PC956L0NSZ0F SHARP | Alldatasheet

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  1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC956L) 2. Approved by VDE, DIN EN60747-5-2 (∗) (as an option), file No. 40008898 (as model No. PC956L) 3. Package resin : UL flammability grade (94V-0) (∗)DIN EN60747-5-2 : successor standard of DIN VDE0884 ■ Features ■ Agency approvals/Compliance 1. Programmable controller 2. Inverter ■ Applications High Speed 2Mb/s, High CMR DIP 8 pin ∗OPIC Photocoupler 1. 8 pin DIP package 2. Double transfer mold package (Ideal for Flow Soldering) 3. High noise immunity due to high instantaneous common mode rejection voltage (CM H : MIN. 15kV/µs, CML : MIN. −15kV/µs) 4. High speed response (tPHL : TYP. 210 ns, tPLH : TYP. 400 ns) 5. High isolation voltage between input and output (Viso(rms) : 5.0 kV) 6. Lead-free and RoHS directive compliant ■ Description PC956L0NSZ0F Series contains a LED optically coupled to an OPIC chip. It is packaged in a 8 pin DIP, available in SMT gullwing lead form option. Input-output isolation voltage(rms) is 5.0kV, High speed response (TYP. 2Mb/s) and CMR is MIN. 15kV/µs. Sheet No.: D2-A05502EN Date Jun. 30. 2005 © SHARP Corporation Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. PC956L0NSZ0F Series ∗"OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing circuit integrated onto a single chip.

■ Internal Connection Diagram 8 7 6 5 1 2 3 4 8Amp. NC Anode Cathode NC V L GND VO VCC Voltage regulator Sheet No.: D2-A05502EN ■ Outline Dimensions (Unit : mm) 1. Through-Hole [ex. PC956L0NSZ0F] 2. Through-Hole (VDE option) [ex. PC956L0YSZ0F] 3. SMT Gullwing Lead-Form [ex. PC956L0NIP0F] 4. SMT Gullwing Lead-Form (VDE option) [ex. PC956L0YIP0F] Product mass : approx. 0.55gProduct mass : approx. 0.55g Product mass : approx. 0.51g Plating material : SnCu (Cu : TYP. 2%) Product mass : approx. 0.51g PC956L 2.54±0.25 8 7 6 5 Primary side mark 6.5±0.5 0.85±0.21.2±0.3 9.66±0.5 3.5±0.5 0.5±0.1 0.5TYP. 1 2 3 4 3.05±0.5 3.4±0.5 θ θθ:0 to 13˚ 7.62±0.3 0.26±0.1 Epoxy resin Date code PC956L VDE Identification mark 2.54±0.25 8 7 6 5 Primary side mark 6.5±0.5 0.85±0.21.2±0.3 9.66±0.5 3.5±0.5 0.5±0.1 0.5TYP. 1 2 3 4 3.05±0.5 3.4±0.5 θ θθ:0 to 13˚ 7.62±0.3 0.26±0.1 Epoxy resin Date code PC956L 0.85±0.21.2±0.3 Primary side mark 78 6 5 6.5±0.5 1 2 3 2.54±0.25 3.5±0.5 1.0+0.4 −0 0.26±0.1 Epoxy resin 10.0+0 −0.5 1.0+0.4 0.35±0.25 7.62±0.3 9.66±0.5 Date code PC956L 0.85±0.21.2±0.3 78 6 5 6.5±0.5 VDE Identification mark1 2 3 2.54±0.25 3.5±0.5 1.0+0.4 −0 0.26±0.1 Epoxy resin 10.0+0 −0.5 1.0+0.4 0.35±0.25 7.62±0.3 9.66±0.5 Date code Primary side mark PC956L0NSZ0F Series

Date code (2 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 Mark A B C D E F H J K L M N Mark P R S T U V W X A B C Mark O N D Month January February March April May June July August September October November December A.D 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012

  • ·· 2nd digit Month of production 1st digit Year of production repeats in a 20 year cycle Sheet No.: D2-A05502EN PC956L0NSZ0F Series Country of origin Japan Rank mark There is no rank mark indicator.

