PC123Y02J00F

PC123Y22J00F SHARP | Alldatasheet

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Sheet No.: D2-A09401EN Date Sep. 1. 2006 © SHARP Corporation Notice The content of data sheet is subject to change without prior notice. In the absence of confi rmation by device specifi cation sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specifi cation sheets before using any SHARP device. PC123N02J00F Series DIP 4pin Reinforced Insulation Type Photocoupler ■ Description PC123N02J00F Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4-pin DIP, available in wide-lead spacing option and SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5kV. CTR is 50% to 400% at input current of 5mA ■Features 1. 4-pin DIP package 2. Double transfer mold package (Ideal for Flow Solder- ing) 3. Current transfer ratio (CTR : MIN. 50% at I F=5 mA, VCE=5V) 4. Several CTR ranks available 5. Reinforced insulation type (Isolation distance : MIN. 0.4mm) 6. Long creepage distance type (wide lead-form type only : MIN. 8mm) 7. High isolation voltage between input and output iso(rms) : 5kV) 8. Lead-free and RoHS directive compliant ■Agency approvals/Compliance 1. Recognized by UL1577 (Double protection isolation), fi le No. E64380 (as model No. PC123) 2. Approved by BSI, BS-EN60065, file No. 7087, BS- EN60950 fi le No. 7409, (as model No. PC123) 3. Approved by SEMKO, EN60065, EN60950, (as mod- el No. PC123) 4. Approved by DEMKO, EN60065, EN60950, (as mod- el No. PC123) 5. Approved by NEMKO, EN60065, EN60950, (as mod- el No. PC123) 6. Approved by FIMKO, EN60065, EN60950, (as model No. PC123) 7. Recognized by CSA fi le No. CA95323 (as model No. PC123) 8. Approved by VDE, DIN EN60747-5-2( ∗) (as an op- tion), fi le No. 40008087 (as model No. PC123) 9. Package resin : UL fl ammability grade (94V - 0) (∗) DIN EN60747-5-2 : successor standard of DIN VDE0884. ■Applications 1. I/O isolation for MCUs (Micro Controller Units) 2. Noise suppression in switching circuits 3. Signal transmission between circuits of different po- tentials and impedances 4. Over voltage detection

Sheet No.: D2-A09401EN PC123N02J00F Series ■ Internal Connection Diagram ■ Outline Dimensions (Unit : mm) Product mass : approx. 0.23g Anode Cathode Emitter Collector 1. Through-Hole [ex. PC123N02J00F] PC123 4.58±0.30 0.6±0.2 1.2±0.3 2.54±0.256.5±0.3 7.62±0.30 0.26±0.10 4.58±0.30 3.5±0.53.0±0.5 2.7±0.5 0.5TYP. Anode mark 0.5±0.1 θ θθ : 0 to 13˚ Epoxy resin Rank mark Factory identification mark Date code Product mass : approx. 0.23g 2. Through-Hole (VDE option) [ex. PC123YN2J00F] Product mass : approx. 0.23g Product mass : approx. 0.23g 3. Wide Through-Hole Lead-Form [ex. PC123F02J00F] 4. Wide Through-Hole Lead-Form (VDE option) [ex. PC123Y02J00F] PC123 4.58±0.30 0.6±0.2 1.2±0.3 2.54±0.25 6.5±0.3 3.5±0.53.0±0.5 2.7±0.5 0.5TYP. Anode mark 0.5±0.1 θ θθ : 0 to 13˚ Epoxy resin Rank mark Factory identification mark Date code SHARP mark "S" VDE idenfication mark 0.26±0.10 PC123 1.2 ±0.3 0.6 ±0.2 2.54 ±0.25 4.58 ±0.30 3.5 ±0.5 1.0 ±0.1 6.5±0.3 7.62 ±0.30 Epoxy resin 4.58 ±0.30 0.26 ±0.10 10.16 ±0.50 2.7MIN. Anode mark 2 3 0.5 ±0.1 Rank mark Factory identification mark Date code PC123 1.2 ±0.3 0.6 ±0.2 2.54 ±0.25 4.58 ±0.30 3.5 ±0.5 1.0 ±0.1 6.5±0.3 7.62 ±0.30 Epoxy resin 4.58 ±0.30 0.26 ±0.10 10.16 ±0.50 2.7MIN. Anode mark 2 3 0.5 ±0.1 Rank mark Factory identification mark Date code SHARP mark "S" VDE idenfication mark

