PC4D10SNIP0F

PC4D10SNIP0F SHARP | Alldatasheet

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Sheet No.: D2-A09201EN Date Sep. 1. 2006 © SHARP Corporation Notice The content of data sheet is subject to change without prior notice. In the absence of confi rmation by device specifi cation sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specifi cation sheets before using any SHARP device. PC4D10SNIP0F Series High Speed 10Mb/s, High CMR Mini-fl at 2-channel Package ∗OPIC Photocoupler ■Description PC4D10SNIP0F Series contains a LED optically cou- pled to an OPIC. It is packaged in a 8 pin mini-fl at (2-ch output). Input-output isolation voltage(rms) is 3.75 kV. High speed response (TYP. 10Mb/s) and CMR is MIN. 10kV/μs. ■Features 1. 2-ch output, 8 pin Mini-fl at package 2. Double transfer mold package (Ideal for Flow Soldering) 3. High noise immunity due to high instantaneous com- mon mode rejection voltage (CMH : MIN. 10kV/μs, CML : MIN. −10kV/μs) 4. High speed response (tPHL : TYP. 50ns, tPLH : TYP. 48ns) 5. Isolation voltage between input and output (V iso(rms) : 3.75kV) 6. Lead-free and RoHS driective compliant ■Agency approvals/Compliance 1. Recognized by UL1577 (Double protection isolation), fi le No. E64380 (as model No. PC4D10S) 2. Approved by VDE, DIN EN60747-5-2 (∗) (as an op- tion), fi le No. 40009162 (as model No. PC4D10S) 3. Package resin : UL fl ammability grade (94V-0)) (∗) DIN EN60747-5-2 : successor standard of DIN VDE0884. ■Applications 1. Programmable controller 2. Inverter * "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-pro- cessing circuit integrated onto a single chip.

Sheet No.: D2-A09201EN PC4D10SNIP0F Series ■Internal Connection Diagram ■Outline Dimensions (Unit : mm) Anode 1 Cathode 1 Cathode 2 Anode 2 Amp. Amp. V GND VO2 VCC ■Truth table Channel Input LED Output

1 HO NL

2 HO NL

3.937±0.127 5.994±0.203 8 7 6 5 Primary side mark Date codeRank mark 4D10S SHARP mark "S" 5.08 0±0.127 3.175±0.127 0.200±0.025 0.203±0.102 0.305MIN. 123 3.937±0.127 5.994±0.203

4 VDE Identification mark

"S" 5.080±0.127 3.175±0.127 0.200±0.025 0.203±0.102 0.305MIN. 123 1. Mini-fl at Package [ex. PC4D10SNIP0F]2 . Mini-fl at Package (VDE option) [ex. PC4D10SYIP0F] Product mass : approx. 0.15gProduct mass : approx. 0.15g Plating material : Pd (Au fl ush)

Sheet No.: D2-A09201EN PC4D10SNIP0F Series repeats in a 20 year cycle 1st digit 2nd digit Year of production Month of production A.D. Mark A.D. Mark Month Mark

1990 A 2002 P January 1

1991 B 2003 R February 2

1992 C 2004 S March 3

1993 D 2005 T April 4

1994 E 2006 U May 5

1995 F 2007 V June 6

1996 H 2008 W July 7

1997 J 2009 X August 8

1998 K 2010 A September 9

1999 L 2011 B October O

2000 M 2012 C November N

2001 N : : December D

Date code (2 digit) Country of origin Japan Rank mark With or without.

Sheet No.: D2-A09201EN PC4D10SNIP0F Series ■Electro-optical Characteristics ■Absolute Maximum Ratings (Ta=25˚C) Parameter Symbol Rating Unit Input *1 Forward current I F 20 mA Reverse voltage V R 5V Power dissipation P 1 40 mW Output Supply voltage V CC 7V Output collector voltage VO 7V Output collector current I O 50 mA *1 Output collector power dissipation PC 60 mW Operating temperature T opr −40 to +85 ̊C Storage temperature T stg −55 to +125 ̊C *2 Isolation voltage V iso(rms) 3.75 kV *3 Soldering temperature T sol 270 ̊C *1 No delating required up to 85˚C *2 40 to 60%RH, AC for 1minute, f=60Hz *3 For 10s (Unless otherwise specifi ed Ta=−40 to 85˚C) Parameter Symbol Condition MIN. TYP. *4 MAX. Unit Input Forward voltage V F Reverse current I R Ta=25̊C, VR=5V −− 10 μA Terminal capacitance C t Ta=25̊C, V=0, f=1MHz − 60 150 pF *5 Output Low level output voltage V OL IOL=13mA, VCC=5.5V , VE=2V , IF=5mA − 0.4 0.6 V High level output current I OH VCC=VO=5.5V , IF=250μA − 0.02 100 μA Low level supply current I CCL VCC=5.5V , IF=10mA − 13 21 mA High level supply current I CCH VCC=5.5V , IF=0 − 10 15 mA *5 Transfer characteristics "High→Low" input threshold current I FHL VCC=5V , VO=0.6V , RL=350Ω− 2.5 5 mA Isolation resistance R ISO Ta=25̊C, DC500V , 40 to 60%RH 5×10 10 1011 −Ω Floating capacitance C f Ta=25̊C, V=0, f=1MHz − 0.6 − pF Response time "High→Low" propagation delay time tPHL VCC=5V , IF=7.5mA, RL=350W, CL=15pF −− 100 ns Ta=25˚C 2 54 87 5n s "Low→High" propagation delay time tPLH −− 100 ns Ta=25˚C 2 55 07 5n s *6 Distortion of pulse width ΔtW − 3.5 35 ns Rise time t r − 20 − ns Fall time t f − 10 − ns Propagation delay skew t PSK −− 40 ns Instantaneous common mode rejection voltage (High level output) CM H IF=0, VO(Min)=2V , Ta=25̊C, VCC=5V , VCM=1kV(P-P), RL=350Ω 10 20 − kV/μs Instantaneous common mode rejection voltage (Low level output) CML IF=7.5mA, VO(MAX)=0.8V −10 −20 − kV/μs *4 All typical values at VCC=5V , Ta=25˚C *5 It shall connect a by-pass capacitor of 0.01μF or more between VCC (pin ➇) and GND (pin ➄) near the device, when it measures the transfer characteristics and the output side characteristics *6 Distortion of pulse width Δtw= | tPHL−tPLH |

