PA985C6R

PA985C6R FUJI | Alldatasheet

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Device Name ɿ Type Name ɿ Spec. No. ɿ D A T E APPROVEDN A M E DRAWN CHECKED DWG.NO. H04-004-07b MS5D3310 1/12 Fuji Electric Device Technology Co.,Ltd. CHECKED This material and the information herein is the property of Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fu ji Electric Device Technolo gy Co.,Ltd. 0DU‘ 0DU‘ 0DU‘ S I L I C O N D I O D E PA985C6R MS5D3310

DWG.NO. H04-004-06b Revised Records DWG.NO. MS5D3310 2/12 Fuji Electric Device Technology Co.,Ltd. This material and the information herein is the property of Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fu ji Electric Device Technolo gy Co.,Ltd. Date Classi- fication Ind. Content Applied date Drawn Checked Approved 0DU &OBDUNFOU ʕ ʕʕʕʕʕʕ *TTVFE EBUF

DWG.NO. DWG.NO. MS5D3310 3/12 H04-004-03a Fuji Electric Device Technology Co.,Ltd. This material and the information herein is the property of Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fu ji Electric Device Technolo gy Co.,Ltd. 1. SCOPE This specification provides the ratings and the test requirement for FUJI SILICON DIODE PA985C6R 2. OUT VIEW, MOLDING RESIN, CHARACTERISTICS Ordering code Package type Out view Molding resin Characteristics PA985C6R TO-3P Page 9/12 UL:V-0 Page 10/12ʙ12/12 Bar code label is EIAJ C-3 specification. Indispensable description items are shown as below. (1) Type name (2) Production code (3) Quantity (4) Lot ᶺ(Date code) (5) Company code 3.RATINGS 3.1 MAXIMUM RATINGS (at Ta=25ˆ unless otherwise specified.) Item Symbol Conditions Ratings Units Repetitive peak reverse voltage V RRM 600 V Average output current Io 50Hz Square wave duty =1/2 Tc = 73ˆ 20 * A Non-repetitive forward surge current** I FSM Sine wave, 10ms 1shot 50 A Operating junction temperature Tj 150 ˆ Storage temperature Tstg -40 ʙʴ150 ˆ * Out put current of center tap full wave connection. Rating per element 3.2 ELECTRICAL CHARACTERISTICS ( a t T a = 2 5ˆ unless otherwise specified.) Item Symbol Conditions Maximum Units Forward voltage* V F I F = 10 A 3.0 V Reverse current* I R V R = VRRM 3 0 ЖA Reverse recovery time trr I F=0.1A,IR=0.2A,Irec=0.05A 0.028 Жs Thermal resistance Rth(j-c) Junction to case 1.5 ˆ/W *Rating per element

3.3 MECHANICAL CHARACTERISTICS

Mounting torque Recommended torque 0.4 ʙ0.6 N ɾm Approximate mass 5.5 g

DWG.NO. DWG.NO. MS5D3310 4/12 H04-004-03a Fuji Electric Device Technology Co.,Ltd. This material and the information herein is the property of Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fu ji Electric Device Technolo gy Co.,Ltd. 4.TEST AND INSPECTION

4.1 STANDARD TEST CONDITION

Standard test condition is Ta=25ˆɺ65%R.H. If judgment is no doubt, the test condition is possible to test in normal condition Ta=5ʙ35ˆɺ48ʙ85%R.H.

4.2 STRUCTURE INSPECTION

It inspect with eye and measure, Item 2 shall be satisfied.

4.3 FORWARD AND REVERSE CHARACTERISTICS

It inspect on the standard condition, Item 3.2 shall be satisfied.

