION Pp bp-01042 | February 26, 2001 }AMEDER Rom | PAGE l y YP PLP 9/10 Fi (1) Inspection lot Inspection shall be carried out per each delivery lot. (2) Inspection method Asingle sampling plan, normal inspection level II based on ISO2859 shall be adopted. Inspection items and test method AQL{%) [| banana | | 2| Inverse polarity on terminal Major defect | 3| Soldering defect (Obstacle to use) 4] Characteristics defect (I, Id) in parameter 3.2. Appearance Minor defect % (Crack, Split, Chip, Scratch, Stain, Blur, . Foreign matter, Bubble) %* + Crack +-Visible crack irrespective of its position shall be defect. %* + Split, Chip, | One which affects the characteristics of + Scratch, --characteristics of parameter 3.2 shall be defect. | + Stain, Blur + Bubble Foreign matter (One on resin surface which can wipe off shall not be applied.) 1. On light detector: ¢0.2mm or more shall be defect. 2. Area excepting on light detector: ¢0.4mm or more shall be defect. *

SHARP CORPORATION ED-01042 February 26, 2001 Packaging (Drawing No. : CY10247G09) i & f ory gi ge pe? Product # Stopper (Top side: light detection face) Sleeve - : \\ Stopper (Fig.1) Bete Magee 27Z2) CASAS CHALE SSS LETT, me \\ Cellophane tape LT Packing case (Fig.2) P.P. tape ——SS= > : ee Set rd Label (Fig.3) Package method (Quantity per a packing case : 2000pcs.) (1) 50pcs. products shall be packaged in a sleeve and both of sleeve edges shall be fixed by stoppers. (Fig. 1) (2) MAX. 40 sleeves (5 lines in 8 rows) above shall be packaged in a packaging case. (Fig.2) (3) Model No., quantity and inspection date shall be marked on the label and this label shall be put on the side of the packaging case. Case shall be closed with the lid and enclosed with P.P. tape. (Fig.3) (4) Formal packeged mass : Approximately 400g