PC412S0NIP0F

PC412S SHARP | Alldatasheet

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SPEC. No. ED-04P062 ISSUE June 23, 2004 OPTO-ELECTRONIC DEVICES DIVISION ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION DEVICE SPECIFICATION FOR PHOTOCOUPLER MODEL No. PC4125 . (Business dealing name : PC412SONIPOF) Specified for Enclosed please find copies of the Specifications which consists of 13 pages including cover. After confirmation of the contents, please be sure to send back [1 Joopies of the Specifications with approving signature on each, CUSTOMER'S APPROVAL PRESENTED DATE DATE li abe 28 Dep a BY BY aa Pe Ling H. Imanaka, Department General Manager of Engineering Dept.,I1 Opto-Electronic Devices Div. ELECOM Group SHARP CORPORATION

Jun 23, 2004 Product name : PHOTOCOUPLER Model No. :__PC412S Business dealing name PC412SONIPOF PC412SOYIPOF 1. These specification sheets include materials protected under copyright of Sharp Corporation ("Sharp"). Please do not reproduce or cause anyone to reproduce them without Sharp's consent. 2, When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This product is designed for use in the following application areas ; -OAequipment Audio visualequipment _- Home appliances - Telecommunication equipment (Terminal) - Measuring equipment - Tooling machines. Computers If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3), please be sure to observe the precautions given in those respective paragraphs. (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; + Transportation control and safety equipment (aircraft, train, automobile etc.) + Traffic signals - Gas leakage sensor breakers _- Rescue and security equipment - Other safety equipment etc. (3) Please donot use this product for equipment which require extremely high reliability and safety in function and precision, such as ; . «Space equipment — - Telecommunication equipment (for trunk lines) + Nuclear power control equipment —_ - Medical equipment (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. etc. 3. Please contact and consult with a Sharp sales representative for any questions about this product. LE

Jun 23, 2004. 1. Application ‘This specification applies to the outline and characteristics of OPIC photocoupler Model No. PC412S. 2. Outline Refer to the attached sheet, page 3. 3. Ratings and characteristics Refer to the attached sheet, page 4 to 6. 4. Reliability Refer to the attached sheet, page 7. 5. Outgoing inspection Refer to the attached sheet, page 8, 6. Supplement ; 6.1 Isolation voltage shall be measured in the following method. (1) Short between pins 1 and 4 on the primary side and between pins 5 and 8 on the secondary side. (2) The dielectric withstanding tester with zero-cross circuit shall be used, . (3) The wave form of applied voltage shall be a sine wave,

6.2 Business dealing name

(‘O" mark indicates business dealing name of ordered product) POHOSONPOF DS SSSCS*d Applied to product as a option PC412S1 | | omen (Attachment-2-1 t0 2-3.) . 6.3 Package specification Refer to the attached sheet, page 9, 10.

6.4 The block diagram, Truth table

® Veer Veco CaO @ Vw @ NC# H | OFF Ai.> @ NC# © Vo | Hi: Logie (1) GND1 ® i © GND? L: Logic (0) *@,@ N.C. tenminal is not allowed extemal connection. 6.5. This Model is approved by UL(under preparation), Approved Model No. : PC412S UL file No. : 864380

6.6 This product is not designed against irradiation,

‘This product is assembled with electrical input and output. ‘This product incorporates non-coherent light emitting diode,

6.7 ODS materials

‘This product shall not contain the following materials. Also, the following materials shall not be used in the production process for this product. Materials for ODS : CFCs, Halon, Carbon tetrachloride, 1 .1.1-Trichloroethane (Methyl chloroform)

6.8 Brominated flame retardants

Specific brominated flame retardants such as the PBBOs and PBBs are not used in this device at all. 7. Notes Precautions for photocouplers. : Attachment-1

Jun 23, 2004 2. Outline Pin Nos. and intemal connection diagram ® ® ® Veca nos Vo GND2 rl rh rl Cl sanmet [PC41 2S | § nat Ss" 3} + vAN ae Tell Primary side cyorara 8| & <j rmark Ld ttt |S oS ao LA] a bo i] 0) H fH) Ai B [| 127+0.05 0.406 0.076 Vou Vin N.C’ *GND1 Date code(*1) i 3K N.C.terminal(@,@) is not allowed Rank mark(*2) external connection. 5.080.127 5,994+0.203 So + a a! | = a a = “ g| i or

4 Sy I

| Boory resin 0.305 " *1) 2-digit number shall be marked according to DIN standard. *2)Factory identification mark shall be or shall not be marked. *3) Pin material: CuAlloy Pin finish: Pd Product mass : Approx. 0. 15g UNIT: /imm Marking is laser marking Name PC4128 Outline Dimensions (Business dealing name : PC412SONIPOF)

Jun 23, 2004 3, Ratings and characteristics

3.1 Absolute maximum ratings

Ta=25°C Input v *] Isolation voltage ‘Visoiems) Opeingtenpenie | Tae Storage temperature | Tae -55 to +125 *c . #2 Soldering temperature ~ | Toot on *1 AC for 1 min, 40 to 60%RH *2 Forl0s .