Sheet No.: D2-A05502EN ■ Electro-optical Characteristics*6 Parameter Symbol Unit Input V µA Operating supply voltage Low level output current High level supply current T a=25˚C, V=0, f=1MHz pF Output VOL VCC IOL High level output current IOH ICCH Low level supply current ICCL mA mA Transfer characteristics "High→Low" input threshold current Isolation resistance Floating capacitance Internal pull-up resistance I FHL RISO Cf RL mA Ω pF kΩ tPLH nstPHL ns Propagation delay skew ∆tw nsDistortion of pulse width TPSK ns Instantaneous common mode rejection voltage (High level output) T a=25˚C, IF=10mA, VCC=15V, CL=100pF, VCM=1.5kV(P-P), RL=20kΩ, VO<1.0V, Short circuit between pin and pin Instantaneous common mode rejection voltage (Low level output) CM L kV/µs Ta=25˚C, IF=10mA Ta=25˚C, VR=5V MIN. 5×10 270 −15 MAX. 250 1.3 1.3 450 450 1.95 400 550 Conditions "Low→High" propagation delay time "High→Low" propagation delay time Response time CMH IF=10mA, Vo=0.6V IF=0, VCC=Vo IF=10mA, Io=2.4mA IF=0, Vo=OPEN IF=10mA, Vo=OPEN Vo=0.8V, RL=20kΩ, VCC=15V Short circuit between pin and pin Ta=25˚C, DC500V, 40 to 60%RH Ta=25˚C, V=0, f=1MHz Ta=25˚C IF=10mA (tpHL), IF=0 (tpLH), VCC=15V, RL=20kΩ, CL=100pF VTHLH=2.0V, VTHHL=1.5V Short circuit between pin and TYP. V4.5 35− V− 0.60.3 0.6 mA4.4 −9 µA− 505 0.8 1.5 1011 0.6 190 200 1.6 210 400 kV/µs15 −30 −30 (unless otherwise specified Ta=−40 to +85˚C, VCC=4.5 to 35V) Low level output voltage Forward voltage Reverse current Terminal capacitance V F IR Ct *6 It shall connect a by-pass capacitor of 0.01µF or more between VCC (pin 8 ) and GND (pin 5 ) near the device, when it measures the transfer characteristics and the output side characteristics *7 Distortion of pulse width ∆tw= | tPHL−tPLH | 7 8 Ta=25˚C, IF=0, VCC=15V, CL=100pF, VCM=1.5kV(P-P), RL=20kΩ, VO>3.0V, Short circuit between pin and pin 7 8 pin ■ Absolute Maximum Ratings Parameter Symbol Rating Unit Forward current IF 25 mA mA Reverse voltageInput Output VR 5V V Power dissipation P4 5 Supply voltage Output voltage Output current Power dissipation 100 mW mW VO PO IO V VCC Viso (rms) kV Operating temperature Topr −55 to +125 −40 to +85 −0.5 to +35 −0.5 to +35 Storage temperature Isolation voltage Tstg *5 Soldering temperature Tsol 270 5.0 (Ta=25˚C) *1 When ambient temperature goes above 70˚C, the power dissipation goes down at approx. 0.5mA/˚C.(Fig.3) *2 When ambient temperature goes above 70˚C, the power dissipation goes down at approx. 0.8mW/˚C.(Fig.4) *3 When ambient temperature goes above 70˚C, the power dissipation goes down at approx. 1.8mW/˚C.(Fig.4) *4 40 to 60%RH, AC for 1minute, f=60Hz *5 For 10s PC956L0NSZ0F Series

