PC457L0NIP

PC457L0NIP SHARP | Alldatasheet

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I Absolute Maximum Ratings I Outline Dimensions (Unit : mm) *1 When ambient temperature goes above 70°C, the power dissipation goes down at 0.8mA/°C *2 When ambient temperature goes above 70°C, the power dissipation goes down at 0.8mW/ °C *3 When ambient temperature goes above 70°C, the power dissipation goes down at 1.8mW/ °C *4 40 to 60%RH, AC for 1minute *5 For 10s Parameter Symbol Rating Unit Forward current IF 25 mA mA Reverse voltageInput Output V R 5V V Power dissipation P4 5 Output current Supply voltage Output voltage Power dissipation Total power dissipation 100 mW 100 mW mW V O PO IO V V CC V iso (rms) Ptot kV Operating temperature Topr −55 to +125 −55 to +100 −0.5 to +30 −0.5 to +20 Storage temperature Isolation voltage Tstg *5 Soldering temperature Tsol 270 3.75 (Ta=25°C) 1. Programmable controller 2. Inverter I Features I Applications High Speed and High CMR ∗OPIC Photocoupler 1. High resistance to noise (CMR:MIN. 15kV/µs) 2. High speed response (tPHL :MAX. 0.8µs, tPLH :MAX. 0.8µs) 3. Mini-flat package 4. Isolation voltage (V iso (rms):3.75kV) 5. Recognized by UL, file No. E64380 (Model No.PC457L ) internal connection diagram Anode mark PC457L Anode Cathode (Input side) GND C0.4 VO (Open collector) VCC 0.2±0.05 5.3±0.3 0.4±0.1 2.6±0.2 4.4±0.2 0.1±0.1 1.27±0.25 3.6±0.3 7.0+0.2 −0.7 0.5+0.4 −0.2 46 5 6 5 4 ∗ “OPIC”(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and signal- processing circuit integrated onto a single chip. Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Internet Internet address for Electronic Components Group http://sharp-world.com/ecg/

Reverse current I R µA Terminal capacitance C t V F=0V, f=1MHz IF=0, VCC =5.5V, VO =5.5V pF Output IOH (1) µA µA High level supply current (1) ICCH (1) High level supply current (2) ICCH (2) nA Transfer charac- teristics tPLH µs tPHL µs Instantaneous common mode rejection voltage "Output : High level" I F=0, RL=1.9kΩ V CC =5V, VCM =1.0kV(p-p) IF=16mA, R L=1.9kΩ V CC =5V, VCM =1.0kV(p-p) kV/µs Instantaneous common mode rejection voltage "Output : Low level" CM L kV/µs IF=16mA V R =5V IF=0, VCC =15V, VO =open IF=16mA, V CC =5V R L=1.9Ω MIN. −15 MAX. 250 1.95 0.8 0.8 Conditions "Low → High" propagation delay time "High→ Low" propagation delay time CM H IF=0, VCC =15V, VO =open Current transfer ratio (1) CTR (1) Current transfer ratio (2) CTR (2) IF=16mA, V CC =4.5V, VO =0.4V IF=16mA, V CC =4.5V, VO =0.4V *6 Ta=0 to 70°C *7 Refer to Fig.1 *8 Refer to Fig.2 TYP. − 5003 1.0 µA− 2.0− µA− 1.0 0.02 1.7 0.6 Isolation resistance R ISO Ω5×1010 −DC =500V, 40 to 60%RH 1 ×1011 Floating capacitance C f V =0, f=1MHz pF − 1.00.6 0.2 −30 (Ta=25˚C) High level output current (1) IF=0, VCC =15V, VO =15VIOH (2)High level output current (2) IF=0, VCC =15V, VO =15VIOH (3)High level output current (3) V OL V µALow level supply current I CCL − − 0.4 IF=16mA, V CC =4.5V, IO =2.4mA IF=16mA, V CC =15V, VO =open 120 Low level output voltage I Electro-optical Characteristics tPHL tPLH R L C L 0.01µF VOL 1.5V IF IF Pulse input Pulse width 10µs Duty ratio I F Monitor VO VO VCC 100Ω *CL includes the probe and wiring capacitance. Fig.1 Test Circuit for Propagation Delay Time Fig.2 Test Circuit for Instantaneous Common Mode Rejection Voltage 0.8V R L C L 0.01µF VOL VO VO VO VCC IF GND VCM SW AB VCM 1.0kV CM H CM L (IF=0mA) (IF=16mA) When SW is A When SW is B *CL includes the probe and wiring capacitance.

Power dissipation P, PO (mW) Ambient temperature Ta (°C) 100 −55 0 25 50 100 125 70 P PO Fig.3 Forward Current vs. Ambient Temperature Fig.4 Power Dissipation vs. Ambient Temperature Fig.6 Relative Current Transfer Ratio vs. Forward Current Forward current IF (mA) Ambient temperature Ta (°C) −55 0 25 50 100 125 70 Forward current IF (mA) Relative current transfer ratio (%) 0.1 1 10 100 100 150 200 V CC =4.5V V O =0.4V Ta=25˚C CTR =100% at IF=16mA Fig.5 Forward Current vs. Forward Voltage Forward voltage VF (V) Forward current IF (mA) 100 0.1 Ta=70˚C Ta=50˚C Ta=25˚C Ta=0˚C Ta=100˚C Ta=−25˚C Ta=−55˚C Fig.8 Relative Current Transfer Ratio vs. Ambient Temperature Relative current transfer ratio (%) 110 130 150 Ambient temperature Ta (˚C) −55 −40 −20 0 20 40 60 100 80 IF=16mA V CC =4.5V V O =0.4V CTR =100% at Ta=25˚C Fig.7 Output Current vs. Output VoltageOutput current IO (mA) Dotted line shows pulse characteristics IF=25mA IF=20mA IF=15mA IF=10mA IF=5mA Output voltage VO (V) 02468 1 0 1 2 2 0 14 16 18 Ta=25˚C V CC =5V

Propagation delay time tPHL , tPLH (ns) 800 400 600 −55 −20−40 60 80 20 400 100 Ambient temperature Ta (˚C) tPLH tPHL 200 IF=16mA V CC =5V R L=1.9kΩ Fig.9 High Level Output Current vs. Ambient Temperature Fig.10 Propagation Delay Time vs. Ambient Temperature Ambient temperature Ta (˚C) High level output current IOH (nA) −25 0 25 50 100 75 100 1 000 0.1 IF=0mA V CC =V O =30V V CC =V O =15V V CC =V O =5.5V

G The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. G Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. G Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). G If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. G This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. G Contact and consult with a SHARP representative if there are any questions about the contents of this publication.