MTP7405S6 CYSTEKEC | Alldatasheet

Document overview

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  • PDF pages: 9

Technical content

Features

  • Low on-resistance
  • High speed switching
  • Low-voltage drive(-2.5V)
  • Pb-free lead plating and halogen-free package Equivalent Circuit Outline

Ordering Information

(Pb-free lead plating and halogen-free package) 3000 pcs / Tape & Reel SOT-363 MTP7405S6 G : Gate S : Source D : Drain Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T1 : 3000 pcs / tape & reel, 7” reel Product rank, zero for no rank products Product name

CYStech Electronics Corp. Spec. No. : C041S6 Issued Date : 2017.04.24 Revised Date : Page No. : 2/ 9 MTP7405S6 CYStek Product Specification Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Limits Unit Drain-Source V oltage VDS -30 Gate-Source V oltage VGS ±12 V Continuous Drain Current @ TA=25°C, VGS=-10V (Note 3) -1.4 Continuous Drain Current @ TA=70°C, VGS=-10V (Note 3) ID -1.1 Pulsed Drain Current (Notes 1, 2) IDM -10 A TA=25℃ 350 Maximum Power Dissipation (Note 3) TA=70℃ PD 220 mW Operating Junction and Storage Temperature Tj, Tstg -55~+150 °C Note : 1. Pulse width limited by maximum junction temperature. 2. Pulse width≤ 300μs, duty cycle≤2%. 3.Surface mounted on 1 in² copper pad of FR-4 board, t ≤5s. Thermal Performance Parameter Symbol Limit Unit Thermal Resistance, Junction-to-Case Rth,jc 320 Thermal Resistance, Junction-to-Ambient(PCB mounted) (Note) Rth,ja 357 °C/W Note : Surface mounted on 1 in² copper pad of FR-4 board, t≤10s. Electrical Characteristics (Tj=25°C, unless otherwise noted) Symbol Min. Typ. Max. Unit Test Conditions Static BVDSS -30 - - VGS=0V , ID=-250μA VGS(th) -0.5 - -1.2 V VDS=VGS, ID=-250μA IGSS - - ±100 nA VGS=±12V , VDS=0V - - 1 VDS=30V , VGS=0V IDSS - - 5 μA VDS=30V , VGS=0V @Tj=55°C - 90 115 VGS=-10V , ID=-1.4A - 130 160 VGS=-10V , ID=-1.4A @ Tj=125°C - 103 140 VGS=-4.5V , ID=-1.2A *RDS(ON) - 132 190 mΩ VGS=-2.5V , ID=-1A *GFS - 3.7 - S VDS=-5V , ID=-1A Dynamic Ciss - 480 624 Coss - 63 - Crss - 33 - pF VDS=-15V , VGS=0V , f=1MHz

CYStech Electronics Corp. Spec. No. : C041S6 Issued Date : 2017.04.24 Revised Date : Page No. : 3/ 9 MTP7405S6 CYStek Product Specification td(ON) - 4.4 - tr - 17.4 - td(OFF) - 42.6 - tf - 7 - ns VDS=-15V , ID=-1.4A, VGS=-10V , RG=3Ω Qg (VGS=-4.5V) 2.2 2.9 Qgs - 1.3 - Qgd - 0.7 - nC VDS=-15V , ID=-1.4A, VGS=-10V Source-Drain Diode *VSD - -0.83 -1 V VGS=0V , IS=-1A *trr - 7 9.1 ns *Qrr - 2.9 - nC IF=-1A, dIF/dt=100A/μs *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% Recommended Soldering Footprint

CYStech Electronics Corp. Spec. No. : C041S6 Issued Date : 2017.04.24 Revised Date : Page No. : 4/ 9 MTP7405S6 CYStek Product Specification Typical Characteristics Typical Output Characteristics 012345 -VDS, Drain-Source Voltage(V) -ID, Drain Current (A) 10V,9V,8V,7V,6V,5V,4V,3V,2.5V -VGS=2V Brekdown Voltage vs Ambient Temperature 0.4 0.6 0.8 1.2 1.4 1.6 -75 -50 -25 0 25 50 75 100 125 150 175 Tj, Junction Temperature(°C) -BVDSS, Normalized Drain-Source Breakdown Voltage ID=-250μA, VGS=0V Static Drain-Source On-State resistance vs Drain Current 100 1000 0.01 0.1 1 10 -ID, Drain Current(A) RDS(on), Static Drain-Source On-State Resistance(mΩ) VGS=-2.5V VGS=-4.5V VGS=-10V Reverse Drain Current vs Source-Drain Voltage 0.2 0.4 0.6 0.8 1.2 02468 1 -IDR, Reverse Drain Current (A) -VSD, Source-Drain Voltage(V) Tj=25°C Tj=150°C VGS=0V Static Drain-Source On-State Resistance vs Gate-Source Voltage 100 150 200 250 300 02468 1 0 Drain-Source On-State Resistance vs Junction Tempearture 0.4 0.6 0.8 1.2 1.4 1.6 1.8 -75 -50 -25 0 25 50 75 100 125 150 175 Tj, Junction Temperature(°C) RDS(ON), Normalized Static Drain- Source On-State Resistance -VGS, Gate-Source Voltage(V) RDS(ON), Static Drain-Source On- State Resistance(mΩ) ID=-1.4A VGS=-10V, ID=-1.4A RDS( ON)@Tj=25°C : 90mΩ