Sheet No.: D2-A05502EN ■ Model Line-up PC956L0NSZ0F PC956L0YSZ0F PC956L0NIP0F PC956L0YIP0F Lead Form Package Model No. DIN EN60747-5-2 Sleeve Taping Through-Hole 50pcs/sleeve 1 000pcs/reel SMT Gullwing Please contact a local SHARP sales representative to inquire about production status. PC956L0NSZ0F Series

Sheet No.: D2-A05502EN Fig.4 Power Dissipation vs. Ambient Temperature Fig.3 Forward Current vs. Ambient Temperature PC956L0NSZ0F Series Fig.1 Test Circuit for Propagation Delay Time Fig.2 Test Circuit for Common Mode Rejection Voltage tPHL tPLH tf 90% 10% IFRL GND CL 0.1µF VOL VTHLHVTHHL 10mA 0mAIF VO VO VCC 47Ω Amp. Voltage regulator tr 1.5kV 0VVCM CMH,VO CML,VO (IF=0) (IF=10mA) SW is A SW is B VCC VO (MIN.) VO (MAX.) VOL VCM + − AB RL GND CL 0.1µF IF VO VCC Amp. Voltage regulator Forward current IF (mA) Ambient temperature Ta (˚C) −40 0 25 50 75 100 125−25 8570 Power dissipation P, PO (mW) Ambient temperature Ta (˚C) 100 −40 0 25 50 100 125−25 P PO 8570

Sheet No.: D2-A05502EN Fig.10 Supply Current vs. Ambient Temperature Fig.9 Low Level Output Voltage vs. Ambient Temperature Fig.7 Relative Output Current vs. Ambient Temperature Fig.8 Input Threshold Current vs. Ambient Temperature PC956L0NSZ0F Series Fig.5 Output Current vs. Forward Current Fig.6 Forward Current vs. Forward Voltage Output current IO (mA) 05 1 5 10 20 Forward current IF (mA) VO=0.6V Ta=−40˚C Ta=25˚C Ta=100˚C Ta=75˚C Forward voltage VF (V) Forward current IF (mA) 100 0.1 Ta=75˚C Ta=50˚C Ta=25˚C Ta=0˚C Ta=−20˚C Ta=−40˚C −40 0 −20 60 80 4020 100 Supply current ICCH, ICCL (mA) 1.6 0.6 0.4 0.2 1.2 1.4 0.8 1.0 Ambient temperature T a (˚C) VCC=35V VO=Open ICCH:IF=0 ICCL:IF=10mA ICCL ICCH Relative output current IO (%) 120 100 110 −40 0 −20 60 80 4020 100 Ambient temperature Ta (˚C) IF=10mA VO=0.6V IO=100% at Ta=25˚C −40 0 −20 60 80 4020 100 Input threshold current IFHL (mA) Ambient temperature T a (˚C) VCC=15V VO=0.8V RL=20kΩ −40 0 −20 60 80 4020 100 Low level output voltage VOL (V) 0.6 0.3 0.4 0.5 Ambient temperature T a (˚C) VCC=4.5V IF=10mA IO=2.4mA 0.2 0.1

