PC123P2 SHARP | Alldatasheet

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Technical content

  1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC123) 2. Approved by BSI, BS-EN60065, file No. 7087, BS- EN60950 file No. 7409, (as model No. PC123) 3. Approved by SEMCO, EN60065, EN60950, file No. 204582 (as model No. PC123) 4. Approved by DEMCO, EN60065, EN60950 (as mod- el No. PC123) 5. Approved by NEMKO, EN60065, EN60950, file No. P03100205 (as model No. PC123) 6. Approved by FIMKO, EN60065, EN60950, file No. 19383 (as model No. PC123) 7. Recognized by CSA file No. CA95323 (as model No. PC123) 8. Approved by VDE, VDE0884 (as an option) file No. 83601 or No. 134349 or No.40005304 (as model No. PC123) 9. Package resin : UL flammability grade (94V - 0) ■ Features ■ Agency approvals/Compliance 1. I/O isolation for MCUs (Micro Controller Units) 2. Noise suppression in switching circuits 3. Signal transmission between circuits of different po- tentials and impedances 4. Over voltage detection ■ Applications DIP 4pin Reinforced Insulation Type Photocoupler 1. 4-pin DIP package 2. Double transfer mold package (Ideal for Flow Solder- ing) 3. Current transfer ratio (CTR : MIN. 50% at IF=5 mA, VCE=5V) 4. Several CTR ranks available 5. Reinforced insulation type (Isolation distance : MIN. 0.4mm) 6. Long creepage distance type (wide lead-form type only : MIN. 8mm) 7. High isolation voltage between input and output iso(rms) : 5.0 kV) ■ Description PC123 Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4-pin DIP, available in wide-lead spacing option and SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5.0kV. CTR is 50% to 400% at input current of 5mA. Sheet No.: D2-A02902EN Date Oct. 31. 2003 © SHARP Corporation Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. PC123 Series

■ Internal Connection Diagram Anode Cathode Emitter Collector Sheet No.: D2-A02902EN ■ Outline Dimensions (Unit : mm) 1. Through-Hole [ex. PC123] 2. Through-Hole (VDE0884 option) [ex. PC123Y] 3. Wide Through-Hole Lead-Form [ex. PC123F] 4. Wide Through-Hole Lead-Form (VDE0884 option) [ex. PC123FY] PC123 4.58±0.3 0.6±0.2 1.2±0.3 2.54±0.256.5±0.3 7.62±0.3 0.26±0.1 4.58±0.3 3.5±0.53.0±0.5 2.7±0.5 0.5TYP. Anode mark 0.5±0.1 θ θ θ : 0 to 13˚ Epoxy resin Rank mark Factory identification mark Date code PC123 4.58±0.3 0.6±0.2 1.2±0.3 2.54±0.25 6.5±0.3 7.62±0.3 4.58±0.3 3.5±0.53.0±0.5 2.7±0.5 0.5TYP. Anode mark 0.5±0.1 θ θ θ : 0 to 13˚ Epoxy resin Rank mark Factory identification mark Date code SHARP mark "S" VDE0884 Indenfication mark 0.26±0.1 PC123 1.2 ±0.3 0.6 ±0.2 2.54 ±0.25 4.58 ±0.3 3.5 ±0.5 1.0 ±0.1 6.5±0.3 7.62 ±0.3 Epoxy resin 4.58 ±0.3 0.26 ±0.1 10.16 ±0.5 2.7MIN. Anode mark 2 3 0.5 ±0.1 Rank mark Factory identification mark Date code PC123 1.2 ±0.3 0.6 ±0.2 2.54 ±0.25 4.58 ±0.3 3.5 ±0.5 1.0 ±0.1 6.5±0.3 7.62 ±0.3 Epoxy resin 4.58 ±0.3 0.26 ±0.1 10.16 ±0.5 2.7MIN. Anode mark 2 3 0.5 ±0.1 Rank mark Factory identification mark Date code SHARP mark "S" VDE0884 Indenfication mark PC123 Series Product mass : approx. 0.18g