Sheet No.: D2-A09201EN PC4D10SNIP0F Series Fig.1 Test Circuit for Propagation Delay Time and Rise Time, Fall Time Fig.2 Test Circuit for Instantaneous Common Mode Rejection Voltage 350Ω 47Ω 0.1μF IF CL VO *CL contains probe and wiring capacity. Timing diagram Input Output 90% 10% 7.5mA 3.75mA 0mA 1.5V IF VO VCC=5V tPHL tPLH VOL trtf Amp. Amp. 0.1μF 350Ω AB IF CL VCM *CL contains probe and wiring capacity. 1kV GND VCM VO VO VOL VO(MIN.) GND VO(MAX.) VO CMH SW=at A, IF=0 CML SW=at B, IF=7.5mA Amp. Amp. VCC=5V + − Timing diagram Fig.3 Forward Current vs. Ambient Temperature Fig.4 Output Collector Power Dissipation vs. Ambient Temperature Forward current IF (mA) Ambient temperature Ta (C) −40 0 25 50 100 125−25 75 85 Collector power dissipation PC (mW) Ambient temperature Ta (C) 100 −40 0 25 50 100 125−25 75 85

Sheet No.: D2-A09201EN PC4D10SNIP0F Series Fig.5 Forward Current vs. Forward Voltage Fig.6 High Level Output Current vs. Ambient Temperature 0.1 100 1.21 1.4 1.6 1.8 2 Forward current IF (mA) Forward voltage VF (V) Ta=50˚C Ta=25˚C Ta=100˚C Ta=−40˚C Ta=0˚C High level output current IOH (nA) Ambient temperature Ta (C) −60 −40 −20 0 40 20 80 60 100 100 1 000 10 000 100 000 VCC=VO=5V IF=0 Low level output voltage VOL (V) Ambient temperature Ta (C) −60 −40 −20 0 20 40 60 80 100 0.1 0.2 0.3 0.4 0.5 0.6 0.8 0.7 VCC=5.5V IF=5mA 12.8mA 9.6mA 6.4mA IOL=16mA Output voltage VO (V) Forward current IF (mA) 012345 Ta=25˚C VCC=5V RL=350Ω RL=1kΩ RL=4kΩ Fig.7 Low Level Output Voltage vs. Ambient Temperature Fig.8 Output Voltage vs. Forward Current Input threshold current IFHL (mA) Ambient temperature Ta (C) −60 −40 −20 0 20 40 60 80 100 V CC=5V VO=0.6V RL=350Ω RL=1kΩ RL=4kΩ Fig.9 Input Threshold Current vs. Ambient Temperature Fig.10 Propagation Delay Time vs. Forward Current Propagation delay time tPLH, tPHL (ns) Forward current IF (mA) 579 1 1 1 3 1 5 100 tPLH tPHL VCC=5V CL=15pF RL=350Ω

