PC847X SHARP | Alldatasheet

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  1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC817) 2. Package resin : UL flammability grade (94V-0) ■ Features ■ Agency approvals/Compliance 1. I/O isolation for MCUs (Micro Controller Units) 2. Noise suppression in switching circuits 3. Signal transmission between circuits of different po- tentials and impedances ■ Applications DIP 16pin (4-channel) General Purpose Photocoupler 1. 16pin DIP 4-channnel package 2. Double transfer mold package (ldeal for Flow Solder- ing) 3. High collector-emitter voltage (VCEO : 80V(*)) 4. Current transfer ratio (CTR : MIN. 50% at IF=5mA, VCE=5V) 5. Several CTR ranks available 6. High isolation voltage between input and output iso(rms) : 5.0kV) (*) Up to Date code "P7" (July 2002) VCEO : 35V. From the production Date code "J5" (May 1997) to "P7" (July 2002), however the products were screened by BV CEO≥70V. ■ Description PC847X Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4-channel package, available in SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5.0kV. Collector-emitter voltage is 80V and CTR is 50% to 600% at input current of 5mA. Sheet No.: D2-A03201EN Date Sep. 30. 2003 © SHARP Corporation Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. PC847X Series ∗1-channel package type is also available. (model No. PC817X Series) PC847X Series

7.62±0.319.82±0.5 3.5±0.5 6.5±0.5 0.6±0.2 1.2±0.3 Date code 2.54±0.25 0.26±0.1 Epoxy resin 1.0+0.4 −0 1.0+0.4 10.0+0 −0.5 0.35±0.25 1 2 3 4 5 6 7 8 11 1013141516 12 9 Factory identification mark Anode mark ■ Internal Connection Diagram Sheet No.: D2-A03201EN ■ Outline Dimensions (Unit : mm) PC817 PC817 PC817 PC817 7.62±0.3 θ θ θ : 0 to 13˚ 19.82±0.5 3.5±0.53.0±0.5 2.7±0.5 0.5TYP. 0.5±0.1 Epoxy resin 6.5±0.5 0.6±0.2 1.2±0.3 Anode mark Factory identification mark Date code 2.54±0.25 12 3 4 5 6 7 8 11 1013141516 12 9 Anode Cathode Emitter Collector 16 15 14 13 12 11 10 9 1 3 5 7 2 4 6 8 9 11 13 15 10 12 14 16 1 2 3 4 5 6 7 8 1. Through-Hole [ex. PC847X] 2. SMT Gullwing Lead-Form [ex. PC847XI] PC847X Series Product mass : approx. 1.0g

Date code (2 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 Mark A B C D E F H J K L M N Mark P R S T U V W X A B C Mark O N D Month January February March April May June July August September October November December A.D 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012

  • ·· 2nd digit Month of production 1st digit Year of production Factory identification mark Factory identification Mark no mark Country of origin Japan Indonesia Philippines China * This factory marking is for identification purpose only. Please contact the local SHARP sales representative to see the actual status of the production. repeats in a 20 year cycle Sheet No.: D2-A03201EN PC847X Series

Sheet No.: D2-A03201EN ■ Electro-optical Characteristics Parameter Conditions Forward voltage Peak forward voltage Terminal capacitance Collector dark current Collector-emitter breakdown voltage Emitter-collector breakdown voltage Transfer charac- teristics Collector current Collector-emitter saturation voltage Isolation resistance MIN. 2.5 5×10 TYP. 1.2 0.1 1×10 MAX. 1.4 3.0 250 100 30.0 0.2 Unit V V V V pF nA mA V Ω µs µs Symbol V F VFM Ct ICEO BVCEO BVECO IC VCE (sat) tr tf RISO Response time Rise time Fall time Input Output IF=20mA IFM=0.5A V=0, f=1kHz Reverse current −− 10 µAIR VR=4V VCE=50V, IF=0 IC=0.1mA, IF=0 IE=10µA, IF=0 *5 80 IF=5mA, VCE=5V DC500V, 40 to 60%RH VCE=2V, IC=2mA, RL=100Ω Cutt-off frequency − 80 − kHzfC VCE=5V, IC=2mA, RL=100Ω, −3dB Floating capacitance − 0.6 1.0 pFCf V=0, f=1MHz IF=20mA, IC=1mA (Ta=25˚C) *5 From the production Date code "J5" (May 1997) to "P7" (July 2002), however the products were screened by BVCEO≥70V. ■ Absolute Maximum Ratings (Ta=25˚C) Parameter Symbol Unit Input Forward current mA *1 Peak forward current A Power dissipation mW Output Collector-emitter voltage V Emitter-collector voltage V Collector current mA Collector power dissipation mW Total power dissipation mW *2 Isolation voltage Operating temperature ˚C Storage temperature ˚C *3 Soldering temperature IF IFM P VCEO VECO IC PC Ptot Viso (rms) Topr Tstg Tsol ˚C *1 Pulse width≤100µs, Duty ratio : 0.001 *2 40 to 60%RH, AC for 1 minute, f = 60Hz *3 For 10s *4 Up to Date code "P7" (July 2002) V CEO : 35V. Rating Reverse voltage V VR 6 150 200 −30 to +100 −55 to +125 260 5.0 kV PC847X Series

Sheet No.: D2-A03201EN ■ Model Line-up IC [mA] (IF=5mA, VCE=5V, Ta=25˚C) 2.5 to 30.0 4.0 to 13.0 PC847X PC847X5 Through-Hole 6.5 to 20.0PC847X6 10.0 to 30.0PC847X7 4.0 to 20.0PC847X8 6.0 to 30.0PC847X9 4.0 to 30.0PC847X0 Sleeve 25pcs/sleeve PC847XI PC847XI5 PC847XI6 PC847XI7 PC847XI8 PC847XI9 PC847XI0 SMT Gullwing Model No. Lead Form Package Please contact a local SHARP sales representative to inquire about production status and Lead-Free options. PC847X Series