Jun 23, 2004 3.2. Blectro-optical characteristics *3 (Unspecified : Ta=Topr, VCCIFVOC2=SV,TYP. ; Ta=25°C) | rume | Syme as | Typ | MAX.| Unt Conutons Parameter | Lowlevel inpatsupplycurent | Toon | - | 60 | 100 | mA | Vn0 E | High levelinputsupplycunent | eam | - | 08 | 30 | mA | VaVer Input current 1 lw [| -o | - | 10 | pA | Voorsv | High level output vollage Vou 16-20 u AN | aa ois Ee ST © | Distortion of pulse width C=15pF ae {Aw | - CMOS Logic level ag |B | feel Mos ee 5: é Propagation delay skew Trsx | - | 2 | os wit<Ins = Pe fe es | gi [rmime es Ts | Instantaneous common Vas=VeonVo>08xV, mode rejection voltage CM, 10 KV/us| Ne o> 08% Vem (High level output) *5 ow Instantaneous common | | Vn70,V0<08 mode rejection voltage ™, 0 | 20 | - (kVIus ye ove (Low level output) #5 | or 3° Itshall connect a by-pass capacitor of 0.01 . F or more between Voc\\(Pin No.1) and GND(Pin No 4) and between between Vex(Pin No.8) and GND(Pin No.5) near the device, when it measures the transfer characteristics and the output side characteristics. *4 Propagation delay time ; Refer to Fig.1 *5 Instantaneous common mode rejection voltage : Refer to Fig.2

Jun 23, 2004 Fig.l tpacs tpi, (test circuit sid) oe ; = dq >® Voces VeorsV G) sv wich, a} Pate Wir Duy 5% V am |_| GQ ae] ott Vee | Vor Ww off av rs we [|---| Va & & Fig2) CMy, CM, test circuit » tit) oe ° dD | Voorsv o!o f->> | A |B + OVo Veo5V 1 N74 IK G | a Vax poe TRV Vos | . GND Vou Mu AVow SW=atA. Vair5V “> AVou cM Ne ce AVo.

Jun 23, 2004 4, Reliability ‘The reliability of products shall satisfy items listed below. Confidence level : 90% LIPD : 10 or 20 Failure Judgement Samples (n) Solderability *2 2AS12°C, 3 5 —_—_— n=l, C=0 Soldering heat 270°C, 10s n=11, C=0 - 15km/", 0.5ms | ence | Mechanical shock as a n=11,C=0 3 times/tX, £Y, +Z direction Tey >UX12 eshte f a 100 to 2000 to 100Hz/4 min 200m/s* Tociy>UX 1.2 - | Variable frequency vibration ‘ati X,Y, Z direction Toc >U X12 n=11,C=0 [Teyele -555C 10 +125 °C Sane ReneS | ‘Temperature cycling G0 min) (30 min) ve <LX 2 n=22,C=0 | 20 cycles test on High temp. and high Ce 4 humidity storage +BS°C, 85%RE, 1000h Us Upper specification imit | "2% C0 | High temp. storage _ 125 °C, 1000h L:Lowerspecificaion limit |_"™=2%C-0 | Low temp. storage - 55°C, 1000h oe Veci=Vou=5V *] Test method, conforms to BIAT ED 4701. *2 Solder shall adhere at the area of 95% or more of immersed portion of lead, and pin hole or other holes shall not be concentrated on one portion.

Jun 23, 2004 5. Outgoing inspection

5.1 Inspection items

(1) Electrical characteristics Toc, Focus locas Jecat: Vors Vous Riso: Viso (2) Appearance 5.2. Sampling method and Inspection level Asingle sampling plan, normal inspection level II based on ISO 2859 is applied. The AQL according to the inspection items are shown below. Inspection item | AQL (%) Major Blectrical characteristics | 06s defect Unreadable marking: - Minor Appearance defect except 025 ‘ defect the above mentioned. ”

Jun 23, 2004

6.3 Package specifications

63.1 Taping conditions

(1) Tape structure and Dimensions (Refer to the attached sheet, Page 9) ‘The carrier tape has the heat pressed structure of A-PET material carries tape of protect against static electricity and three layers cover tape (PET material base). (2) Reel structure and Dimensions (Refer to the attached sheet, Page 10) The taping reel shall be of plastic (PS material) with its dimensions as shown in the attached drawing. (3) Direction of product insertion (Refer to the attached sheet, Page 10) Product direction in carrier tape shall direct to the anode mark at the hole side on the tape. (4) Joint of tape The cover tape and carrier tape in one reel shall be jointless. (5) The way to repair taped failure devices Cutting a bottom of carrier tape with a cutter, and after replacing to good devices, the cut portion shall be sealed with adhesive tape.