Sheet No.: D2-A02902EN (Unit : mm) 5. SMT Gullwing Lead-Form [ex. PC123P] 6. SMT Gullwing Lead-Form (VDE0884 option) [ex. PC123PY] 7. Wide SMT Gullwing Lead-Form [ex. PC123FP] 8. Wide SMT Gullwing Lead-Form (VDE0884 option) [ex. PC123ZY] 0.6±0.2 1.2±0.3 6.5±0.3 7.62±0.3 0.26±0.1 4.58±0.3 2.54±0.25 Epoxy resin 3.5±0.5 4.58±0.3 2.54±0.25 Anode mark Rank mark Factory identification mark Date code 1.0+0.4 −0 1.0+0.4 10.0+0 −0.5

2 PC123

0.35±0.25 0.6±0.2 1.2±0.3 6.5±0.3 7.62±0.3 0.26±0.1 4.58±0.3 2.54±0.25 Epoxy resin 3.5±0.5 4.58±0.3 2.54±0.25 Anode mark Rank mark Factory identification mark Date code 1.0+0.4 −0 1.0+0.4 10.0+0 −0.5 0.35±0.25 SHARP mark "S" VDE0884 Indenfication mark PC123 0.6±0.2 1.2±0.3 1.0±0.1 6.5±0.3 4.58±0.3 2.54±0.25 Anode mark Rank mark Factory identification mark Date code 7.62±0.3 12.0MAX 4.58±0.3 Epoxy resin 3.5±0.5 0.26±0.1 0.5±0.1 0.25±0.25 0.6±0.2 1.2±0.3 1.0±0.1 6.5±0.3 4.58±0.3 2.54±0.25 Anode mark Rank mark Factory identification mark Date code 7.62±0.3 12.0MAX 4.58±0.3 Epoxy resin 3.5±0.5 0.26±0.1 0.5±0.1 0.25±0.25 SHARP mark "S" VDE0884 Indenfication mark PC123 Series Product mass : approx. 0.18g

Date code (2 digit) Rank mark Refer to the Model Line-up table A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 Mark A B C D E F H J K L M N Mark P R S T U V W X A B C Mark O N D Month January February March April May June July August September October November December A.D 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012

  • ·· 2nd digit Month of production 1st digit Year of production Factory identification mark Factory identification Mark no mark Country of origin Japan Indonesia Philippines China * This factory making is for identification purpose only. Please contact the local SHARP sales representative to see the actual status of the production. repeats in a 20 year cycle Sheet No.: D2-A02902EN PC123 Series

Sheet No.: D2-A02902EN ■ Electro-optical Characteristics Parameter Conditions Forward voltage Reverse current Terminal capacitance Collector dark current Collector-emitter breakdown voltage Emitter-collector breakdown voltage Transfer charac- teristics Collector current Collector-emitter saturation voltage Isolation resistance Floating capacitance Cut-off frequency MIN. 2.5 5×10 TYP. 1.2 0.1 1×10 0.6 MAX. 1.4 250 100 0.2 1.0 Unit V µA pF nA V nA mA V Ω pF kHz µs µs Symbol V F IR Ct ICEO BVCEO BVECO IC VCE (sat) RISO fc tr tf Cf Response time Rise time Fall time Input Output IF=20mA VR=4V V=0, f=1kHz VCE=50V, IF=0 IC=0.1mA, IF=0 IE=10µA, IF=0 IF=5mA, VCE=5V IF=20mA, IC=1mA V=0, f=1MHz VCE=2V, IC=2mA, RL=100Ω VCE=5V, IC=2mA, RL=100Ω, −3dB DC500V, 40 to 60%RH (Ta=25˚C) ■ Absolute Maximum Ratings (Ta=25˚C) Parameter Symbol Unit Input Forward current mA *1 Peak forward current A Power dissipation mW Output Collector-emitter voltage V Emitter-collector voltage V Collector current mA Collector power dissipation mW Total power dissipation mW *2 Isolation voltage Operating temperature ˚C Storage temperature ˚C *3 Soldering temperature IF IFM P VCEO VECO IC PC Ptot Viso (rms) Topr Tstg Tsol ˚C *1 Pulse width≤100µs, Duty ratio : 0.001 *2 40 to 60%RH, AC for 1 minute, f = 60Hz *3 For 10s Rating Reverse voltage V VR 6 150 200 −30 to +100 −55 to +125 260 5.0 kV PC123 Series