4.4 TEST

No. Test items Testing methods and conditions Reference standard EIAJ ED4701 Sampling number Acceptance number Terminal strength (Tensile) Pull force : 25N Force maintaining duration :10±1s EIAJ ED4701/401 method 1 Terminal strength (Bending) Load force : 10N Number of times : 2times(90deg./time) EIAJ ED4701/401 method 3

3 Mounting

strength Screwing torque value:(M3) : 50±10Nɾcm EIAJ ED4701/402 method 2

4 Vibration

Frequency : 100Hz to 2kHz Acceleration : 100m/s2 Sweeping time : 4min./1 cycle 4times for each X, Y&Z directions. EIAJ ED4701/403 test code D

5 Shock

Peak amplitude : 15km/s2 Duration time : 0.5ms 3times for each X, Y&Z directions. EIAJ ED4701/404 test code D Solder ability 1 Solder : Sn-37Pb Solder temp. : 235ʶ5ˆ Immersion time : 5ʶ0.5s Apply to flux EIAJ ED4701/303 test code A Solder ability 2 Solder : Sn-3Ag-0.5Cu Solder temp. : 245ʶ5ˆ Immersion time : 5ʶ0.5s Apply to flux ʵ 5 Mechanical test

7 Resistance to

Solder temp. : 260±5°C Immersion time : 10±1s Number of times : 1time EIAJ ED4701/302 test code A (0 : 1)

DWG.NO. DWG.NO. MS5D3310 5/12 H04-004-03a Fuji Electric Device Technology Co.,Ltd. This material and the information herein is the property of Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fu ji Electric Device Technolo gy Co.,Ltd. Test No. Test items Testing methods and conditions Reference standard EIAJ ED4701 Sampling number Acceptance number 1 High temp. Storage Temperature :̩stg max Test duration : 1000h EIAJ ED4701/201 22 2 Low temp. Storage Temperature :̩stg min Test duration : 1000h EIAJ ED4701/202 22 Temperature humidity storage Temperature : 85±2°C Relative humidity : 85±5% Test duration : 1000h EIAJ ED4701/103 test code C Temperature humidity bias Temperature : 85±2°C Relative humidity : 85±5% Bias voltage : VRRM× 0.8 Test duration : 1000h EIAJ ED4701/103 test code C Unsaturated pressurized vapor Temperature : 130±2°C Relative humidity : 85±5% Vapor pressure : 230kPa Test duration : 48h EIAJ ED4701/103 test code F

6 Temperature

High temp. side : Tstg max Room temp. : 5ʙ35ˆ Low temp. side : Tstg min Duration time : HT 30min,RT 5min LT 30min Number of cycles : 100 cycles EIAJ ED4701/105 22

7 Thermal

Fluid : pure water(running water) High temp. side : 100+0/-5°C Low temp. side : 0+5/-0°C Duration time : HT 5min,LT 5min Number of cycles : 100 cycles EIAJ ED4701/307 test code A Steady state operating life Ta=25±5°C Rated load Test duration : 1000h ʵ 22 Intermittent operating life Tj=Tjmax ʙ50ˆ 3min ON, 3min OFF Test duration : 10000cycles EIAJ ED4701/106 22 Endurance test High temp. Reverse bias Temperature : Ta=100 °C Bias voltage : VR=VRRM duty=1/2 Test duration : 1000h EIAJ ED4701/101 22 (0 : 1) IR ʽUSL x 5 USL : Upper specification limit Failure criteria VFʽUSL x 1.1