Sheet No.: D2-A09201EN PC4D10SNIP0F Series Fig.11-a Propagation Delay Time vs. Ambient Temperature Fig.11-b Propagation Delay Time vs. Ambient Temperature Propagation delay time tPLH, tPHL (ns) Ambient temperature Ta (C) −60 −40 −20 0 20 40 60 80 100 100 tPHL tPLH VCC=5V IF=7.5mA CL=15pF RL=350Ω Propagation delay time tPLH, tPHL (ns) Ambient temperature Ta (C) −60 −40 −20 0 20 40 60 80 100 100 tPLH tPHL VCC=5V IF=7.5mA CL=15pF RL=1kΩ Fig.12 Pulse width Distortion vs. Ambient Temperature Pulse width distrrion Δtw (ns) Ambient temperature Ta (C) −20 −60 −40 −20 0 20 40 60 80 100 VCC=5V IF=7.5mA CL=15pF RL=1kΩ RL=4kΩ RL=350Ω Fig.11-c Propagation Delay Time vs. Ambient Temperature Propagation delay time tPLH, tPHL (ns) Ambient temperature Ta (C) −60 −40 −20 0 20 40 60 80 100 140 120 100 tPLH tPHL VCC=5V IF=7.5mA CL=15pF RL=4kΩ Fig.13 Rise Time / Fall Time vs. Ambient Temperature Rise time tr, Fall time tf (ns) Ambient temperature Ta (C) −60 −40 −20 0 20 40 60 80 100 tr tf VCC=5V IF=7.5mA CL=15pF RL=350Ω Remarks : Please be aware that all data in the graph are just for reference and anot for guarantee.

Sheet No.: D2-A09201EN PC4D10SNIP0F Series ■Design Considerations

• Recommended operating conditions Parameter Symbol MIN. TYP. MAX. Unit Low level input current I FL 0 − 250 μA High level input current I FH 8 − 15 mA Supply voltage V CC 4.5 − 5.5 V Fan out (TTL load) N −− 5 − Output pull-up resitor R L 330 − 4 000 Ω Operating temperature T opr −40 − +85 ˚C
• Notes about static electricity Transistor of detector side in bipolar confi guration may be damaged by static electricity due to its minute de- sign. When handling these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics.
• Design guide In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of 0.01μF or more between VCC and GND near the device. In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is fl oating capacitance may be generated and result in false operation since current may go through LED or current may change. If the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of LED. The detector which is used in this device, has parasitic diode between each pins and GND. There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin becomes below GND level even for instant. Therefore it shall be recommended to design the circuit that electric potential of any pin does not become below GND level. This product is not designed against irradiation and incorporates non-coherent LED.
• Degradation In general, the emission of the LED used in photocouplers will degrade over time. In the case of long term operation, please take the general LED degradation (50% degradation over 5 years) into the design consideration. Please decide the input current which become 2 times of MAX. I FHL.
• Recommended foot print (reference) 1.27 0.641.9 7.49 1.271.27 (Unit : mm)

Sheet No.: D2-A09201EN PC4D10SNIP0F Series ■Manufacturing Guidelines

• Soldering Method Refl ow Soldering: Refl ow soldering should follow the temperature profi le shown below. Soldering should not exceed the curve of temperature profi le and time. Please don't solder more than twice. Flow Soldering : Due to SHARP's double transfer mold construction submersion in fl ow solder bath is allowed under the be- low listed guidelines. Flow soldering should be completed below 270̊C and within 10s. Preheating is within the bounds of 100 to 150̊C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400̊C. Please don't solder more than twice. Other notice Please test the soldering method in actual condition and make sure the soldering works fi ne, since the im- pact on the junction between the device and PCB varies depending on the tooling and soldering conditions. 123 4 300 200 100 0 0 (˚C) Terminal : 260˚C peak (package surface : 250˚C peak) Preheat 150 to 180˚C, 120s or less Reflow 220˚C or more, 60s or less (min)

Sheet No.: D2-A09201EN PC4D10SNIP0F Series

• Cleaning instructions Solvent cleaning : Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less. Ultrasonic cleaning : The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials : Ethyl alcohol, Methyl alcohol and Isopropyl alcohol. In case the other type of solvent materials are intended to be used, please make sure they work fi ne in ac- tual using conditions since some materials may erode the packaging resin.
• Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specifi c brominated fl ame retardants such as the PBB and PBDE are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
• Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE).

Sheet No.: D2-A09201EN PC4D10SNIP0F Series

• Tape and Reel package SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions Reel structure and Dimensions a c e g f b d Dimensions List (Unit : mm) a φ330 b 13.5±1.5 c φ100±1 d φ13.0±0.2 e φ21.0±0.8 f 2.0TYP. g 2.0±0.5 Direction of product insertion Pull-out direction [Packing : 1 500pcs/reel] Dimensions List (Unit : mm) A 12.0±0.3 B 5.50±0.05 C 1.75±0.10 D 8.0±0.1 E 2.00±0.05 H 5.4±0.1 I 0.30±0.05 J 3.7±0.1 K 6.3±0.1 F 4.0±0.1 G φ1.55±0.05 K FE I D J H B A C G H 5˚MAX.

Sheet No.: D2-A09201EN PC4D10SNIP0F Series ■Important Notices

• The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices.
• Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the spec- ifi cations, characteristics, data, materials, structure, and other contents described herein at any time without no- tice in order to improve design or reliability. Manufactur- ing locations are also subject to change without notice.
• Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specifi ed in the relevant specifi cation sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Offi ce automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffi c signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connec- tion with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba).
• If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices.
• This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be re- produced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party.
• Contact and consult with a SHARP representative if there are any questions about the contents of this publi- cation. [E256]