Sheet No.: D2-A09401EN PC123N02J00F Series (Unit : mm) Product mass : approx. 0.22g 5. SMT Gullwing Lead-Form [ex. PC123P02J00F] 0.6±0.2 1.2±0.3 6.5±0.3 7.62±0.30 0.26±0.10 4.58±0.30 2.54±0.25 Epoxy resin 3.5±0.5 4.58±0.30 2.54±0.25 Anode mark Rank mark Factory identification mark Date code 1.0+0.4 −0.01.0+0.4 −0.0 10.0+0.0 −0.5

2 PC123

0.35±0.25 Product mass : approx. 0.22g 6. SMT Gullwing Lead-Form (VDE option) [ex. PC123GY2J00F] Product mass : approx. 0.22g 7. Wide SMT Gullwing Lead-Form (VDE option) [ex. PC123Y13J00F] 0.6±0.2 1.2±0.3 6.5±0.3 7.62±0.30 0.26±0.10 4.58±0.30 2.54±0.25 Epoxy resin 3.5±0.5 4.58±0.30 2.54±0.25 Anode mark Rank mark Factory identification mark Date code 1.0+0.4 −0.01.0+0.4 −0.0 10.0+0.0 −0.5 0.35±0.25 SHARP mark "S" VDE idenfication mark PC123 0.6±0.2 1.2±0.3 1.0±0.1 6.5±0.3 4.58±0.30 2.54±0.25 Anode mark Rank mark Factory identification mark Date code 7.62±0.30 12MAX 4.58±0.30 Epoxy resin 3.5±0.5 0.26±0.10 0.5±0.1 0.25±0.25 SHARP mark "S" VDE idenfication mark

Sheet No.: D2-A09401EN PC123N02J00F Series repeats in a 20 year cycle 1st digit 2nd digit Year of production Month of production A.D. Mark A.D. Mark Month Mark

1990 A 2002 P January 1

1991 B 2003 R February 2

1992 C 2004 S March 3

1993 D 2005 T April 4

1994 E 2006 U May 5

1995 F 2007 V June 6

1996 H 2008 W July 7

1997 J 2009 X August 8

1998 K 2010 A September 9

1999 L 2011 B October O

2000 M 2012 C November N

2001 N : : December D

Date code (2 digit) Rank mark Refer to the Model Line-up table. Factory identifi cation Mark Country of origin Plating material no mark Japan SnCu (Cu : TYP. 2%) or Indonesia SnBi (Bi : TYP. 2%) or China SnCu (Cu : TYP. 2%)* SnCu (Cu : TYP. 2%) * Up to Date code "T4" (April 2005), SnBi (Bi : TYP. 2%). ** This factory marking is for identifi cation purpose only. Please contact the local SHARP sales representative to see the actural status of the production. Factory identifi cation mark and Plating material

Sheet No.: D2-A09401EN PC123N02J00F Series (Ta=25̊C) Parameter Symbol Rating Unit Input Forward current I F 50 mA *1 Peak forward current I FM 1A Reverse voltage V R 6V Power dissipation P 70 mW Output Collector-emitter voltage V CEO 70 V Emitter-collector voltage V ECO 6V Collector current I C 50 mA Collector power dissipation PC 150 mW Total power dissipation P tot 200 mW *2 Isolation voltage V iso(rms) 5 kV Operating temperature T opr −30 to +100 ̊C Storage temperature T stg −55 to +125 ̊C *2 Soldering temperature T sol 260 ̊C *1 Pulse width≤100ms, Duty ratio : 0.001 *2 40 to 60%RH, AC for 1 minute, f = 60Hz *3 For 10s ■ Absolute Maximum Ratings ■ Electro-optical Characteristics (Ta=25̊C) Parameter Symbol Condition MIN. TYP. MAX. Unit Input Forward voltage V F IF=20mA − 1.2 1.4 V Reverse current I R VR=4V −− 10 μA Terminal capacitance C t V=0, f=1kHz − 30 250 pF Output Collector dark current I CEO VCE=50V , IF=0 −− 100 nA Collector-emitter breakdown voltage BVCEO IC=0.1mA, IF=0 70 −− V Emitter-collector breakdown voltage BVECO IE=10μA, IF=0 6 −− nA Transfer charac− teristics Collector current I C IF=5mA, VCE=5V 2.5 − 20 mA Collector-emitter saturation voltage V CE(sat) IF=20mA, IC=1mA − 0.1 0.2 V Isolation resistance R ISO DC500V , 40 to 60%RH 5×10 10 1×1011 −Ω Floating capacitance C f V=0, f=1MHz − 0.6 1 pF Cut-off frequency f C VCE=5V , IC=2mA, RL=100Ω, −3dB − 80 − kHz Response time Rise time tr VCE=2V , IC=2mA, RL=100Ω − 41 8 μs Fall time tf − 31 8 μs