Sheet No.: D2-A02902EN ■ Model Line-up Sleeve 100pcs/sleeve Taping 2 000pcs/reel Rank mark with or without A B No mark S IC [mA] (IF=5mA, VCE=5V, Ta=25˚C) 2.5 to 30.0 2.5 to 7.5 5.0 to 12.5 10.0 to 20.0 5.0 to 10.0 Lead Form Package VDE0884 Model No. Through-Hole PC123 PC123A PC123B PC123C PC123S PC123Y PC123Y1 PC123Y2 PC123Y5 PC123YS PC123F PC123F1 PC123F2 PC123F5 PC123FS PC123FY PC123FY1 PC123FY2 PC123FY5 PC123FY8 PC123P PC123P1 PC123P2 PC123P5 PC123PS PC123PY PC123PY1 PC123PY2 PC123PY5 PC123PY8 PC123FP PC123FP1 PC123FP2 PC123FP5 PC123FP8 PC123ZY PC123ZY1 PC123ZY2 PC123ZY5 PC123ZY8 Wide Through-Hole Wide SMT Gullwing − Approved − Approved − Approved − Approved SMT Gullwing Please contact a local SHARP sales representative to inquire about production status and Lead-Free options. PC123 Series

Sheet No.: D2-A02902EN Fig.6 Forward Current vs. Forward Voltage Duty ratio Pulse width≤100µs Ta=25˚C 100 200 500 210−3 10−252 1 0 −152 5 Peak forward current IFM (mA) 10 000 5 000 2 000 1 000 Fig.5 Peak Forward Current vs. Duty Ratio PC123 Series 50˚C 25˚C 0˚C 100 200 500 −25˚C Ta=75˚C Forward current IF (mA) Forward voltage VF (V) Forward current IF (mA) Ambient temperature Ta (˚C) −30 0 25 50 55 75 100 125 Fig.1 Forward Current vs. Ambient Temperature Diode power dissipation P (mW) Ambient temperature Ta (˚C) 100 −30 0 25 50 55 75 100 125 Fig.2 Diode Power Dissipation vs. Ambient Temperature Collector power dissipation PC (mW) Ambient temperature Ta (˚C) 250 200 150 100 −30 0 25 50 75 100 125 Fig.3 Collector Power Dissipation vs. Ambient Temperature Fig.4 Total Power Dissipation vs. Ambient Temperature Total Power dissipation Ptot (mW) Ambient temperature Ta (˚C) 250 200 150 100 −30 0 25 50 75 100 125

Sheet No.: D2-A02902EN Ambient temperature Ta (˚C) Collector dark current ICEO (A) −30 0 20 40 60 80 100 10−11 10−10 10−9 10−8 10−7 10−6 10−5 VCE=50V Fig.11 Collector Dark Current vs. Ambient Temperature Response time (µs) 0.01 0.1 1 10 100 0.1 100 VCE=2V IC=2mA Ta=25˚C tr tf td ts 1 000 Load resistance (kΩ) Fig.12 Response Time vs. Load Resistance 100 150 02 5 5 0 7 5 100 Relative current transfer ratio (%) −30 IF=5mA VCE=5V Ambient temperature Ta (˚C) Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature Ambient temperature Ta (˚C) Collector-emitter saturation voltage VCE (sat) (V) −30 0 20 4 06 08 0 1 0 0 0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 I F=20mA IC=1mA Fig.10 Collector - emitter Saturation Voltage vs. Ambient Temperature Forward current IF (mA) Current transfer ratio CTR (%) 0.1 1 10 100 100 150 200 250 300 V CE=5V Ta=25˚C Fig.7 Current Transfer Ratio vs. Forward Current Collector-emitter voltage VCE (V) 0123456789 1 0 T a=25˚C IF=30mA IF=20mA IF=10mA IF=5mA Collector current IC (mA) PC (MAX.) Fig.8 Collector Current vs. Collector-emitter Voltage PC123 Series