DWG.NO. DWG.NO. MS5D3310 6/12 H04-004-03a Fuji Electric Device Technology Co.,Ltd. This material and the information herein is the property of Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fu ji Electric Device Technolo gy Co.,Ltd. 5.CAUTIONS ɾAlthough Fuji Electric is continually improving pr oduct quality and reliability, a small percentage of semiconductor products may become faulty. When using Fuji Electric semiconductor products in your equipment, you are requested to take adequate safe ty measures to prevent the equipment from causing physical injury, fire, or other problem in ca se any of the products fail. It is recommended to make your design fail-safe, flame retardant, and free of malfunction. ɾThe products described in this specification ar e intended for use in the following electronic and electrical equipment which has normal reliability requirements. ɾComputers ɾOA equipment ɾCommunications equipment (Terminal devices) ɾMeasurement equipment ɾM a c h i n e t o o l s ɾAV equipment ɾElectrical home appliances ɾPersonal equipment ɾIndustrial robots etc. ɾThe products described in this specification are not designed or manufactured to be used in equipment or systems used under life-threatening situations. If you are considering using these products in the equipment listed below, first check the system cons truction and required reliability, and take adequate safety measures such as a backup system to prevent the equipment from malfunctioning. ɾTransportation equipment (automobiles, trains, ships, etc.) ɾBackbone network equipment ɾTraffic-signal control equipment ɾGas alarms, leakage gas auto breakers ɾSubmarine repeater equipment ɾBurglar alarms, fire alarms, emergency equipment ɾMedical equipment ɾNuclear control equipment etc. ɾDo not use the products in this sp ecification for equipment requiring strict reliability such as (but not limited to): ɾA e r o s p a c e e q u i p m e n t ɾAeronautical equipment 6.WARNINGS ɾThe Diodes should be used in products within their absolute maximum rating (voltage, current, temperature, etc. ). The diodes may be destroyed if used beyond the rating. ɾThe equipment containing Diodes should have adequat e fuses or circuit breakers to prevent the equipment from causing secondary destruction (ex. fire, explosion etc…). ɾUse the Diodes within their reliability and lifetime under certain environments or conditions. The Diodes may fail before the target lifetime of your products if used under certain reliability conditions. ɾYou must design the Diodes to be operated within the specified maximum ratings (voltage, current, temperature, etc. ) to prevent possible failure or destruction of devices. ɾConsider the possible temperature rise not only for the junction and case, but also for the outer leads. ɾDo not directly touch the leads or package of the Diodes while power is supplied or during operation, to avoid electric shock and burns. ɾThe Diodes are made of incombustible material. Howe ver, if a Diode fails, it may emit smoke of flame. Also, operating the Diodes near any flammable place or material may cause the Diodes to emit smoke or flame in case the Diodes become even hotter during operation. Design the arrangement to prevent the spread of fire. ɾThe Diodes should not used in an environment in the presence of acid, organic matter, or corrosive gas. (hydrogen sulfide, sulfurous acid gas.) ɾThe Diodes should not used in an irradiated field since they are not radiation proof.

DWG.NO. DWG.NO. MS5D3310 7/12 H04-004-03a Fuji Electric Device Technology Co.,Ltd. This material and the information herein is the property of Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fu ji Electric Device Technolo gy Co.,Ltd. INSTALLATION ɾSoldering involves temperatures which exceed the device storage temperature rating. To avoid device damage and to ensure reliability, observe the following guidelines from the quality assurance standard. Table 1: Solder temperature and duration Method Solder temperature Duration Flow 260 ʶ5ˆ 10 ʶ1sec Soldering iron 350 ʶ10ˆ 3.5 ʶ0.5sec ɾThe immersion depth of the lead should basical ly be up to the lead stopper and the distance should be a maximum of 1.5mm from the device. ɾWhen flow-soldering, be careful to avoid immersing the package in the solder bath. ɾRefer to the following torque reference When mounting the device on a heat sink. Excess torque applied to the mounting screw causes damage to the device and weak torque will increase the thermal resistance, both of which conditions may destroy the device. Table 2:Recommended tightening torque Package style Screw Recommended tightening torque TO-3P M3 0.4 ʙ0.6Nɾm ɾThe heat sink should hav e a flatness within ʶ30Жm and roughness within 10 Жm. Also, keep the tightening torque within the limits of this specification. ɾImproper handling may cause isolation breakdown leading to a critical accident. ɾWe recommend the use of thermal compound to optim ize the efficiency of heat radiation. It is important to evenly apply the compound and to eliminate any air voids. STORAGE ɾThe Diodes must be stored at a standard temperature of 5 to 35 ˆ and relative humidity of 45 to 75%.If the storage area is very dry, a humid ifier may be required. In such a case, use only deionized water or boiled water, since the chlorine in tap water may corrode the leads. ɾThe Diodes should not be subjecte d to rapid changes in temper ature to avoid condensation on the surface of the Diodes . Therefore, store the Diodes in a place where the temperature is steady. ɾThe Diodes should not be stored on top of each other, since this may cause excessive external force on the case. ɾThe Diodes should not be stored with the lead terminals remaining unprocessed. Rust may cause presoldered connections to go fail during later processing. ɾThe Diodes should be stored in antistatic containers or shipping bags.