Sheet No.: D2-A09401EN PC123N02J00F Series ■ Model Line-up Lead Form Through-Hole Wide Through-Hole Rank mark IC[mA] (IF=5mA, VCE=5V , Ta=25˚C) Package Sleeve 100pcs/sleeve DIN EN60747-5-2 − Approved − Approved Model No. PC123N02J00F PC123YN2J00F PC123F02J00F PC123Y02J00F With or without 2.5 to 20 PC123NA2J00F PC123YA2J00F PC123F12J00F PC123Y12J00F L 2.5 to 7.5 PC123NB2J00F PC123YB2J00F PC123F22J00F PC123Y22J00F M 5 to 12.5 PC123NC2J00F PC123YC2J00F PC123F52J00F PC123Y52J00F N 10 to 20 PC123NS2J00F PC123YS2J00F PC123FS2J00F PC123Y82J00F E 5 to 10 Lead Form SMT Gullwing Wide SMT Gullwing Rank mark IC[mA] (IF=5mA, VCE=5V , Ta=25˚C) Package Taping 2 000pcs/reel DIN EN60747-5-2 − Approved − Approved Model No. PC123P02J00F − − With or without 2.5 to 20 PC123P12J00F PC123Y13J00F L 2.5 to 7.5 PC123P22J00F PC123GY2J00F PC123Y23J00F M 5 to 12.5 PC123P52J00F PC123HY2J00F PC123Y53J00F N 10 to 20 PC123P82J00F PC123EY2J00F PC123Y83J00F E 5 to 10 Please contact a local SHARP sales representative to inquire about production status.

Sheet No.: D2-A09401EN PC123N02J00F Series Fig.1 Forward Current vs. Ambient Temperature Fig.2 Diode Power Dissipation vs. Ambient Temperature Fig.3 Collector Power Dissipation vs. Ambient Temperature Fig.4 Total Power Dissipation vs. Ambient Temperature Fig.5 Peak Forward Current vs. Duty Ratio Fig.6 Forward Current vs. Forward Voltage 50˚C 25˚C 0˚C 0 0.5 1 1.5 2 2.5 3 3.5 100 −25˚C Ta=75˚C Forward current IF (mA) Forward voltage VF (V)Duty ratio Pulse width≤100μs Ta=25˚C 100 10−3 10−2 10−1 Peak forward current IFM (mA) 10 000 1 000 Forward current IF (mA) Ambient temperature Ta (˚C) −30 0 25 50 55 75 100 125 Diode power dissipation P (mW) Ambient temperature Ta (˚C) 100 −30 0 25 50 55 75 100 125 Collector power dissipation PC (mW) Ambient temperature Ta (˚C) 250 200 150 100 −30 0 25 50 75 100 125 Total Power dissipation Ptot (mW) Ambient temperature Ta (˚C) 250 200 150 100 −30 0 25 50 75 100 125

Sheet No.: D2-A09401EN PC123N02J00F Series Fig.7 Current Transfer Ratio vs. Forward Current Fig.8 Collector Current vs. Collector-emitter Voltage Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature Fig.10 Collector - emitter Saturation Voltage vs. Ambient Temperature Fig.11 Collector Dark Current vs. Ambient Temperature Fig.12 Response Time vs. Load Resistance Response time (μs) 0.01 0.1 1 10 100 0.1 100 VCE=2V IC=2mA Ta=25˚C tr tf td ts 1 000 Load resistance (kΩ)Ambient temperature Ta (˚C) Collector dark current ICEO (A) −3 0 0 2 04 06 08 0 1 0 0 10−11 10−10 10−9 10−8 10−7 10−6 10−5 VCE=50V Forward current IF (mA) Current transfer ratio CTR (%) 0.1 1 10 100 100 150 200 250 300 V CE=5V Ta=25˚C Collector-emitter voltage VCE (V) 0123456789 1 0 T a=25˚C IF=30mA IF=20mA IF=10mA IF=5mA Collector current IC (mA) PC (MAX.) 100 150 0 2 55 07 5 1 0 0 Relative current transfer ratio (%) −30 IF=5mA VCE=5V Ambient temperature Ta (˚C) Ambient temperature Ta (˚C) Collector-emitter saturation voltage VCE (sat) (V) −3 0 0 2 04 06 08 0 1 0 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.16 I F=20mA IC=1mA