Sheet No.: D2-A05502EN Fig.13 Propagation Delay Time vs. Load Capacitance Fig.14 Propagation Delay Time vs. Supply Voltage Fig.15 Propagation Delay Time vs. Forward Current PC956L0NSZ0F Series Fig.12 Propagation Delay Time vs. Load Resistance Fig.11 Propagation Delay Time vs. Ambient Temperature Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. −40 0 −20 60 80 4020 100 Propagation delay time tPHL, tPLH (µs) 2.0 0.2 0.4 1.8 0.6 0.8 1.0 1.2 1.4 1.6 Ambient temperature T a (˚C) tPLH tPHL IF=10mA VCC=15V CL=100pF RL=20kΩ Propagation delay time tPHL, tPLH (µs) 2.0 0.2 0.4 1.8 0.6 0.8 1.0 1.2 1.4 1.6 04 21 0 1 6 1 8 1412862 0 Forward current I F (mA) tPLH tPHL VCC=15V CL=100pF RL=20kΩ Ta=25˚C Propagation delay time tPHL, tPLH (µs) 2.0 0.2 0.4 1.8 0.6 0.8 1.0 1.2 1.4 1.6 Load resistance R L (kΩ) IF=10mA VCC=15V CL=100pF Ta=25˚C tPLH tPHL 05 1 0 15 20 25 30 35 40 45 50 Propagation delay time tPHL, tPLH (µs) 2.0 0.2 0.4 1.8 0.6 0.8 1.0 1.2 1.4 1.6 0 10050 300 350 400 450250200150 500 Load capacitance C L (pF) IF=10mA VCC=15V RL=20kΩ Ta=25˚C tPLH tPHL Propagation delay time tPHL, tPLH (µs) 2.0 0.2 0.4 1.8 0.6 0.8 1.0 1.2 1.4 1.6 01 0 52 5 3 0 2015 35 Supply voltage V CC (V) IF=10mA CL=100pF RL=20kΩ Ta=25˚C tPLH tPHL

Sheet No.: D2-A05502EN PC956L0NSZ0F Series ■ Design Considerations Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute design. When handling these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics.

  • Notes about static electricity In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of 0.01µF or more between VCC and GND near the device. In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is floating capacitance may be generated and result in false operation since current may go through LED or current may change. If the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of LED. The detector which is used in this device, has parasitic diode between each pins and GND. There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin becomes below GND level even for instant. Therefore it shall be recommended to design the circuit that electric potential of any pin does not become below GND level. This product is not designed against irradiation and incorporates non-coherent LED.
  • Design guide
  • Recommended operating conditions Parameter Forward current Supply voltage Output voltage MIN. TYP. MAX. Unit mA V V Symbol I F VCC VO Operating temperature 70 4.5 −40 ˚CTopr

Sheet No.: D2-A05502EN ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes. PC956L0NSZ0F Series

  • Degradation In general, the emission of the LED used in photocouplers will degrade over time. In the case of long term operation, please take the general LED degradation (50% degradation over 5 years) into the design consideration. Please decide the input current which become 2 times of MAX. I FHL.
  • Recommended Foot Print (reference) 2.542.54 1.7 2.2 8.2 2.54 (Unit : mm)

Sheet No.: D2-A05502EN ■ Manufacturing Guidelines Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice.

  • Soldering Method Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400˚C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. 123 4 300 200 100 0 0 (˚C) Terminal : 260˚C peak ( package surface : 250˚C peak) Preheat 150 to 180˚C, 120s or less Reflow 220˚C or more, 60s or less (min) PC956L0NSZ0F Series

Sheet No.: D2-A05502EN Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin.

  • Cleaning instructions This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
  • Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE).
  • Presence of ODC PC956L0NSZ0F Series

Sheet No.: D2-A05502EN ■ Package specification 12.0 6.7 5.8 10.8 520

  • Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 50 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its primary side mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions (Unit : mm) PC956L0NSZ0F Series

Sheet No.: D2-A05502EN

  • Tape and Reel package Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F K E I D J G B H H A C Dimensions List (Unit : mm) A 16.0±0.3 B 7.5±0.1 C 1.75±0.1 D 12.0±0.1 E 2.0±0.1 H 10.4±0.1 I 0.4±0.05 J 4.2±0.1 K 10.2±0.1 F 4.0±0.1 G φ1.5+0.1 −0 MAX. a c e g f b d Dimensions List (Unit : mm) a 330 b 17.5±1.5 c 100±1.0 d 13±0.5 e 23±1.0 f 2.0±0.5 g 2.0±0.5 Pull-out direction [Packing : 1 000pcs/reel] Reel structure and Dimensions Direction of product insertion PC956L0NSZ0F Series
  • The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices.
  • Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice.
  • Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba).
  • If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices.
  • This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party.
  • Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: D2-A05502EN ■ Important Notices PC956L0NSZ0F Series [E231]