6.3.2 Adhesiveness of cover tape

. + The exfoliation force between carrier tape and cover tape shall be 0.2N to 0.7N for the angle 160° to 180° .

63.3 Rolling method and quantity

+ Wind the tape back on the reel so that the cover tape will be outside the tape. + Attach more than 20cm of blank tape to the trailer and the leader of the tape and fix the both ends with adhesive tape. One reel shall contain 1500pes.

6.3.4 Outerpacking appearance (Refer to attached sheet, Page 10)

635 Marking

+ The onter packaging case shall be marked with following information. *ModelNo. * Number of pieces delivered —_* Production date

6.3.6 Storage condition

+ ‘Taped products shalll be stored at the temperature 5 to 30°C. and the humidity lower than 70%0RH.

63.7 Safety protection during shipping

+ There shall be no deformation of component or degradation of electrical characteristics due to shipping. Cartier tape structure and Dimensions E E D G 1| i | c r i i a B oye | poy 3 e sem A ee eee on : H ; oo i Fro | leo i Bo i a) Lr i maa i stm) ioe i [am 1 | | | Ki B wax pats foe Too fe fr fos Ts |

Jun 23, 2004 Reel structure and Dimensions KS CS Dimensions list (Unit : mm) | Or | c c d Sy | 135415 | 100410 1302 | f | i} Direction of product insertion ‘ Pull-out direction Row tr etree Outer packing appearance (1) Carrier tape with 1,500pcs. of the devices (reeled) are packed in packing case. (2) The packing case is sealed by kraft tape & the label is placed on it. Pad (5 sheets in total : Top, bottom and between Product (Reel including carrier tape) Kraft tape Sticker Packing case (corrugated cardboard)

Jun 23, 2004 Precautions for Photocouplers 1. Recommended operating conditions Symbal Sharp recommends usage of the device under the above conditions to secure reliability and allowance for over time degradation of light emitting diode, 2. For cleaning “2.1 Solvent cleaning: Solvent temperature 45°C. or less, Immersion for 3 min or less 22 Ultrasonic cleaning: The effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output, cleaning time, PCB size or device mounting condition etc Please test it in actual using condition and confirm that doesn't occur any defect before starting the ultrasonic cleaning.

23 Applicable solvent: Ethyl alcohol, Methyl alcohol, Isopropyl alcohol

When the other solvent is used, there are cases that the packaging resin is eroded, Please use the other solvent after thorough confirmation is performed in actual using condition. 3, Precaution for use ‘This product is transistor of detector side in bipolar and CMOS type device and is susceptive to static electricity due to its minute design. When handling them, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics. 4, Circuit design 4.1 In order to stabilize power supply line, we should certainly recommend to connect two by-pass capacitor of 0.01 yz F or more. One capacitor should connect between Veo; and GND1, another should connect between Veg; and GND2. 4.2. When steep voltage noise is applied between the primary side and the secondary side of the photocoupler, current flows or changes in the light emitting diode through a parasitic capacitance between the primary side and the secondary side of the photocoupler, then there is a case that miss operation occurs depending upon the applied noise level. We should certainly recommend to use a by-pass capacitor between both terminals of the light emitting diode where used in a noisy environment. 4.3 The detector which is used in this device, has parasitic diode between each pins and GND. ‘There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin becomes below GND level even for instant. ‘Therefore it shall be recommended to design the circuit that electric potential of any pin does not become below GND level. 44 @,@ N.C. tenninal is not allowed extemal connection.

Attachment-]-2 ED-04P062 PC412SONIPOF Jun 23, 2004 5. Precautions for Soldering Photocouplers

5.1 In the case of flow soldering (Whole device dipping)

Itis recommended that flow solder be carried out at 270°C. and within 10 s Pre-heating : 100 to 150°C, 30 to 80s). (2 times or less) 5.2. Ifsolder reflow : It is recommended that only one soldering be done at the temperature and the time within the temperature profile as shown in the figure below. (2 times or less) 300°C Terminal : 260°C peak (Package surface : 250°C peak) 200°C ke——S Reflow 220°C. or more, 60s or less 100°C Pre-heat 150°C to 180°C, 120s or less Since, influence to the device is different according to reflow equipment and its condition, please use the device after confirming no damage in the actual using condition. 5.3. In the case of hand soldering What is done on the following condition is recommended.( 2 times or Jess) Soldering iron temperature: 400°C Time: 3s orless

5.4 Other precautions

An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin. So keep the package temperature within that specified in Item (2).