Sheet No.: D2-A02902EN Frequency (kHz) Voltage gain Av (dB) 0.1 10 100 −20 −15 −10 VCE=5V IC=2mA Ta=25˚C RL=10kΩ 1kΩ 100Ω 1 000 Fig.14 Frequency Response Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Forward current IF (mA) Collector-emitter saturation voltage VCE (sat) (V) 02468 1 0 1 2 14 16 18 20 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 T a=25˚C IC=0.5mA 1mA 3mA 7mA 5mA Fig.15 Collector-emitter Saturation Voltage vs. Forward Current VCC 90% 10% Output Input RLInput Output VCE RD tftr tstd Please refer to the conditions in Fig.12. Fig.13 Test Circuit for Response Time PC123 Series

Sheet No.: D2-A02902EN ■ Design Considerations While operating at IF<1.0mA, CTR variation may increase. Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED.

  • Degradation In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5years) into the design consideration.
  • Recommended Foot Print (reference) ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes. SMT Gullwing lead-form Wide SMT Gullwing lead-form 10.2 2.54 1.7 2.2 8.2 2.54 1.7 2.2 (Unit : mm)
  • Design guide ■ Design Considerations PC123 Series

Sheet No.: D2-A02902EN ■ Manufacturing Guidelines Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice.

  • Soldering Method Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400˚C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. 123 4 300 200 100 0 0 (˚C) Terminal : 260˚C peak ( package surface : 250˚C peak) Preheat 150 to 180˚C, 120s or less Reflow 220˚C or more, 60s or less (min) PC123 Series

Sheet No.: D2-A02902EN Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in ac- tual using conditions since some materials may erode the packaging resin.

  • Cleaning instructions This product shall not contain the following materials. And they are not used in the production process for this device. Regulation substances:CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
  • Presence of ODC PC123 Series

Sheet No.: D2-A02902EN ■ Package specification 12.0 6.7 5.8 10.8 15.0 6.35 5.9 10.8 520 520 PC123 Series

  • Sleeve package 1. Through-Hole Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions (Unit : mm) (Unit : mm) 2. Wide Through-Hole Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions

Sheet No.: D2-A02902EN

  • Tape and Reel package 1. SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F K E I D J GB H H A C MAX. Dimensions List (Unit : mm) A 16.0±0.3 B 7.5±0.1 C 1.75±0.1 D 8.0±0.1 E 2.0±0.1 H 10.4±0.1 I 0.4±0.05 J 4.2±0.1 K 5.1±0.1 F 4.0±0.1 G φ1.5+0.1 −0 a c e g f b d Dimensions List (Unit : mm) a 330 b 17.5±1.5 c 100±1.0 d 13±0.5 e 23±1.0 f 2.0±0.5 g 2.0±0.5 Pull-out direction [Packing : 2 000pcs/reel] Reel structure and Dimensions Direction of product insertion PC123 Series

Sheet No.: D2-A02902EN 2. Wide SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions Dimensions List A 24.0±0.3 B 11.5±0.1 C 1.75±0.1 D 8.0±0.1 E 2.0±0.1 H 12.4±0.1 I 0.4±0.05 J 4.1±0.1 K 5.1±0.1 F 4.0±0.1 G φ1.5+0.1 −0 (Unit : mm) JG IE CB A H H 5˚MAX. F D K a c e g f b d Dimensions List (Unit : mm) a 330 b 25.5±1.5 c 100±1.0 d 13±0.5 e 23±1.0 f 2.0±0.5 g 2.0±0.5 Pull-out direction [Packing : 2 000pcs/reel] Reel structure and Dimensions Direction of product insertion PC123 Series

  • The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems rela- ted to any intellectual property right of a third party re- sulting from the use of SHARP's devices.
  • Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the spec- ifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufac- turing locations are also subject to change without no- tice.
  • Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connec- tion with equipment that requires an extremely high lev- el of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba).
  • If the SHARP devices listed in this publication fall with- in the scope of strategic products described in the For- eign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP de- vices.
  • This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be repro- duced or transmitted in any form or by any means, elec- tronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party.
  • Contact and consult with a SHARP representative if there are any questions about the contents of this pub- lication. Sheet No.: D2-A02902EN ■ Important Notices PC123 Series