CYStech Electronics Corp. Spec. No. : C041S6 Issued Date : 2017.04.24 Revised Date : Page No. : 5/ 9 MTP7405S6 CYStek Product Specification Typical Characteristics(Cont.) Capacitance vs Drain-to-Source Voltage 100 1000 0 5 10 15 20 25 30 -VDS, Drain-Source Voltage(V) Capacitance---(pF) Coss Ciss Crss Threshold Voltage vs Junction Tempearture 0.4 0.6 0.8 1.2 1.4 -75 -50 -25 0 25 50 75 100 125 150 175 Tj, Junction Temperature(°C) -VGS(th),Normalized Threshold VoltageID=-250μA ID=-1mA Forward Transfer Admittance vs Drain Current 0.01 0.1 0.001 0.01 0.1 1 10 -ID, Drain Current(A) GFS, Forward Transfer Admittance-(S) VDS=-10V Pulsed Ta=25°C Gate Charge Characteristics 0123456789 1 0 1 1 1 2 Qg, Total Gate Charge(nC) -VGS, Gate-Source Voltage(V) VDS=-15V ID=-1.4A Maximum Safe Operating Area 0.001 0.01 0.1 100 0.01 0.1 1 10 100 -VDS, Drain-Source Voltage(V) -ID, Drain Current (A) DC 10ms 100ms 1ms 100μs RDS( ON) Limited TA=25°C, Tj=150°C, VGS=-10V, RθJA=357°C/W Single Pulse Maximum Drain Current vs JunctionTemperature 0.2 0.4 0.6 0.8 1.2 1.4 1.6 1.8 25 50 75 100 125 150 175 Tj, Junction Temperature(°C) -ID, Maximum Drain Current(A)TA=25°C, VGS=-10V, RθJA=357°C/W

CYStech Electronics Corp. Spec. No. : C041S6 Issued Date : 2017.04.24 Revised Date : Page No. : 6/ 9 MTP7405S6 CYStek Product Specification Typical Characteristics(Cont.) Typical Transfer Characteristics 012345 VGS, Gate-Source Voltage(V) ID, Drain Current(A) VDS=5V Single Pulse Power Rating, Junction to Ambient 0.001 0.01 0.1 1 10 100 Pulse Width(s) Power (W) TJ(MAX)=150°C TA=25°C RθJA=357°C/W Transient Thermal Response Curves 0.001 0.01 0.1 0.0001 0.001 0.01 0.1 1 10 100 1000 t1, Square Wave Pulse Duration(s) r(t), Normalized Transient Thermal Resistance Single Pulse 0.01 0.02 0.05 0.1 0.2 D=0.5 1.RθJA(t)=r(t)*RθJA 2.Duty Factor, D=t1/t2 3.TJM-TA=PDM*RθJA(t) 4.RθJA=357°C/W

CYStech Electronics Corp. Spec. No. : C041S6 Issued Date : 2017.04.24 Revised Date : Page No. : 7/ 9 MTP7405S6 CYStek Product Specification Reel Dimension Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C041S6 Issued Date : 2017.04.24 Revised Date : Page No. : 8/ 9 MTP7405S6 CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note :1. All temperatures refer to topside of the package, measured on the package body surface. 2.For devices mounted on FR-4 PCB of 1.6mm or equivalent grade PCB. If other grade PCB is used, care should be taken to match the coefficients of thermal expansion between components and PCB. If they are not matched well, the solder joints may crack or the bodies of the parts may crack or shatter as the assembly cools.

CYStech Electronics Corp. Spec. No. : C041S6 Issued Date : 2017.04.24 Revised Date : Page No. : 9/ 9 MTP7405S6 CYStek Product Specification SOT-363 Dimension Marking: D 2.000 2.200 0.079 0.087 θ 0° 8° 0° 8° E 1.150 1.350 0.045 0.053 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material :

  • Lead : Pure tin plated.
  • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Style: Pin 1. Drain (D) Pin 2. Drain (D) Pin 3. Gate (G) Pin 4. Source (S) Pin 5. Drain (D) 6-Lead SOT-363 Plastic Surface Mounted Package CYStek Package Code: S6 7405 XX Date Code Pin 6. Drain (D)