Sheet No.: D2-A09401EN PC123N02J00F Series Fig.13 Test Circuit for Response Time Fig.14 Frequency Response Fig.15 Collector-emitter Saturation Voltage vs. Forward Current Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. VCC 90% 10% Output Input RLInput Output VCE RD tftr tstd Please refer to the conditions in Fig.12. Frequency (kHz) Voltage gain Av (dB) 0.1 10 100 −20 −15 −10 VCE=5V IC=2mA Ta=25˚C RL=10kΩ 1kΩ 100Ω 1 000 Forward current IF (mA) Collector-emitter saturation voltage VCE (sat) (V) 0 2 4 6 8 1 01 21 41 61 82 0 0.5 1.5 2.5 3.5 4.5 Ta=25˚C IC=0.5mA 1mA 3mA 7mA 5mA

Sheet No.: D2-A09401EN PC123N02J00F Series ■Design Considerations

• Design guide While operating at IF<1mA, CTR variation may increase. Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED.
• Degradation In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration.
• Recommended foot print (reference) SMT Gullwing lead-form Wide SMT Gullwing lead-form 8.2 2.54 1.7 2.2 10.2 2.54 1.7 2.2 (Unit : mm) ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.

Sheet No.: D2-A09401EN PC123N02J00F Series ■ Manufacturing Guidelines

• Soldering Method Refl ow Soldering : Refl ow soldering should follow the temperature profi le shown below. Soldering should not exceed the curve of temperature profi le and time. Please don't solder more than twice. Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270̊C and within 10s. Preheating is within the bounds of 100 to 150̊C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400̊C. Please don't solder more than twice Other notice Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. 123 4 300 200 100 0 0 (˚C) Terminal : 260˚C peak (package surface : 250˚C peak) Preheat 150 to 180˚C, 120s or less Reflow 220˚C or more, 60s or less (min)

Sheet No.: D2-A09401EN PC123N02J00F Series

• Cleaning instructions Solvent cleaning : Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less. Ultrasonic cleaning : The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials : Ethyl alcohol, Methyl alcohol and Isopropyl alcohol. In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin.
• Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specifi c brominated fl ame retardants such as the PBB and PBDE are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
• Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE).

Sheet No.: D2-A09401EN PC123N02J00F Series ■ Package specifi cation

• Sleeve package 1. Through-Hole Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 6.7 5.8 10.8 520 (Unit : mm) 2. Wide Through-Hole Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 6.35 5.9 10.8 520 (Unit : mm)

Sheet No.: D2-A09401EN PC123N02J00F Series

• Tape and Reel package 1. SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F K E I D J GB H H A C 5˚MAX. Dimensions List (Unit : mm) A 16.0±0.3 B 7.5±0.1 C 1.75±0.10 D 8.0±0.1 E 2.0±0.1 H 10.4±0.1 I 0.40±0.05 J 4.2±0.1 K 5.1±0.1 F 4.0±0.1 G φ1.5+0.1 −0.0 Reel structure and Dimensions a c e g f b d Dimensions List (Unit : mm) a φ330 b 17.5±1.5 c φ100±1 d φ13.0±0.5 e φ23±1 f 2.0±0.5 g 2.0±0.5 Direction of product insertion Pull-out direction [Packing : 2 000pcs/reel]

Sheet No.: D2-A09401EN PC123N02J00F Series 2. Wide SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions Dimensions List A 24.0±0.3 B 11.5±0.1 C 1.75±0.10 D 8.0±0.1 E 2.0±0.1 H 12.4±0.1 I 0.40±0.05 J 4.1±0.1 K 5.1±0.1 F 4.0±0.1 G φ1.5+0.1 −0.0 (Unit : mm) JG IE CB A H H 5˚MAX. F D K Reel structure and Dimensions a φ330 b 25.5±1.5 c φ100±1 d φ13.0±0.5 e φ23±1 f 2.0±0.5 g 2.0±0.5a c e g f b d Dimensions List (Unit : mm) Direction of product insertion Pull-out direction [Packing : 2 000pcs/reel]

Sheet No.: D2-A09401EN PC123N02J00F Series ■ Important Notices

• The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices.
• Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifi cations, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice.
• Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specifi ed in the relevant specifi cation sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Offi ce automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffi c signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba).
• If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices.
• This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party.
• Contact and consult with a SHARP representative if there are any questions about the contents of this publication. [E252]