DWG.NO. DWG.NO. MS5D3310 8/12 H04-004-03a Fuji Electric Device Technology Co.,Ltd. This material and the information herein is the property of Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fu ji Electric Device Technolo gy Co.,Ltd. 7.APPENDIX ɾThis products does not contain PBBs (Polyb rominated Biphenyl) or PBDEs (Polybrominated Diphenyl Ether ) , substances. ɾThis products does not contain Class-I ODS and Cla ss-II ODS substances set force by ‘Clean Air Act of US’ law. ɾIf you have any questions about any part of this specification, please contact Fuji Electric Device Technology or its sales agent before using the product ɾNeither Fuji nor its agents shall be held liable for any injury caused by usin g the products not in accordance with the instructions. ɾThis specification does not confer any industrial property rights or other rights, nor constitute a license for such rights.

DWG.NO. DWG.NO. MS5D3310 9/12 H04-004-03a Fuji Electric Device Technology Co.,Ltd. This material and the information herein is the property of Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fu ji Electric Device Technolo gy Co.,Ltd. 5:1&ɿ1"$3 1"$3 1"$3 Sn-Cu dipping (Pbʻ1000ppm)

DWG.NO. DWG.NO. MS5D3310 10/12 H04-004-03a Fuji Electric Device Technology Co.,Ltd. This material and the information herein is the property of Fuji Electric Device Technology Co.,Ltd. They shall be neither reproduced, copied,lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fu ji Electric Device Technolo gy Co.,Ltd. 02468 1 0 Square wave λ=180° Sine wave λ=180° Square wave λ=120° Per 1element Square wave λ=60° Forward Power Dissipation (max.) 8''PSXBSE1PXFS%JTTJQBUJPO 8 IF(AV) Average Forward Current (A) 0 100 200 300 400 500 600 700 0.000 0.005 0.010 0.015 0.020 0.025 0.030 0.035 Reverse Power Dissipation (max.) α=180° DC PR Reverse Power Dissipation (W) VR Reverse Voltage (V) Е 360˃ Ћ 360˃ VR 0.1 Tj=100°C Tj=25°C Tj=125°C Tj=150°C Forward Characteristic (typ.) IF Forward Current (A) VF Forward Voltage (V) Reverse Characteristic (typ.) Tj=25°C Tj=100°C Tj=125°C Tj=150°C IR Reverse Current (µA) VR Reverse Voltage (V)

DWG.NO. DWG.NO. MS5D3310 11/12 H04-004-03a Fuji Electric Device Technology Co.,Ltd. This material and the information herein is the property of Fuji Electric Device Technology Co.,Ltd. They s hall be neither reproduced, copied,lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fu ji Electric Device Technolo gy Co.,Ltd. 0 2 4 6 8 1 01 21 41 61 82 02 22 42 62 8 100 110 120 130 140 150 160 Square wave λ=60° Square wave λ=120° λ:Conduction angle of forward current for each rectifier element IF(AV):Forward current of center-tap full wave connection Square wave λ=180° Sine wave λ=180° DC Current Derating (IF(AV)-Tc) (max.) Tc Case Temperature (°C) IF(AV) Average Forward Current (A) 1 10 100 1000 100 1000 Junction Capacitance Characteristic (typ.) Cj Junction Capacitance (pF) VR Reverse Voltage (V) 11 0 1 0 0 100 1000 Surge Capability (max.) IFSM Peak Half - Wave Current (A) Number of Cycles at 50Hz

DWG.NO. DWG.NO. MS5D3310 12/12 H04-004-03a Fuji Electric Device Technology Co.,Ltd. This material and the information herein is the property of Fuji Electric Device Technology Co.,Ltd. They sha ll be neither reproduced, copied,lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fu ji Electric Device Technolo gy Co.,Ltd. 3UIKDˆ8 Transient Thermal Impedance (max.) Transient Thermal Impedance (°C/W) t Time (sec)