Sheet No.: D2-A03201EN Fig.6 Current Transfer Ratio vs. Forward Current Duty ratio Pulse width≤100µs Ta=25˚C 100 200 500 210−3 10−252 1 0 −152 5 Peak forward current IFM (mA) 10 000 5 000 2 000 1 000 Fig.5 Peak Forward Current vs. Duty Ratio PC847X Series Forward current IF (mA) Ambient temperature Ta (˚C) −30 0 25 50 55 75 100 125 Fig.1 Forward Current vs. Ambient Temperature Diode power dissipation P (mW) Ambient temperature Ta (˚C) 100 −30 0 25 50 55 75 100 125 Fig.2 Diode Power Dissipation vs. Ambient Temperature Collector power dissipation PC (mW) Ambient temperature Ta (˚C) 250 200 150 100 −30 0 25 50 75 100 125 Fig.3 Collector Power Dissipation vs. Ambient Temperature Fig.4 Total Power Dissipation vs. Ambient Temperature Total Power dissipation Ptot (mW) Ambient temperature Ta (˚C) 250 200 150 100 −30 0 25 50 75 100 125 Current transfer ratio CTR (%) Forward current IF (mA) 0.1 1 10 800 700 600 500 400 300 200 100 VCE=5V Ta=25˚C

Sheet No.: D2-A03201EN Collector-emitter saturation voltage VCE (sat) (V) Forward current IF (mA) 51 0 7mA 1mA 3mA 5mA I C=0.5mA Ta=25˚C Fig.12 Collector-emitter Saturation Voltage vs. Forward Current 806040200−30 100 10−5 10−6 10−7 10−8 10−9 10−10 10−11 Collector dark current ICEO (A) Ambient temperature Ta (˚C) VCE=50V Fig.11 Collector Dark Current vs. Ambient Temperature Relative current transfer ratio (%) 150% 100% 50% −40 0−20 20 40 60 80 100 Ambient temperature Ta (˚C) IF=1mA,VCE=5V IF=5mA,VCE=5V Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature 0.02 0.04 0.06 0.08 0.10 0.12 0.14 Collector-emitter saturation voltage VCE (sat) (V) IF=20mA IC=1mA Ambient temperature Ta (˚C) −40 0−20 20 40 60 80 100 Fig.10 Collector - emitter Saturation Voltage vs. Ambient Temperature PC847X Series 50˚C 25˚C 0˚C 100 200 500 −25˚C Ta=75˚C Forward current IF (mA) Forward voltage VF (V) Fig.7 Forward Current vs. Forward Voltage 23456789 20mA 10mA 5mA Collector current IC (mA) Collector-emitter voltage VCE (V) IF=30mA PC (MAX.) Ta=25˚C Fig.8 Collector Current vs. Collector-emitter Voltage

Sheet No.: D2-A03201EN Frequency f (kHz) −20 0.5 1 2 5 −10 200100502010 500 1kΩ 100Ω Voltage gain Av (dB) RL=10kΩ VCE=5V IC=2mA Ta=25˚C Fig.15 Frequency Response VCC RL Output Please refer to the conditions in Fig.15. RD Fig.16 Test Circuit for Frequency Response Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. PC847X Series VCC tftr ts 90% 10% td Output Input RLInput OutputRD Please refer to the conditions in Fig.13. VCE Fig.14 Test Circuit for Response Time 0.01 0.1 1 10 500 200 0.2 0.5 0.1 100 Response time (µs) VCE=2V IC=2mA Ta=25˚C ts td tf tr Load resistance RL (kΩ) Fig.13 Response Time vs. Load Resistance

Sheet No.: D2-A03201EN ■ Design Considerations While operating at IF<1.0mA, CTR variation may increase. Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED.

  • Degradation In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5years) into the design consideration. ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
  • Design guide
  • Recommended Foot Print (reference) (Unit : mm) PC847X Series 2.2 1.7 8.2

Sheet No.: D2-A03201EN ■ Manufacturing Guidelines Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice.

  • Soldering Method Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400˚C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. 123 4 300 200 100 0 0 (˚C) Terminal : 260˚C peak ( package surface : 250˚C peak) Preheat 150 to 180˚C, 120s or less Reflow 220˚C or more, 60s or less (min) PC847X Series

Sheet No.: D2-A03201EN Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in ac- tual using conditions since some materials may erode the packaging resin.

  • Cleaning instructions This product shall not contain the following materials. And they are not used in the production process for this device. Regulation substances:CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
  • Presence of ODC PC847X Series

Sheet No.: D2-A03201EN

  • Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 25pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions ■ Package specification (Unit : mm) 12.0 6.7 5.8 10.8 520 PC847X Series
  • The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems rela- ted to any intellectual property right of a third party re- sulting from the use of SHARP's devices.
  • Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the spec- ifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufac- turing locations are also subject to change without no- tice.
  • Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connec- tion with equipment that requires an extremely high lev- el of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba).
  • If the SHARP devices listed in this publication fall with- in the scope of strategic products described in the For- eign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP de- vices.
  • This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be repro- duced or transmitted in any form or by any means, elec- tronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party.
  • Contact and consult with a SHARP representative if there are any questions about the contents of this pub- lication. Sheet No.: D2-A03201EN ■ Important Notices PC847X Series