PC400J00000F SHARP | Alldatasheet
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V mW V iso Operating temperature T opr ˚C Storage temperature T stg ˚C T sol 260 ˚C n Features n Outline Dimensions 3. Isolation voltage between input and output 1. Hybrid substrate which requires high den- 2. Personal computers, office computers and 3. Electronic musical instruments sity mounting peripheral equipment PC400 PC400 *1 Isolation voltege Total power dissipation V OH IOL P O P tot 130 150 - 25 to + 85 - 40 to + 125 mA mW n Package Specifications
1 Anode
2 N C
6 Vcc
5 GND
4 V o
- “ Low ” output during light emission 1. Mini-flat package (V iso rms ) data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.” “ In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs, (Ta= 25˚C )n Absolute Maximum Ratings (Input Side) Amp. Compact, Surface Mount Type OPIC Photocoupler Forward current Reverse voltage Power dissipation Supply voltage High level output voltege Low level output current Power dissipation Parameter ( Unit : mm) *1 AC for 1 minute, 40 to 60% RH *2 For 10 seconds Soldering temperature 0.2mm or more Soldering area 4. TTL and LSTTL compatible output 5. Recognized by UL(No.E64380) Model No. Package specifications Diameter of reel Tape width PC400 φ 370mm 12mm PC400T Taping package (Net: 750pcs.) φ 178mm 12mm PC400Z Sleeve package (Net: 100pcs.) -- : 3 750V Taping package (Net:3 000pcs.) V rms3 750 C0.4 An OPIC consists of a light-detecting element and signal- processing circuit integrated onto a single chip. * “ OPIC ” ( Optical IC) is a trademark of the SHARP Corporation. 4.4± 0.2 1.27± 0.25 2.54± 0.25 0.4± 0.1 3.6± 0.3 2.6± 0.20.1± 0.1 5.3± 0.3 0.2± 0.05 0.5+ 0.4 -0.2 7.0+ 0.2 -0.7
3 Cathode
n Electro-optical Characteristics Forward voltage V F Reverse current I R Terminal capacitance C t Operating supply voltage V CC Low level output voltage V OL High level output current I OH Low level supply current I CCL High level supply current I CCH *3 “H → L ” threshold IFHL *4 “L → H ” threshold IFLH *5Hysteresis IFLH /IFHL R ISO tPHL tPLH Fall time t f Rise time t r Parameter Symbol Conditions MIN. TYP. MAX. Unit Input Output Transfer charac- teristics IF IF Ta = 25˚C, VR =3 V Ta = 25˚C, V = 0 f = 1kHz IOL CC =5 V IF V CC =V O = 15V, IF =0 V CC = 5V, IF V CC = 5V, IF =0 Ta = 25˚C,VCC =5 V R L = 280Ω V CC = 5V,R L = 280Ω Ta = 25˚C,VCC =5 V R L = 280Ω V CC = 5V,R L = 280Ω V CC = 5V,R L = 280Ω *6Response - - 1 0 µ A - 30 250 pF 3 - 15 V - 0.2 0.4 V - - 100 µ A - 2.5 5.0 mA - 1.0 5.0 mA - 1.1 2.0 mA - - 4.0 0.4 0.8 - mA 0.3 - - 0.5 0.7 0.9 5x1 010 1011 - Ω - 1 3 µ s- 2 6 - 0.05 0.5 - 0.1 0.5 PC400 *3 IFHL represents forward current when output gose from high to low. *4 IFLH represents forward current when output goes from low to high. *5 Hysteresis stands for IFLH /IFHL . *6 Test circuit for response time is shown below. time time 47Ω VIN Amp Voltage regulator 5V 280Ω V o 0.1µ F VIN V o t tPLH tf tf 50% VOH 90% 1.5V 10%VOL tr= tf= 0.01µ S Z o = 50Ω Isolation resistance input current input current time Ta = 25˚C, DC500V Ta = 25˚C V = 5V,I = 4 mA CC F R = 280 ΩL 40 to 60% RH (Ta= 0 to + 70˚C unless otherwise specified) = 4mA = 0.3mA = 16mA, V = 4mA = 4mA “H → L ” propagation delay “L → H ” propagation delay PHL
Fig. 2 Power Dissipation vs. Ambient Temperature Ambient temperature Ta (˚C) Power dissipation PO , Ptot (mW ) - 25 0 25 50 75 100 85 Fig. 1 Forward Current vs. Ambient Temperature F (mA ) Ambient temperature Ta (˚C) 0.2 Relative threshold input current 0.4 0.6 1.4 51 0 2 001 5 1.2 1.0 0.8 Supply voltage V CC (V ) 50˚C 25˚C 0˚C 100 200 500 F (mA ) Fig. 3 Forward Current vs. Forward Voltage Forward voltage VF (V ) - 25˚C Fig. 4 Relative Threshold Input Current vs. Supply Voltage 0.2 0.4 Relative threshold input current 0.6 0.8 1.6 0 25 50 100-2 5 7 5 1.4 1.2 1.0 Ambient temperature T a (˚C) 0.01 0.02 0.05 0.1 1.0 2 5 10 100 5020 0.2 0.5 Low level output voltage VOL (V ) Low level output current IOL (mA ) Fig. 5 Relative Threshold Input Current vs. Ambient Temperature PC400 Fig. 6 Low Level Output Voltage vs. Low Level Output Current Forward current IForward current I -2 5 P tot P O I FHL I FLH T a = 25˚C IFHL = 1 at VCC =5 VT a = 75˚C I FHL I FLH V CC =5 V IFHL = 1 at Ta = 25˚C V CC =5 V IF = 4mA T a = 25˚C
0.2 0.3 0.5 - 25 0 25 50 100 0.1 0.4 16mA 5mA Low level output voltage VOL (V ) Ambient temperature Ta (˚C) Fig. 7 Low Level Output Voltage vs. Ambient Temperature PC400 Supply current Icc (mA ) 59 1 711 3 11 1573 25˚C 85˚C 25˚C 85˚C Supply Voltage Supply voltage VCC (V ) 10 20 30 40 6005 0 (µ s ) Forward Current 0.1 0.1 0.2 0.3 0.4 0.5 0.2 0.5 1 2 5 10 20 Rise time,fall time (µ s) L (k Ω ) V CC =5 V T a = 25˚C IF = 4mA tr tf Forward current IF (mA ) Propagation delay time - 25˚C Fig.10 Rise Time, Fall Time vs. Fig. 9 Propagation Delay Time vs. Fig. 8 Supply Current vs. n Preautions for Use GND near the device in order to stabilize power supply line. (2) Handle this product the same as with other integrated circuits against static electricity. (3) As for other general cautions, refer to the chapter “Precautions for Use ” (1) It is recommended that a by-pass capacitor of more than 0.01µ F be added between VCC and V CC =5 V IF = 4mA IOL = 30mA T a = - 25˚C ICCL ICCL ICCH ICCH tPHL tPLH V CC =5 V R L = 280Ω T a = 25˚C Load resistance R Load Resistance
l The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. l Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. l Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). l Contact a SHARP representative in advance when intending to use SHARP devices for any "specific" applications other than those recommended by SHARP or when it is unclear which category mentioned above controls the intended use. l If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export such SHARP devices. l This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. l Contact and consult with a SHARP representative if there are any questions about the contents of this publication.